JPS63295217A - Manufacturing method of laminates - Google Patents
Manufacturing method of laminatesInfo
- Publication number
- JPS63295217A JPS63295217A JP62130736A JP13073687A JPS63295217A JP S63295217 A JPS63295217 A JP S63295217A JP 62130736 A JP62130736 A JP 62130736A JP 13073687 A JP13073687 A JP 13073687A JP S63295217 A JPS63295217 A JP S63295217A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- pressure
- copper
- prepreg
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000465 moulding Methods 0.000 claims abstract description 62
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000000155 melt Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 10
- 239000004744 fabric Substances 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 7
- 239000011888 foil Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000011229 interlayer Substances 0.000 abstract description 3
- 230000003028 elevating effect Effects 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 235000013405 beer Nutrition 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000269821 Scombridae Species 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 235000020640 mackerel Nutrition 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は積層板の製造法に関し、殊にプレス成形の圧力
制御に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a laminate, and in particular to pressure control in press forming.
従来の技術
電子、電気機器等民生用、産業用に使用されているエポ
キシ樹脂積層板は１通常、布、紙、不織布などの基材に
、エポキシ樹脂フェスを含浸させ乾燥せしめることによ
り得られるプリプレグを１枚若しくは複数枚重ね合わせ
た積層構成体、または該積層構成体に銅箔などの金属箔
を重ね合わせ、鏡面板に挾み込み、８１層板成形用多段
ホットプレスで、所定の加熱加圧条件下で、１回に多数
枚の積層板を製造する方法か従来より実施されている。Conventional technology Epoxy resin laminates used in consumer and industrial applications such as electronics and electrical equipment are usually prepregs obtained by impregnating a base material such as cloth, paper, or nonwoven fabric with an epoxy resin face and drying it. A laminated structure made by laminating one or more layers of Conventionally, a method of manufacturing a large number of laminates at one time under pressure conditions has been practiced.
ここで、前記の加熱。Here, the heating mentioned above.
加圧を行うプレス成形工程に於いて、従来からの方法、
すなわち、大気圧下（７６０ｓ＋ＨＳ’″′Ｆ）で成形
する方法（以下、常圧成形と記す）と真空或は、減圧下
で成形する方法（以下、減圧成形と記す）が知られてい
る。In the press molding process that applies pressure, conventional methods,
That is, a method of molding under atmospheric pressure (760s+HS''''F) (hereinafter referred to as normal pressure molding) and a method of molding under vacuum or reduced pressure (hereinafter referred to as reduced pressure molding) are known.
発明か解決しようとする問題点
前記従来方法の減圧成形は、積層構成体を加熱加圧する
プレス成形を真空或は減圧下で行う亀
ため、積層構成体が有しているガス、空隙に起因する積
層板の気泡、ボイド及び積層板周辺に生じるガス曇り等
の不良現象が低減、或は解消されることにより、成形圧
力は、常圧成形の成形圧力以下の一定圧力で１例えば、
単位圧５〜１５ｋ）７ｃｍという非常に低い成形圧力で
成形が行なわれていた。Problems to be Solved by the Invention In the conventional method of vacuum molding, the laminated structure is heated and pressurized to perform press forming in a vacuum or under reduced pressure. By reducing or eliminating defective phenomena such as bubbles, voids, and gas clouding that occur around the laminate, the molding pressure can be reduced to 1 at a constant pressure lower than the molding pressure of normal pressure molding.
Molding was carried out at a very low molding pressure of 5 to 15 k)7 cm.
このため、従来の減圧成形により得られた積層板は、ボ
イド、気泡等の現象はみられないが。Therefore, the laminates obtained by conventional vacuum molding do not exhibit phenomena such as voids and bubbles.
金属箔を一体に貼り付けない積層板の場合は表面平滑性
が、金属箔張積層板の場合は金属箔ビール強度が、また
異なったプリプレグを用いて積層構成体を形成したとき
は層間の接着力が十分でなく、積層板内に於ける前記特
性の変動幅増大を誘発したりする等の問題があった。In the case of a laminate with no metal foil attached to it, the surface smoothness is measured, in the case of a metal foil-clad laminate, the metal foil strength is measured, and when a laminate structure is formed using different prepregs, the adhesion between the layers is determined. There was a problem in that the force was not sufficient and the range of variation in the characteristics within the laminate was increased.
