JPS63229427A - Input/output device for optical wiring - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] The present invention is an input/output device for optical wiring between ICs or between electronic devices, in which an output electrical signal from the above-mentioned IC or the above-mentioned electronic device is optically output by an electro-optical element. By making it possible to input this data to other ICs or other electronic devices, high-speed data transfer between ICs or electronic devices is made possible.

[Industrial application field]

The present invention relates to an optical wiring input/output device that performs optical wiring between ICs on a printed circuit board or between electronic devices (eg, an IC board, a computer, a peripheral terminal device, etc.).

[Conventional technology]

Conventionally, most of the wiring between ICs or between electronic devices is electrical wiring. However, the data transfer rate using such electrical wiring has a limit of about 4 Mbytes/see. Therefore, in order to break this limit, in particular,
Between electronic devices, an LED (light emitting diode) array or L
An optical wiring method has been proposed in which a D (semiconductor laser) array is made to blink and this optical signal is received by a light receiving element of another electronic device.

[Problem that the invention seeks to solve]

In the optical wiring method described above, as the number of input/output terminals of electronic equipment increases, the number of LEDs (or LDs)
There is also a problem that the number of drive circuits becomes enormous. Furthermore, the data transfer speed is higher than that of LED (or LD).
There was also the problem that the rate was determined by the modulation speed of ).

In addition, considering the future speed-up of ICs, optical wiring between ICs on printed circuit boards will become necessary, but conventionally, hybrid optical waveguides and electrical elements on printed circuit boards have not been used. Although proposed, optical wiring between ICs has not yet been realized.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an optical wiring input/output device that enables high-speed data transfer between ICs having many input/output terminals or between electronic devices.

[Means to try to solve problems]

In the optical wiring input/output device of the present invention, an electro-optical element formed by forming an electro-optic material between a pair of electrodes is provided on a printed circuit board in correspondence with an output terminal of an IC, and one of the pair of electrodes is One electrode of the IC is connectable to the output terminal, and the electro-optical element converts light from the light source into modulated light according to the electrical signal output from the output terminal and outputs it to another IC. It is characterized by:

In another optical wiring input/output device of the present invention, an electro-optic element formed by forming an electro-optic material between a pair of electrodes is provided corresponding to an output terminal of an electronic device, and one of the above-mentioned pair of electrodes is One electrode can be connected to the output terminal, and the electro-optical element converts light from the light source into modulated light according to the electrical signal output from the output terminal and outputs it to other electronic equipment. This is a characteristic feature.

[For production]

In the present invention, the above-mentioned electro-optical element is used as a means for converting an output electrical signal into an optical signal and outputting it. In such an electro-optic element, a sufficient electro-optic effect is produced in the electro-optic material between the pair of electrodes by applying only a small voltage (for example, about 5 cm) between the pair of electrodes. Therefore, if an output electrical signal from an IC or an electronic device is applied between the electrodes as described above, the light irradiated onto the electro-optic material will be modulated and output.

If such modulated light is photoelectrically converted by a light receiving element, an electric signal corresponding to the above output electric signal can be obtained. By inputting this electric signal to another IC or electronic device, it is possible to convert between ICs or electronic devices. optical wiring will be realized.

Light modulation using the electro-optical element described above does not require a drive circuit, unlike when using an LED or LD, and has a fast modulation speed. Therefore, even if the present invention is applied to ICs and electronic devices equipped with many output terminals, high-speed data transfer is possible with a very simple configuration.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram showing an embodiment of the present invention.

This embodiment realizes optical wiring between a plurality of ICs 2, 3, and 4 arranged on a printed circuit board 1 made of glass, ceramic, or the like.

In the following, optical wiring between two ICs 2 and 3 will be explained as an example.

