JPS63234536A - Semiconductor substrate cleaning device - Google Patents

Abstract

PURPOSE:To make possible a stable conveyance and to contrive the improvement of a cleaning effect by setting the number of stages to be arranged and a tension to be applied by a method wherein a pair of roller brushes is set as one group and the plural groups are arranged. CONSTITUTION:A pair of upper and lower roller brushes is set as one group, the plural groups are arranged along a semiconductor substrate conveying line and roller brushes 1a and 1b are each rotated in directions A and A' reverse to each other on the upper and lower sides. Moreover, each roller brush 1a, 1b, 2a, 2b, 3a, 3b, 4a and 4b is ready-changed its number of rotation even though their directions of rotation are set in the same. Accordingly, each roller brush slips on a wafer (semiconductor substrate) 6 due to a difference in the numbers of rotation between the roller brushes 1a and 1b and the roller brushes 2a and 2b to cleanse the wafer 6 and even in case the water is made to pass through between the roller brushes 3a and 3b and 4a and 4b, the wafer is similarly cleansed. On the other hand, pure water or cleaning chemicals is sprayed toward the wafer 6 through nozzles 5 for increasing a cleaning effect. Thereby, the cleaning effect can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device for semiconductor substrates (hereinafter referred to as wafers), and particularly to a device for cleaning both sides of a wafer with a roller brush.

[Prior Art] Conventionally, this type of semiconductor substrate cleaning apparatus cleans semiconductor substrates by rotating a roller brush at a constant speed.

[Problems to be solved by the invention] In the conventional device, the roller brush rotates at a constant speed.
The contact time between the roller brush and the substrate remains unchanged, making it impossible to increase the cleaning effect.

Furthermore, since the roller brushes are arranged at right angles, there is a drawback that stability is lacking when setting wafers.

An object of the present invention is to provide a cleaning device that solves the above problems.

[Means for Solving the Problems] The present invention provides a semiconductor substrate cleaning apparatus for cleaning semiconductor substrates using roller brushes, which rotate in opposite directions to give feed to the substrates, and arbitrarily feed each set of roller brushes. A semiconductor comprising a plurality of pairs of cleaning roller brushes driven at a set rotational speed, the plurality of pairs of cleaning roller brushes being arranged in series along a semiconductor substrate conveyance line. This is a substrate cleaning device.

[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, a pair of roller brushes la and lb are vertically opposed and rotate in opposite directions to feed the substrate.
, 2a, 2b, 3a, 3b, 4a, and 4b are set as one set, and the plurality of sets are arranged in series at regular intervals in the horizontal direction. Further, nozzles 5, 5, . . . for spraying a chemical liquid or the like onto the semiconductor substrate 6 are arranged between adjacent roller brushes. Also roller brushes la, ib, 2a.

The pairs 2b, 3a, 3b, 4a, and 4b are driven at an arbitrarily set rotation speed for each pair.

The roller brushes are arranged in pairs (upper and lower), and multiple sets are lined up along the semiconductor substrate conveyance line. wafer 6
The first roller brush la, 1 is transferred by belt conveyance etc.
When the wafer 6 is carried to the point b, since the roller brushes 1a and lb are vertically rotating in opposite directions A and A', a driving force is applied to the wafer 6, and the roller brushes la and lb move to the next roller brushes 2a and 2b. Go towards it. Roller brushes 2a, 2b, 3a, 3b.

The roller brushes 4a and 4b also rotate in the same manner as the roller brushes ia and ib, and the wafer 6 can be handled by passing between the roller brushes in order. Each roller brush 1a, lb, 2a, 2
b. 3a.

3b, 4a, and 4b have different rotational speeds even though their rotational directions are the same. Although it may be set arbitrarily, here, the roller brushes 1a, lb, 4a, and 4b are set to be slow, and the roller brushes 2a, 2b, 3a, and 3b are set to be fast. Roller brush 2 passes through roller brushes la and lb
When reaching the roller brushes a and 2b, each roller brush slips on the bar 6 due to the difference in rotational speed between the roller brushes ia and ib and the roller brushes 2a and 2b, and the wafer 6 is washed by rubbing the wafer 6. do. A similar phenomenon occurs when the wafer 6 passes through the roller brushes 3a, 3b, 4a, and 4b, and the wafer 6 is cleaned. On the other hand, pure water or cleaning chemicals are sprayed from the nozzle 5 toward the wafer 6 in order to enhance the cleaning effect. By making the tension on each set of roller brushes freely adjustable, cleaning can be performed without causing scratches.

[Effects of the Invention] As explained above, the present invention has a pair of roller brushes.
By arranging a plurality of sets, stable conveyance can be achieved, and the cleaning effect can be improved by setting the number of stages arranged and the tension applied.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of an embodiment of the invention. la, lb, 2a, 2b, 3a, 3b, 4
a, 41o・a-ra brush, 5...nozzle, 6・
...Semiconductor substrate patent applicant Kyushu NEC Co., Ltd. Figure 1

Claims (1)

[Claims] (1) In a semiconductor substrate cleaning apparatus that cleans semiconductor substrates using roller brushes, a pair of roller brushes that rotate in opposite directions to feed the substrate and are driven at an arbitrarily set rotational speed for each set. 1. A semiconductor substrate cleaning apparatus comprising a plurality of pairs of cleaning roller brushes, the plurality of pairs of cleaning roller brushes being arranged in series along a semiconductor substrate conveyance line.