本発明は、減圧成形における積層板の製造において１層
間接着性１表明平滑性、金属箔ビール強度の優れた積層
板を提供することを目的とする。An object of the present invention is to provide a laminate that has excellent interlayer adhesion, surface smoothness, and metal foil beer strength in the production of a laminate using vacuum molding.
問題点を解決するための手段
本発明は上記の目的を達成するためになされたもので、
プリプレグを真空或は減圧下で加熱加圧することにより
積層板を製造する積層板の減圧成形に於いて加熱成形中
に成形圧力を上昇させることを特徴とするものである。Means for Solving the Problems The present invention has been made to achieve the above objects.
This method is characterized in that the molding pressure is increased during the hot molding in vacuum molding of a laminate, in which a laminate is manufactured by heating and pressurizing prepreg under vacuum or reduced pressure.
かかる本発明の方法に於いて、積層構成体のプリプレグ
中の樹脂が溶融し硬化開始した時点で成形圧力を上昇さ
せることが好ましい。In the method of the present invention, it is preferable to increase the molding pressure at the time when the resin in the prepreg of the laminate structure starts to melt and harden.
作用
本発明は、上記の特徴を有することにより、従来の減圧
成形と同様な効果、すなわち、積層板に内泡される気泡
、ボイド及び積層板周辺に生じるガス曇り等の不良現象
が低減或は皆無になるだけではなく、加熱成形中に成形
圧力を上昇させることにより、積層板の表面平滑性、銅
箔（金属箔）ビール強度の向上及び異種のプリプレグ間
の接着強度等の積極板特性を、従来の常圧成形及び減圧
成形で得られるものより優れたものにすると共に、該緒
特性の積層板肉変動幅を縮減することかできる。Operation The present invention has the above-mentioned features, and thus has the same effects as conventional vacuum molding, namely, reducing or reducing defective phenomena such as bubbles and voids formed in the laminate, and gas clouding that occurs around the laminate. Not only is it completely eliminated, but by increasing the molding pressure during heat forming, positive board properties such as surface smoothness of the laminate, improvement of copper foil (metal foil) beer strength, and adhesive strength between different types of prepregs can be improved. This method is superior to that obtained by conventional normal pressure molding and vacuum molding, and it is also possible to reduce the range of variation in the thickness of the laminate.
実施例 本発明で、プリプレグに使用される樹脂は。Example In the present invention, the resin used for the prepreg is:
エポキシに限られるものではなく、フェノール、ポリア
ミド、ポリイミドポリエステルをメラミン等の積層板用
として使用できる全ての樹脂でである。また、樹脂を含
浸してプリプレグとする基材も、紙、布、不織布等、通
常積層成形に供されるものである。金属箔も銅箔に限る
ものではない。It is not limited to epoxy, but can be any resin that can be used for laminates, such as phenol, polyamide, polyimide polyester, and melamine. Further, the base material impregnated with a resin to form a prepreg is also one that is usually subjected to lamination molding, such as paper, cloth, or nonwoven fabric. The metal foil is not limited to copper foil either.
本発明の実施例を詳細に説明する。Examples of the present invention will be described in detail.
実施例１
ガラス布にＦ几−４用エポキシ樹脂を塗布含浸させ、加
熱乾燥して、Ｂステージの樹脂含有率４２重量幅、大き
さ、１０５０醪Ｘ１０５０鵡のプリプレグを得た。該プ
リプレグ８枚を重ね合わせたその両面に大きさｌ ０７
０ＷＸ１０７０寵、厚さｌ ８ ｔｉ ｍの銅箔を配置
して１組の積層構成体とし、キャリア板の上を該プリプ
レグ構成体とステンレス鏡面板とを交互に組み合わせて
プレス１段から１２枚の銅張り積層板が得られるように
１２組まで積み重ねた。次いで、その上下にクラフト紙
（厚さ０．１５＋ａ＋）５枚を置いて成形用クッション
材とし、上側クッション材の上に上板を載せてプレス成
形の１段分とした。この１段分と同じ方法で３０段分を
構成し。Example 1 A glass cloth was coated and impregnated with an epoxy resin for F-4, and then heated and dried to obtain a B-stage prepreg with a resin content of 42 weight width and size of 1050 mash x 1050 mackerel. The size l 07 is placed on both sides of the 8 sheets of prepreg stacked together.