First, a plurality of electro-optical elements 5 are arranged in a line so as to correspond to each of a plurality of output bins (output terminals) 2a of the IC 2 to form an electro-optical element array 50. The electro-optical element 5 constitutes, for example, a total internal reflection optical switch as shown in FIG. The entire waveguide 6 or only the branching portion 6a is formed of an electro-optic material.The optical waveguide 6 branches light from a light source (for example, an LED or LD) 7 to each electro-optic element. 5. Also, one electrode 5a can be connected to the output pin 2a of the IC2 as a pin holder as an electrode, and the other electrode 5b can be connected to the output pin 2a of the IC2.
is grounded as a common electrode. The pin holder is the electrode,
In order to perform impedance matching, it may be grounded through a 50Ω load.

In the electro-optical element 5 shown in FIG. 2 fa), the electrode (
When a voltage (output electrical signal) is applied to the pin receiver (electrode) 5a via the output pin 2a, the refractive index of the electro-optic material between the electrodes 5a and 5b decreases. Then, the light from the light source 7 that was traveling straight through the optical waveguide 6 is totally reflected between the electrodes 5a and 5b, and enters the other optical waveguide 8 toward the other IC 3. That is, the light from the light source 7 is modulated by the electro-optical element 5 according to the output electric signal of the IC 2, and this modulated light is output to the other IC 3.

On the other hand, on the input side of the other IC 3, a plurality of light receiving elements 9 are arranged in a row to form a light receiving element array 90 so as to correspond to each of the plurality of input pins (input terminals) 3a. Each light-receiving element 9 is equipped with a pair of electrodes 9a and 9b, for example as shown in FIG. One electrode 9b is grounded as a common electrode. During this time, the signal input from the electrode of the pin receiver to the input pin of the IC may be amplified by the IC circuit. Further, the optical waveguide 8 coming out from the IC2 side extends to the corresponding light receiving element 9 on the IC3 side. Therefore, the modulated light traveling through the optical waveguide 8 is photoelectrically converted by the light receiving element 9, and the electrical signal is inputted to the input pin 3a via the pin receiver electrode 9a.

By performing the optical wiring as described above, the data in IO2 is transmitted to the output pin 2a, the electro-optical element array 50, the optical waveguide 8, the light receiving element array 90 (in some cases, the amplifier),
and is transferred to IC3 via input pin 3a. I
Optical wiring between C3 and IC4 can also be performed in the same manner as above.

In addition to the total internal reflection optical switch shown in FIG. 2(a), the electro-optical element 5 may have a structure as shown in FIG. 2(b) to (e). FIG. 2B shows a cross-type bipolar switch, in which the refractive index of the central portion of the optical waveguide changes by applying a voltage to the electrode 5a of the pin receiver, and light switching occurs. The same figure (C) is a directional coupler,
In the pin receiver, the refractive index between the optical waveguides is changed by applying a voltage to the electrode 5a, so that light moves from one optical waveguide to the other optical waveguide. In the same figure (dl is a Bragg switch, and in the pin receiver, applying a voltage to the electrode 5a produces a grating in the electro-optic material, and the resulting Bragg reflection switches the direction of light. Figure (e) shows a normal phase delay switch. (phase re
An optical modulator that utilizes tarda-tion),
When the linearly polarized light that has passed through the polarizer (metal cladding) 5c is passed through an optical waveguide made of electro-optic material, a phase delay occurs due to voltage application, and the polarization state changes depending on the voltage. The light intensity is modulated by passing this light through an analyzer (metal clad) 5d.

Further, instead of using the optical waveguide 6, the light from the light source 7 may be expanded by a lens or the like and guided to each of the electro-optical elements 5.

Furthermore, by providing a matrix optical switch 10 in the middle of the optical waveguide, such as between ICs 3 and 4 in FIG. 1, a plurality of modulated lights from the electro-optical element array can be appropriately switched and guided to the light-receiving element array. You can also do this. By doing so, it is possible to realize multifunctionalization of the optical wiring.

