JPS6330130Y2 - - Google Patents
Info
- Publication number
- JPS6330130Y2 JPS6330130Y2 JP1979139898U JP13989879U JPS6330130Y2 JP S6330130 Y2 JPS6330130 Y2 JP S6330130Y2 JP 1979139898 U JP1979139898 U JP 1979139898U JP 13989879 U JP13989879 U JP 13989879U JP S6330130 Y2 JPS6330130 Y2 JP S6330130Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- lead wire
- conductor part
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【考案の詳細な説明】
本考案は印刷配線基板におけるリード線接続構
造に関する。[Detailed Description of the Invention] The present invention relates to a lead wire connection structure in a printed wiring board.
従来の印刷配線基板におけるリード線接続構造
は、第１図に示すように、印刷配線基板１の銅箔
部２に端子３と取付け、この端子３にリード線４
の導体部４ａを巻付けて（ワイヤラツピングし
て）接続した構造を有するが、この構造は、リー
ド線４に加わる外力により、導体部４ａの根本部
分が緩んで、銅箔部２に近接して形成された他の
銅箔部６に接触して、電気的に短絡することがし
ばしばあつた。 As shown in FIG. 1, the conventional lead wire connection structure for a printed wiring board is that a terminal 3 is attached to a copper foil portion 2 of a printed wiring board 1, and a lead wire 4 is connected to this terminal 3.
This structure has a structure in which the conductor part 4a is connected by winding (wire wrapping), but in this structure, the root part of the conductor part 4a loosens due to external force applied to the lead wire 4, and the conductor part 4a becomes close to the copper foil part 2. This often resulted in electrical short circuits due to contact with other copper foil portions 6 formed in the same manner.
本考案はこのような従来欠点を改良したもの
で、第２図の一実施例について説明すると、銅箔
部２に取付けた端子３に銅箔部２の外径より大き
な外径を有する絶縁体５例えば円形の絶縁ワツシ
ヤを挿嵌し、この絶縁ワツシヤ５を貫通して突出
した端子３にリード線４の導体部４ａを巻付けて
接続した構造である。 The present invention is an improvement over such conventional drawbacks, and to explain one embodiment of FIG. For example, a circular insulating washer 5 is inserted into the terminal 3, and the conductor portion 4a of the lead wire 4 is wound around the terminal 3 which protrudes through the insulating washer 5 for connection.
図中、１は印刷配線基板、６は他の銅箔部であ
る。 In the figure, 1 is a printed wiring board, and 6 is another copper foil part.
また、絶縁ワツシヤ５の大きさは、リード線４
の緩み度合や銅箔２，６間の近接度合に応じて適
当に定められ、例えば図示のように近接した他の
銅箔部６の一部を覆う大きさに定められる。 Also, the size of the insulating washer 5 is the same as the size of the lead wire 4.
It is determined appropriately depending on the degree of looseness of the copper foils 2 and 6 and the degree of proximity between the copper foils 2 and 6, and is determined to have a size that covers a part of another adjacent copper foil section 6 as shown in the figure, for example.
このような構造は、銅箔部２とリード線４の導
体部４ａとの間が絶縁体５によつて絶縁されてい
るので、リード線４の導体部４ａが緩んでも、こ
の導体部４ａと他の銅箔部６が接触して、電気的
に短絡することはなく、また、構造的にも著しく
単純であり安価である。 In such a structure, since the copper foil part 2 and the conductor part 4a of the lead wire 4 are insulated by the insulator 5, even if the conductor part 4a of the lead wire 4 becomes loose, this conductor part 4a and There is no possibility of electrical short circuit due to contact with other copper foil parts 6, and the structure is extremely simple and inexpensive.