Copper foils of 0W Up to 12 sets were stacked to obtain copper-clad laminates. Next, five sheets of kraft paper (thickness 0.15+a+) were placed above and below it to serve as a cushioning material for molding, and a top plate was placed on top of the upper cushioning material to form one stage of press molding. Configure 30 stages using the same method as this one stage.
プレス熱盤間に挿入した。It was inserted between the press heating plates.
次いで、真空ポンプを使い、５０ ｙａｎｋ ｔの減圧
状態で熱盤温度１７５°Ｃ１成形初期圧力１０ｋｇ ／
ｃｄｌ、成形後期圧力３０ｋ）／ｃＩ／ｌ、加熱時間
１００分、冷却時間４０分の条件で、加熱加圧成形を行
い、厚さ１６ ｍの銅張り積層板を得た。Next, using a vacuum pump, the heating platen temperature was 175°C, the initial molding pressure was 10 kg/1, and the pressure was reduced to 50 yank t.
A copper-clad laminate with a thickness of 16 m was obtained by hot-pressure molding under the following conditions: cdl, late-molding pressure 30 k)/cI/l, heating time 100 minutes, and cooling time 40 minutes.
尚、成形後期圧力への圧力上昇ポイントは、熱盤に近い
プリプレグの温度か１１０°Ｃ（プリプレグ樹脂のゲル
化点）になった時点である。The point at which the pressure increases to the late molding pressure is when the temperature of the prepreg near the heating plate reaches 110° C. (the gelling point of the prepreg resin).
実施例２
成形初期圧力１０ｋ）／ｃ＜、成形後期圧力５０ｋｙ
／ ｃｄｌ、その他の条件は、実施例１と同様な方法で
、厚さ１．６ｍの銅張り積層板を得た。Example 2 Initial molding pressure 10k)/c<, late molding pressure 50ky
/cdl and other conditions were the same as in Example 1 to obtain a copper-clad laminate having a thickness of 1.6 m.
実施例３
成形初期圧力１０ｋｙ、／７、成形後期圧カフ０ｋｔ
／ ａｒｔ、その他の条件は実施例１と同様な方法で、
厚さ１，６Ｈの銅張り積層板を得た。Example 3 Initial molding pressure 10ky, /7, late molding pressure cuff 0kt
/ art, other conditions were the same as in Example 1,
A copper-clad laminate with a thickness of 1.6H was obtained.
実施例４
３００ｗＨｙ−の減圧状態で、他は実施例１と同様な方
法により厚さ１．６Ｍの銅張り積層板を得た。Example 4 A copper-clad laminate having a thickness of 1.6 M was obtained in the same manner as in Example 1 except under a reduced pressure of 300 wHy-.
実施例５
成形初期圧１０ｋｙ／ｃｍ、成形後期圧力５０に？／ｄ
、他の条件は実施例４と同様な方法で、厚さ１．６篩の
銅張り積層板を”得た。Example 5 Initial molding pressure 10ky/cm, late molding pressure 50? /d
A copper-clad laminate having a thickness of 1.6 sieves was obtained using the same method as in Example 4 except for the other conditions.
実施例６
成形初期圧ＩＱｋ）／ｃＩＩｔ、成形後期圧カフ０ｋｆ
／ ｃｍ 、他の条件は実施例４と同様な方法で、厚さ
１．６ｍｍの銅張り積層板を得た。Example 6 Initial molding pressure IQk)/cIIt, late molding pressure cuff 0kf
/cm, and the other conditions were the same as in Example 4 to obtain a copper-clad laminate with a thickness of 1.6 mm.