FIG. 4 is a schematic configuration diagram showing another embodiment of the present invention. In this embodiment, an IO adapter 12 that can be attached to the IC board 11 is configured to realize optical wiring between the IC board 11 and other IC boards. This one
The 0 adapter 12 includes a light output section 12a and a light receiving section 12b.

The light output section 12a includes an electro-optical element array 130 in which a plurality of electro-optical elements 13 are arranged in a row, and each electro-optical element 13 is arranged at a position corresponding to the output terminal 11a of the IC board 11. There is. Furthermore, light from a light source (for example, an LED or LD) 14 is branched and guided to each electro-optical element 13 through an optical waveguide 15, and its output light is guided to the outside through an optical waveguide 16. Electro-optical element 1
For example, as shown in FIG. 5, 3 constitutes a total internal reflection optical switch similar to that shown in FIG. 2 (ta). this is,
A pair of electrodes 13a, 13 are provided at the branch portion 15a of the optical waveguide 15.
b, and the entire optical waveguide 15 or only the branch portion 15a is formed of an electro-optic material. Here, one electrode 13a can be connected to the output terminal 1'la, and the other electrode 13b is grounded as a common electrode. In order to achieve impedance matching, the electrode 13a may be grounded through a 50Ω load. In addition to the above-mentioned total internal reflection optical switch, the electro-optical element 13 may include a crossed bipolar switch, a directional coupler, a Bragg switch, and an optical switch using phase delay as shown in FIG. 2 (bl to tel). It may also be a modulator.

In the light output section 12a having the above configuration, the light source 14
The light from the output terminal 11a is modulated by the electro-optical element 13 according to the output electrical signal from the output terminal 11a, and this modulated light is sent out as an optical signal.

On the other hand, the light receiving section 12b includes a light receiving element array 170 in which a plurality of light receiving elements 17 are arranged in a line, and each light receiving element 17 is arranged at a position corresponding to the input terminal 11b of the IC board 11.

Each light receiving element 17 is equipped with a pair of electrodes as shown in FIG. 3, one electrode can be connected to the input terminal 11b, and the other electrode is grounded as a common electrode. . The light sent from the outside passes through optical waveguide 1
8 to the light receiving element 17. Therefore, light (modulated light) sent from the outside is photoelectrically converted by the light receiving element 17, and the electrical signal is input to the input terminal 11b. The photoelectrically converted electrical signal may be amplified before entering the input terminal 11b.

By using the IO adapter 12 described above, optical wiring between IC boards can be realized. An example thereof is shown in FIG. Light is transmitted between each of the ten adapters 12 via optical fibers 19. In addition, by providing a matrix optical switch 20 in the middle of the circuit and appropriately switching and transmitting each optical signal, data transfer between a large number of IC boards becomes possible. Note that this embodiment applies to electronic devices other than IC boards,
For example, it can be applied to electronic computers, peripheral terminal devices, etc.

FIG. 7 is a schematic configuration diagram showing still another embodiment of the present invention. This embodiment also includes a ■0 adapter 21 for realizing optical wiring between IC boards.

The 10 adapters 21 are arranged in a plurality of sets in a matrix, each consisting of one electro-optical element 13 and one light-receiving element 17, and each of them is connected to a corresponding output terminal 11a,
It can be connected to the input terminal 11b. As shown in FIG. 8, the electro-optical element 13 includes a pair of electrodes 13
An electro-optical material 13c is formed between a and 13b, one electrode 13a can be connected to the output terminal 11a, and the other electrode 13b is used as a common electrode and is grounded. On the other hand, the light receiving element 17 has a pair of electrodes 17a and 17b.
One electrode 17a is connectable to the input terminal 11b, and the other electrode 17b is grounded as a transparent common electrode.

