JPS6324871U - - Google Patents
Info
- Publication number
- JPS6324871U JPS6324871U JP11820486U JP11820486U JPS6324871U JP S6324871 U JPS6324871 U JP S6324871U JP 11820486 U JP11820486 U JP 11820486U JP 11820486 U JP11820486 U JP 11820486U JP S6324871 U JPS6324871 U JP S6324871U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- wiring board
- printed wiring
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係るプリント配線板の一例
を示す要部の断面図、第２図は実装状態を示す断
面図、第３図は従来の説明に供するプリント配線
板の断面図、第４図及び第５図はこの考案の説明
に供する第３図と同様な断面図である。
１０……プリント配線板、１……プリント基板
、２……導電層、２ａ……導体ランド、３，４…
…チツプ部品、５……デスクリート部品、８……
スルーホール、９……スルーホールメツキ層、９
ａ……スルーホールランド、２０……充填層、２
５……半田レジスト層。
FIG. 1 is a cross-sectional view of essential parts showing an example of a printed wiring board according to this invention, FIG. 2 is a cross-sectional view showing a mounted state, FIG. 3 is a cross-sectional view of a conventional printed wiring board for explanation, and FIG. 5 and 5 are sectional views similar to FIG. 3 for explaining this invention. 10... Printed wiring board, 1... Printed circuit board, 2... Conductive layer, 2a... Conductor land, 3, 4...
...Chip parts, 5...Discrete parts, 8...
Through hole, 9...Through hole plating layer, 9
a... Through-hole land, 20... Filled layer, 2
5...Solder resist layer.
Claims (1)
ールメツキ層と、 このスルーホールメツキ層の上部及び下部配線
面に形成されたスルーホールランドと、 上部及び下部配線用導電層と、 この導電層の電子部品実装部に形成された導体
ランドとを有し、 上記スルーホールにはこれを閉塞するように充
填層が形成され、 上記スルーホールランドを挾んで上記電子部品
が実装されるようになされたことを特徴とするプ
リント配線板。 (2) 上記電子部品としては、チツプ部品が使用
されてなることを特徴とする特許請求の範囲第１
項記載のプリント配線板。 (3) 上記充填層は、半田レジスト層が利用され
てなることを特徴とする特許請求の範囲第１項記
載のプリント配線板。 (4) 上記充填層は、サービスマツプ印刷層が利
用されてなることを特徴とする特許請求の範囲第
１項記載のプリント配線板。[Scope of claim for utility model registration] (1) A through-hole plating layer formed in the through-hole of a printed circuit board, through-hole lands formed on the upper and lower wiring surfaces of this through-hole plating layer, and upper and lower wiring. and a conductive land formed on the electronic component mounting portion of the conductive layer, and a filling layer is formed in the through hole to close it, and the through hole land is sandwiched between the conductive lands and A printed wiring board characterized by having components mounted thereon. (2) Claim 1, characterized in that the electronic component is a chip component.
Printed wiring board as described in section. (3) The printed wiring board according to claim 1, wherein the filling layer is formed by using a solder resist layer. (4) The printed wiring board according to claim 1, wherein the filling layer is formed by using a service map printing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820486U JPS6324871U (en) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820486U JPS6324871U (en) | 1986-07-31 | 1986-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6324871U true JPS6324871U (en) | 1988-02-18 |
Family
ID=31004438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11820486U Pending JPS6324871U (en) | 1986-07-31 | 1986-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324871U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6384979U (en) * | 1986-11-22 | 1988-06-03 | ||
| JPH06350256A (en) * | 1993-06-11 | 1994-12-22 | Nec Corp | Printed wiring board having non-through hole and production of thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51665A (en) * | 1974-06-21 | 1976-01-06 | Nippon Electric Co | HANDAZUKE HOHO |
| JPS5758792U (en) * | 1980-09-24 | 1982-04-07 |
-
1986
- 1986-07-31 JP JP11820486U patent/JPS6324871U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51665A (en) * | 1974-06-21 | 1976-01-06 | Nippon Electric Co | HANDAZUKE HOHO |
| JPS5758792U (en) * | 1980-09-24 | 1982-04-07 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6384979U (en) * | 1986-11-22 | 1988-06-03 | ||
| JPH06350256A (en) * | 1993-06-11 | 1994-12-22 | Nec Corp | Printed wiring board having non-through hole and production of thereof |