従来例１
実施例１と同様のエポキシ−ガラス布のプリプレグを用
い、常圧下（大気圧７６０＋ｗ＋Ｈ１ｉ’下）で、熱盤
温度１７５°Ｃ１成形初期圧力１０ｋｆ／ｄ、成形後期
圧カフ０ｋ）７ｍ（成形圧力上昇ポイントは実施例１と
同様）、加熱時間１００分、冷却時間４０分の条件で、
加熱加圧成形を行い、厚さ１．６ ｗｘの銅張り積層板
を得た。Conventional Example 1 Using the same epoxy glass cloth prepreg as in Example 1, under normal pressure (atmospheric pressure 760+w+H1i'), heating platen temperature 175°C, initial molding pressure 10 kf/d, late molding pressure cuff 0 k) 7 m ( The molding pressure increase point is the same as in Example 1), heating time is 100 minutes, cooling time is 40 minutes,
Heat and pressure molding was performed to obtain a copper-clad laminate having a thickness of 1.6 wx.
従来例２
実施例１と同様に５０ｍＨｌｉ’の減圧状態で、但し成
形圧力は１０ｋｐ／ｍの一定圧力に保って、他は実施例
１と同じ方法で、厚さ１．６ｓｍの銅張り積層板を得た
。Conventional Example 2 A copper-clad laminate with a thickness of 1.6 sm was prepared in the same manner as in Example 1, except that the molding pressure was kept at a constant pressure of 10 kp/m, in the same manner as in Example 1, under a reduced pressure of 50 mHli'. I got it.
従来例３
成形圧力を２０ｋｙ／’ｃ＋＋！の一定圧力に保つ以外
。Conventional example 3 Molding pressure is 20ky/'c++! other than keeping it at a constant pressure.
従来例２と同様の方法で、厚さ１．６ ｖａｎの銅張り
積層板を得た。A copper-clad laminate having a thickness of 1.6 van was obtained in the same manner as in Conventional Example 2.
従来例４
減圧状態を３００．Ｈ１ｉ４とする以外は、従来例２と
同様な方法で厚さ１．６０の銅張り積層板を得た。Conventional Example 4 Reduced pressure to 300. A copper-clad laminate having a thickness of 1.60 was obtained in the same manner as in Conventional Example 2 except that H1i4 was used.
従来例５
成形圧力を２０ｋ）／ｃ＋＋！の一定圧力に保つ以外従
来例４と同様の方法で厚さ１．６酊の銅張り積層板を得
た。Conventional example 5 Molding pressure 20k)/c++! A copper-clad laminate with a thickness of 1.6 mm was obtained in the same manner as in Conventional Example 4 except that the pressure was maintained at a constant pressure of .
以上、実施例１〜６、従来例１〜５は、ＦＲ−４タイプ
のエポキシ銅張り積層板について説明したか、エポキシ
樹脂−ガラス不織布プリプレグを芯材とし、前記のエポ
キシ−ガラス布プリプレグを表面材としたコンポジット
銅張り積層板について説明する。Above, in Examples 1 to 6 and Conventional Examples 1 to 5, FR-4 type epoxy copper-clad laminates were explained. The composite copper-clad laminate used as the material will be explained.
実施例７
ガラス不織布にＯＥＭ−３用エポキシ樹脂を塗布含浸さ
せ、加熱乾燥してＢ−ステージの樹脂含有率６０重量係
、大きさｌ Ｏ５奮１０５０闘のエポキシガラス不織布
プリプレグを得た。Example 7 A glass nonwoven fabric was coated and impregnated with an epoxy resin for OEM-3, and then heated and dried to obtain a B-stage epoxy glass nonwoven fabric prepreg having a resin content of 60% by weight and a size of 1050% by weight.
該プリプレグ４枚を重ね合わせた両面に、実施例１で作
製したエポキシ−ガラス布プリプレグ１枚ずつを重ね合
計６枚とした。更に、その両面に、大きさ１０７０ｓｗ
Ｘ１０７０ｓ＋、厚さｌｓｔｔｍの銅箔を配置し１組と
し、しかる後は。One sheet of the epoxy-glass fabric prepreg produced in Example 1 was stacked on each side of the four sheets of prepreg, making a total of six sheets. Furthermore, on both sides, the size is 1070sw.