To realize optical wiring using the above IO adapter 21,
Light from a light source (not shown) is irradiated onto the entire surface from above. The light is modulated by the electro-optic element 13 and reflected upward. This modulated light is guided to the 10 adapter 21' of the other IC board 11' using the SELFOC fiber 22 (and vice versa). Note that the formation positional relationship of the electro-optical element 13 and the light-receiving element 17 is reversed between the IO adapter 21 and the IO adapter 21', and the electro-optical element 13 and the light-receiving element in either one of the 10 adapters 21 and 21' are reversed. A polarizing film is provided on the surface of 17.

Note that a SELFOC lens, SELFOC FIHA (trade name), or a normal lens or optical fiber may be used to transmit the modulated light. Furthermore, the present invention can be similarly applied to electronic computers, peripheral terminal devices, etc. instead of IC boards.

As explained above, in each of the above embodiments, an electro-optical element is used as a means for converting an output electrical signal of an IC or an electronic device (for example, an ICC power electronic computer peripheral terminal device, etc.) into an optical signal. , it is possible to realize high-speed data transfer between ICs or between electronic devices with a very simple configuration.

The above-mentioned electro-optical materials include materials shown in the molecular formula in FIG. 9, such as MNA, DΔN, 'MNM
Δ, PAN, NPP, PNP, SPCD (Styry
organic single crystal such as lpyridinium cyanine dye), or SPCD, merocyanine dye,
A polymer to which DANS or the like is added, or a II-VI group, m-v group MQW (multiple quantum well), etc. can be used. The organic single crystal thin film can be produced by a solvent evaporation method, a melting method, an LB (Langmuir-Blodgett) method, a vapor deposition method, etc.
ecular beam epitaxy) method, MOC
VD method, ALE (Atomic Layer E)
It can be produced by the pitaxy method etc.

Further, as the light-receiving element, a photodiode or solar cell using Si single crystal, GaAs single crystal, a-3i type material, etc., or a photoconductor such as a-3i: H, CdS, etc. can be used.

〔Effect of the invention〕

According to the present invention, the output electrical signal of an IC or electronic device is converted into an optical signal by an electro-optical element and outputted, so that the present invention can be applied to an IC or electronic device equipped with a large number of output terminals. Even in this case, high-speed data transfer is possible with a very simple configuration.

[Brief explanation of drawings]

Figure 1 is a schematic configuration diagram showing an embodiment of the present invention, Figure 2 (
a) to (el are enlarged plan views showing various specific examples of the electro-optical element 5, FIG. 3 is an enlarged plan view showing a specific example of the light receiving element 9, and FIG. 4 is another embodiment of the present invention. A schematic configuration diagram showing an example, FIG. 5 is an enlarged plan view showing a specific example of the electro-optical element 13, FIG. 6 is a diagram showing optical wiring between IC boards using ■0 adapter 12, and FIG. FIG. 8 is an enlarged perspective view showing an example of a specific structure of the electro-optical element 13 and light receiving element 17 in FIG. 7; FIG. )) is a diagram showing an example of a molecular formula representing a material used as an electro-optic material. 1...Printed circuit board, 2.3.4...IC. 2a... Output bin, 3a... Input pin, 5... Electro-optical element, 5a... Electrode (pin receiver is an electrode), 5b... Electrode (common electrode), 6... Optical waveguide , 7... Light source, 8... Optical waveguide, 9... Light receiving element, 9a... Electrode (pin receiver is an electrode), 9b... Electrode (common electrode), 10... Matrix optical switch , 11... IC board, 11a... Output terminal, 11b... Input terminal, 12... IO adapter, 13... Electro-optical element, 13a, 13b... Electrode, 13G... Electricity Optical substance, 14... Light source, 15... Optical waveguide, 17... Light receiving element, 19... Optical fiber, 21.21'... 107 Dufter, 22... Selfo Tsuku fiber, 50... ...Electro-optical element array, 90... Light-receiving element array, 130... Electro-optical element array, 170... Light-receiving element array. Patent applicant: Fujitsu Limited) F-! t, eR/l-*a[J Figure 1 Reception C1-1 To9s j Qd≦・I column Figure 3 Figure 5 Record between IC Ru-to Figure 6 1399 Kotakukan 1,000 7th figure 1; 几・1 Groden' Sleeping sword two palms Kochi l3J-,・
b'"Dirty in' [J -17 shells, Ishitomiif'
jFigure 8