第３図は他の実施例を示すもので、印刷配線基
板１の銅箔部２の表面に絶縁スペーサ７を介して
銅板８を配置した構造において、この銅板８とリ
ード線４の導体部４ａとの間に絶縁ワツシヤ５を
介在せしめた構造である。このような構造によれ
ば、リード線４の導体部４ａが緩み、また、巻付
けた導体部４ａがズレて銅板８方向に移動して
も、絶縁ワツシヤ５によつて銅板８と導体部４ａ
との絶縁状態が保持される。従つて、従来のよう
に銅板８と導体部４ａの間隔を一定に保つた状態
で、導体部４ａを半田付け、固定する必要がな
く、リード線４の接続作業が簡略である。 FIG. 3 shows another embodiment, in which a copper plate 8 is arranged on the surface of the copper foil part 2 of the printed wiring board 1 with an insulating spacer 7 in between, and the copper plate 8 and the conductor part 4a of the lead wire 4 This structure has an insulating washer 5 interposed between the two. According to such a structure, even if the conductor part 4a of the lead wire 4 becomes loose or the wound conductor part 4a shifts and moves in the direction of the copper plate 8, the insulating washer 5 will keep the copper plate 8 and the conductor part 4a
The insulation state is maintained. Therefore, it is not necessary to solder and fix the conductor part 4a while keeping the distance between the copper plate 8 and the conductor part 4a constant as in the conventional case, and the work of connecting the lead wire 4 is simplified.
以上のように、本考案は印刷配線基板１の銅箔
部２と端子３に巻付けたリード線４の導体部４ａ
との間に絶縁体５を介在せしめたので、リード線
４の導体部４ａと他回路（他の銅箔６、銅板８）
との絶縁が完全なものとなり、また、構造も単純
で安価である利点を有する。 As described above, the present invention provides the copper foil portion 2 of the printed wiring board 1 and the conductor portion 4a of the lead wire 4 wound around the terminal 3.
Since the insulator 5 is interposed between the conductor part 4a of the lead wire 4 and other circuits (other copper foil 6, copper plate 8)
It has the advantage of complete insulation from the other materials, and that the structure is simple and inexpensive.
第１図は従来のリード線接続構造を示す図、第
２図は本考案のリード線接続構造を示す図、第３
図は同、他の実施例を示す図である。
１は印刷配線基板、２は銅箔部、３は端子、４
はリード線、４ａは導体部、５は絶縁体である。
Figure 1 is a diagram showing a conventional lead wire connection structure, Figure 2 is a diagram showing a lead wire connection structure of the present invention, and Figure 3 is a diagram showing a lead wire connection structure of the present invention.
The figure is a diagram showing another embodiment of the same. 1 is a printed wiring board, 2 is a copper foil part, 3 is a terminal, 4
4 is a lead wire, 4a is a conductor, and 5 is an insulator.
Claims (1)
箔部２に近接して他の銅箔部６を形成し、上記銅
箔部２に端子３を取り付け、当該端子３にリード
線４の導体部４ａを巻き付けて接続した構造にお
いて、上記銅箔部２とリード線４の導体部４ａと
の間に、上記銅箔部２より大きな外径を有し、か
つ、上記他の銅箔部６の上記銅箔部２に近接する
部分を覆う大きさを有する平板状絶縁体５を介在
せしめてなることを特徴とする印刷配線基板にお
けるリード線接続構造。 A copper foil section 2 and another copper foil section 6 are formed in proximity to the copper foil section 2 on the surface of the printed wiring board 1, a terminal 3 is attached to the copper foil section 2, and a lead wire 4 is attached to the terminal 3. In the structure in which the conductor part 4a is wound and connected, there is a wire between the copper foil part 2 and the conductor part 4a of the lead wire 4, which has a larger outer diameter than the copper foil part 2 and which has the other copper foil part. 6. A lead wire connection structure for a printed wiring board, characterized in that a flat insulator 5 having a size to cover a portion close to the copper foil portion 2 of No. 6 is interposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979139898U JPS6330130Y2 (en) | 1979-10-09 | 1979-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979139898U JPS6330130Y2 (en) | 1979-10-09 | 1979-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5657476U JPS5657476U (en) | 1981-05-18 |
| JPS6330130Y2 true JPS6330130Y2 (en) | 1988-08-12 |
Family
ID=29371248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979139898U Expired JPS6330130Y2 (en) | 1979-10-09 | 1979-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6330130Y2 (en) |
-
1979
- 1979-10-09 JP JP1979139898U patent/JPS6330130Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5657476U (en) | 1981-05-18 |
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