X1070s+ copper foil with a thickness of lsttm was arranged to form one set, and then the following steps were taken.
実施例１と同様の方法で厚さ１．６目のコンポジット銅
張り積層板を得た。A composite copper-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 1.
実施例８
成形初期圧力１０ｋ）７ｃｍ、成形後期圧力５０ｋｐ
／ ｃｉとし、その他の条件は実施例７と同様の方法で
厚さ１．６ ｍのコンポジット銅張り積層板を得た。Example 8 Initial molding pressure 10k) 7cm, late molding pressure 50kp
/ci, and the other conditions were the same as in Example 7 to obtain a composite copper-clad laminate having a thickness of 1.6 m.
実施例９
成形初期圧力１０ｋ）／ｃｎｔ、成形後期圧カフ０ｋｌ
／ｃｒｄ、他の条件は実施例７と同様に厚さ１．６簡の
フンポジット銅張り積層板を得た。Example 9 Initial molding pressure 10k)/cnt, late molding pressure cuff 0kl
/crd, and other conditions were the same as in Example 7 to obtain a Hunposite copper-clad laminate having a thickness of 1.6 sheets.
従来例６
実施例７と同様のプリプレグ構成で、常圧（大気圧７６
０ ｗｓＨＳ’）下、従来例１と同様の方法で厚さ１．
６ ｍのコンポジット銅張り積ｊ色板を得た。Conventional Example 6 A prepreg structure similar to that of Example 7, normal pressure (atmospheric pressure 76
0 wsHS'), the thickness was 1.
A 6 m long composite copper-clad laminated colored board was obtained.
従来例７
実施例７と同様に５０ ｗｓＨｌｉ’の減圧状態で、但
し成形圧力は、２０ｋ）７ｃｍの一定圧力に保ち。Conventional Example 7 As in Example 7, the molding pressure was kept at a reduced pressure of 50 wsHli', but the molding pressure was maintained at a constant pressure of 20k)7cm.
しかる後は、実施例７と同じ方法で厚さ１．６ ｍのコ
ンポジット銅張り積層板を得た。Thereafter, a composite copper-clad laminate having a thickness of 1.6 m was obtained in the same manner as in Example 7.
実施例１〜９、及び従来例１〜７で製造した銅張り積層
板について、板厚、ボイドの有無、反り、ネジレ、レジ
ンフロー、銅箔ヒール強度、また、コンポジット銅張り
積層板については。Regarding the copper-clad laminates manufactured in Examples 1 to 9 and Conventional Examples 1 to 7, the board thickness, presence or absence of voids, warpage, twisting, resin flow, copper foil heel strength, and composite copper-clad laminates are as follows.
ガラス布層とガラス不織布層の接着強度につい゛パ２．
′ご、、１り
発明の効果
本発明の効果を以下に述べる。Regarding the adhesive strength between the glass cloth layer and the glass nonwoven fabric layer, 2.
1. Effects of the invention The effects of the invention will be described below.
（１１従来の減圧成形と同様な効果、すなわち、積層板
内の気泡、ボイドの解消等の効果を有した。(11) It had the same effect as conventional vacuum molding, that is, the effect of eliminating air bubbles and voids in the laminate.
（２）減圧成形の加熱中に昇圧を行うため、（１１項の
効果に加え、銅箔（金属箔）ビール強度が従来よりも向
上した。(2) Since the pressure is increased during heating during vacuum molding, (in addition to the effect of item 11), the copper foil (metal foil) beer strength is improved compared to the conventional one.
（３） コンポジット積層板の場合、ガラス布層とガ
ラス不織布層など異種プリプレグ間の層間接着強度等、
異種の櫃層相料（プリプレグ）間の接着強度か従来の減
圧成形より高まり優れたものになった。(3) In the case of composite laminates, interlayer adhesion strength between different types of prepreg such as glass cloth layer and glass nonwoven fabric layer, etc.
The adhesive strength between different types of pre-preg materials has increased and is superior to conventional vacuum molding.