Claims (1)

[Claims] 1) In an optical wiring input/output device that performs optical wiring between a plurality of ICs arranged on a printed circuit board (1), an electro-optic material is placed between a pair of electrodes (5a, 5b). The formed electro-optical element (5) is mounted on the printed circuit board.
(2), and one electrode (5a) of the pair of electrodes is connectable to the output terminal (2a) of the IC, and the electro-optical element (
5), the light from the light source (7) is transmitted to the output terminal (2a
) into modulated light according to the output electrical signal from the other IC (
3) An input/output device for optical wiring, characterized in that it outputs to. 2) A light receiving element (9) is provided corresponding to the input terminal (3a) of the other IC (3), and one electrode (9a) of the light receiving element is connected to the input terminal (3a) of the other IC. Optical wiring according to claim 1, characterized in that the modulated light is received by the light receiving element (9), photoelectrically converted and inputted to the input terminal (3a). Input/output device. 3) A light-receiving element array (90) is formed by arranging a plurality of the light-receiving elements (9) in a line corresponding to the plurality of input terminals (3a) of the other IC. The input/output device for optical wiring according to item 2. 4) A claim characterized in that an electro-optical element array (50) is formed by arranging a plurality of the electro-optical elements (5) in a line corresponding to the plurality of output terminals (2a) of the IC. The input/output device for optical wiring according to any one of items 1 to 3. 5) A matrix optical switch (10) is provided between the IC and the other IC, and the electro-optical element array (50)
A plurality of modulated lights from the matrix optical switch (10)
5. The input/output device for optical wiring according to claim 4, wherein the input/output device for optical wiring is switched by. 6) The light according to any one of claims 1 to 5, characterized in that the light from the light source (7) is expanded and guided to each of the electro-optical elements (5). Input/output device for wiring. 7) The device according to any one of claims 1 to 5, characterized in that the light from the light source (7) is branched and guided to each of the electro-optical elements (5). Input/output device for optical wiring. 8) Light from the light source (7) and the electro-optical element (
Any one of claims 1 to 7, characterized in that the modulated light from 5) is guided by an optical waveguide (6, 8).
The input/output device for optical wiring described in . 9) The input/output device for optical wiring according to any one of claims 1 to 8, wherein the light source (7) is a light emitting diode. 10) The input/output device for optical wiring according to any one of claims 1 to 8, wherein the light source (7) is a semiconductor laser. 11) The electro-optical element (5) uses any one of an optical modulator using a normal phase delay, a total internal reflection optical switch, a crossed bipolar switch, a Bragg switch, and a directional coupler. An input/output device for optical wiring according to any one of claims 1 to 10, characterized in that: 12) The electro-optic material is MNA, DAN, MNMA.
, PAN, NPP, PNP, and SPCD. 13) The optical wiring according to any one of claims 1 to 11, wherein the electro-optic material is a polymer added with SPCD, merocyanine dye, or DANS. Input/output device. 14) The electro-optic material is a group II-VI or III-V material.
The input/output device for optical wiring according to any one of claims 1 to 11, characterized in that the input/output device is a multi-quantum well of the group A. 15) The optical wiring according to any one of claims 2 to 14, wherein the light receiving element (9) is one of a solar cell, a photodiode, and a photoconductive element. input/output device. 16) In an optical wiring input/output device that performs optical wiring between electronic devices having a plurality of input/output terminals, a pair of electrodes (13a
, 13b), an electro-optical element (13) formed by forming an electro-optic material between the output terminals (11) of the electronic device (11).
a), one electrode (13a) of the pair of electrodes can be connected to the output terminal (11a), and the electro-optic element (13) connects the light source (1) to the output terminal (11a).
4) An input/output device for optical wiring, characterized in that the light from the output terminal (11a) is modulated according to the electrical signal output from the output terminal (11a) and output to another electronic device. 17) A light-receiving element (17) is provided corresponding to the input terminal (11b) of the electronic device, and the light-receiving element is electrically connectable to the input terminal (11b), so that light from other electronic devices is not transmitted. 17. The input/output device for optical wiring according to claim 16, wherein the light is received by the light receiving element (17), photoelectrically converted, and inputted to the input terminal (11b). 18) An electro-optical element array (130) is formed by arranging a plurality of the electro-optical elements (13) in a line corresponding to the plurality of output terminals (11a) of the electronic device, and the light-receiving element (17) Multiple input terminals of electronic equipment (11
18. The input/output device for optical wiring according to claim 17, characterized in that a plurality of light receiving elements are arranged in a line corresponding to (b) to form a light receiving element array (170). 19) The input/output device for optical wiring according to claim 18, characterized in that a plurality of modulated lights from the electro-optical element array (130) are respectively guided by optical fibers (19). 20) In correspondence with the plurality of output terminals (11a) and the plurality of input terminals (11b) of the electronic device, one each of the electro-optical element (13) and the light-receiving element (17) are arranged in a matrix shape. 18. The input/output device for optical wiring according to claim 17, wherein a plurality of sets are arranged in the optical wiring input/output device. 21) The modulated light from the plurality of electro-optical elements (13) arranged in a matrix is transmitted through Selfoc fibers (21).
2) The input/output device for optical wiring according to claim 20, characterized in that the input/output device is guided by a Selfoc lens, a normal lens, or an optical fiber. 22) The input/output device for optical wiring according to claim 21, characterized in that a polarizing film is provided on the light exit surface of the electro-optical element (13). 23) Claim 21 or 22, characterized in that a polarizing film is provided on the light receiving surface of the light receiving element (17).
Input/output device for optical wiring as described in section. 24) The light according to any one of claims 16 to 22, characterized in that the light from the light source (14) is spread and guided to each of the electro-optical elements (13). Input/output device for wiring. 25) The device according to any one of claims 16 to 22, characterized in that the light from the light source (14) is branched and guided to each of the electro-optical elements (13). Input/output device for optical wiring. 26) Claims 16 to 2, characterized in that the light from the light source (14) is guided by an optical waveguide (15).
The input/output device for optical wiring according to any one of Item 5. 27) The optical wiring input/output device according to any one of claims 16 to 26, wherein the light source (14) is a light emitting diode. 28) The input/output device for optical wiring according to any one of claims 16 to 26, wherein the light source (14) is a semiconductor laser. 29) The electro-optical element (13) may be any one of an optical modulator using normal phase delay, a total internal reflection optical switch, a crossed bipolar switch, a Bragg switch, and a directional coupler. An input/output device for optical wiring according to any one of claims 16 to 28, characterized in that: 30) The electro-optic material is MNA, DAN, MNMA.
The input/output device for optical wiring according to any one of claims 16 to 29, characterized in that it is an organic single crystal of any one of , PAN, NPP, PNP, and SPCD. 31) The optical wiring according to any one of claims 16 to 29, wherein the electro-optic material is a polymer added with SPCD, merocyanine dye, or DANS. Input/output device. 32) The electro-optic material is a group II-VI or III-V material.
The input/output device for optical wiring according to any one of claims 16 to 29, characterized in that the input/output device is a multi-quantum well of the group A. 33) The optical wiring according to any one of claims 17 to 32, wherein the light receiving element (17) is one of a solar cell, a photodiode, and a photoconductive element. input/output device. 34) The input/output device for optical wiring according to any one of claims 16 to 33, wherein the electronic device is an IC board (11).