Claims (1)
板を製造する積層板のプレス成形に於いて、加熱成形中
に成形圧力を上昇させることを特徴とする積層板の製造
法。 ２、成形圧力を上昇させるポイントが、プリプレグ中の
樹脂が溶融し硬化を開始する時点である特許請求の範囲
第１項記載の積層板の製造法。[Claims] 1. In press forming of a laminate in which a laminate is produced by heating and pressurizing prepreg under reduced pressure, the production of a laminate is characterized by increasing the molding pressure during hot forming. Law. 2. The method for manufacturing a laminate according to claim 1, wherein the point at which the molding pressure is increased is the point at which the resin in the prepreg melts and begins to harden.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62130736A JPH0757494B2 (en) | 1987-05-27 | 1987-05-27 | Laminated board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62130736A JPH0757494B2 (en) | 1987-05-27 | 1987-05-27 | Laminated board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63295217A true JPS63295217A (en) | 1988-12-01 |
| JPH0757494B2 JPH0757494B2 (en) | 1995-06-21 |
Family
ID=15041397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62130736A Expired - Lifetime JPH0757494B2 (en) | 1987-05-27 | 1987-05-27 | Laminated board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0757494B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112658A (en) * | 1989-09-27 | 1991-05-14 | Shin Kobe Electric Mach Co Ltd | Manufacture of epoxy resin laminated board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615156A (en) * | 1979-07-13 | 1981-02-13 | Matsushita Electric Works Ltd | Rotor of flat type motor |
| JPS56166020A (en) * | 1980-05-27 | 1981-12-19 | Shin Kobe Electric Mach Co Ltd | Manufacture of laminate |
| JPS61295038A (en) * | 1985-06-24 | 1986-12-25 | 新神戸電機株式会社 | Manufacture of laminated board |
-
1987
- 1987-05-27 JP JP62130736A patent/JPH0757494B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615156A (en) * | 1979-07-13 | 1981-02-13 | Matsushita Electric Works Ltd | Rotor of flat type motor |
| JPS56166020A (en) * | 1980-05-27 | 1981-12-19 | Shin Kobe Electric Mach Co Ltd | Manufacture of laminate |
| JPS61295038A (en) * | 1985-06-24 | 1986-12-25 | 新神戸電機株式会社 | Manufacture of laminated board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112658A (en) * | 1989-09-27 | 1991-05-14 | Shin Kobe Electric Mach Co Ltd | Manufacture of epoxy resin laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0757494B2 (en) | 1995-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63295217A (en) | Manufacturing method of laminates | |
| JPS6365509B2 (en) | ||
| JP3145915B2 (en) | Prepreg for manufacturing metal foil-clad laminates | |
| JPH04223113A (en) | Manufacture of laminated sheet | |
| JPH04158593A (en) | Manufacture of laminate | |
| JPH0397551A (en) | Production of laminated sheet | |
| JPH06914A (en) | Manufacture of single-faced copper-clad laminated sheet | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JPH02258337A (en) | Manufacture of laminate for printed circuit | |
| JPH021672B2 (en) | ||
| JP2001179884A (en) | Metal foil clad laminated sheet and method of manufacturing the same | |
| JP4425523B2 (en) | Laminate production method | |
| JPH0257018B2 (en) | ||
| JPS61220841A (en) | Manufacture of copper lined laminated board | |
| JPH04185408A (en) | Manufacture of thermosetting resin laminate | |
| JPH0414875B2 (en) | ||
| JPH04216022A (en) | Manufacture of thermosetting resin laminate | |
| JPH0443029A (en) | Manufacture of copper-clad laminated board | |
| JPS6411449B2 (en) | ||
| JPH0334677B2 (en) | ||
| JPH10166381A (en) | Manufacturing method of laminated board | |
| JPH06336528A (en) | Single-copper-clad laminate for printed circuit | |
| JPH06336527A (en) | Single-copper-clad laminate for printed circuit | |
| JPH0564823A (en) | Manufacture of laminated sheet for one side printed circuit | |
| JPH03155936A (en) | Manufacture of laminated sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |