JPS6322299A - Resin-impregnated base material - Google Patents
Resin-impregnated base materialInfo
- Publication number
- JPS6322299A JPS6322299A JP16497986A JP16497986A JPS6322299A JP S6322299 A JPS6322299 A JP S6322299A JP 16497986 A JP16497986 A JP 16497986A JP 16497986 A JP16497986 A JP 16497986A JP S6322299 A JPS6322299 A JP S6322299A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated base
- powder
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims description 34
- 239000000843 powder Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 description 6
- 230000002265 prevention Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 4
- 239000002966 varnish Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Details Of Cutting Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野］
本発明は切断部からの樹脂粉及び基材粉等の粉末の落下
を防止した樹脂含浸基材に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a resin-impregnated base material that prevents powders such as resin powder and base material powder from falling from a cut portion.
［背景技術］
従来より樹脂含浸基材は、紙、ガラス布、織物等の基材
を樹脂ワニス槽に浸漬して樹脂を含浸させ、乾燥機で乾
燥させて製造されており、この樹脂含浸基材は、積層成
形に際して所定寸法に切断されるが、この際にあるいは
切断後に切断部がら樹脂粉及１基材粉等の粉末が落下し
て、作業環境が悪くなるだけでなく、積層成形の際の加
熱加圧により、これら粉末が打痕となってしまっていた
。[Background Art] Conventionally, resin-impregnated base materials have been manufactured by dipping base materials such as paper, glass cloth, and textiles in a resin varnish bath to impregnate them with resin, and then drying them in a dryer. Materials are cut into predetermined dimensions during lamination molding, but powders such as resin powder and base material powder fall from the cut parts at this time or after cutting, which not only worsens the working environment but also causes problems during lamination molding. Due to the heat and pressure applied during the process, these powders formed dents.
［発明の目的］
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは切断部からの粉末の落下がなく、作業
環境を悪化させることがないだけでなく、積層成形に際
して打痕を発生させることがない樹脂含浸基材を提供す
ることにある。[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to not only prevent powder from falling from the cutting section and worsen the working environment, but also to eliminate the possibility of laminated molding. An object of the present invention is to provide a resin-impregnated base material that does not cause dents during washing.
［発明の開示］
本発明の樹脂含浸基材は、基材に！（脂を含浸させ乾燥
させて形成され、積層成形１こ際して所定寸法に切断さ
れる樹脂含浸基材１であって、切断部２に樹脂粉及び基
材粉等の粉末の落下防止層３を設けて成るものであり、
このｖｔ成により上記目的を達成できたものである。[Disclosure of the Invention] The resin-impregnated base material of the present invention can be used as a base material! (Resin-impregnated base material 1 formed by impregnating with oil and drying, and cut into predetermined dimensions during laminated molding 1. A layer to prevent powders such as resin powder and base material powder from falling on the cut portion 2. It is made up of 3,
With this vt configuration, the above objective was achieved.
本発明における基材としては紙、有機繊維により形成し
た布、不織布、又はガラス、アスベスト等の黒磯繊維の
単独もしくは混紡による不繊布を採用できる。この基材
としてはＦＩ−さ０．０８〜０．３０ｍｍのらのを好適
に使用できる。この基材を樹脂フェスに浸漬して樹脂を
含浸し、乾燥させて樹脂含浸基材を形成するが、樹脂フ
ェスの樹脂としてはフェノール８（脂、エポキシ樹脂、
不飽和ポリエステル樹脂等の熱硬化性樹脂とがポリイミ
ド樹脂、ポリフェニレンポリサルファイド！（脂、ポリ
アミド樹脂等の熱可塑性樹脂のいずれをも採用できる。As the base material in the present invention, paper, cloth made of organic fibers, nonwoven fabric, or nonwoven fabric made of black iso fibers such as glass and asbestos alone or in combination can be used. As this base material, a laminated glass having an FI-length of 0.08 to 0.30 mm can be suitably used. This base material is immersed in a resin face to be impregnated with resin and dried to form a resin-impregnated base material.The resin for the resin face is phenol 8 (fat, epoxy resin,
Thermosetting resins such as unsaturated polyester resins and polyimide resins, polyphenylene polysulfides! (Any thermoplastic resin such as resin or polyamide resin can be used.
この場合基材への樹脂の含浸はワニス槽を減圧して減圧
下で、又はフェス槽内に配置した上下２個のロール間に
基材を通すことにより加圧した後、除圧して行う。加圧
下の場合、例えばロールが３段で、圧力１０ｋｇ／ｃ〜
２下で含浸を行う、樹脂の含浸量は固形分で３５〜６５
重量％である。加圧下又は減圧下で行うことにより、ワ
ニス槽中での基材への気泡の巻き込みを少なくで終るも
のである。もちろん、大気圧下で行ってもよい。このよ
うにして基材に樹脂を含浸させた後、１００〜１６０℃
で乾燥して樹脂含浸基材１を得る。この樹脂含浸基材１
は積層成形に際して、例えば、１ ａ＋Ｘ １ ｍの大
きさに切断される。切断部２には樹脂粉及び基材粉等の
粉末の落下防止Ｎ３が形成されている。この落下防止Ｎ
３は切断後あるいは切断前に切断する箇所に形成される
。例えば、１■×１（至）の大きさの樹脂含浸基材であ
れば、切断部２は周縁部に約５１程度の巾で形成される
。この切断部２は、例えば、切断後に、第２図に示すよ
うに上下一対の熱風ノズル４開に樹脂含浸基材１を通す
ことにより切断部２の樹脂を溶融させることにより形成
される。この場合、熱風温度は１２０〜２５０℃、熱風
ノズル径φ２〜８ｍｍ、ｔｆｉｆ脂含浸基材１とノズル
先端との距離５〜２０ｍｍ程度で行なわれる。その他、
接着剤を塗布したり、又熱溶融テープを貼着したりして
切断部２に落下防止層３が形成される。In this case, impregnation of the resin into the base material is carried out under reduced pressure by reducing the pressure in the varnish tank, or by applying pressure by passing the base material between two upper and lower rolls arranged in the fest tank, and then removing the pressure. In the case of under pressure, for example, there are three rolls and the pressure is 10 kg/c ~
Impregnation is carried out under 2. The amount of resin impregnated is 35 to 65 in terms of solid content.
Weight%. By carrying out the coating under increased pressure or reduced pressure, the entrainment of air bubbles into the substrate in the varnish bath can be reduced. Of course, it may be performed under atmospheric pressure. After impregnating the base material with resin in this way,
The resin-impregnated base material 1 is obtained by drying. This resin-impregnated base material 1
is cut into a size of, for example, 1 a+X 1 m during lamination molding. The cutting portion 2 is formed with a fall prevention member N3 for powder such as resin powder and base material powder. This fall prevention N
3 is formed at the cutting location after or before cutting. For example, in the case of a resin-impregnated base material having a size of 1×1 (to), the cut portion 2 is formed at the peripheral edge with a width of about 51 cm. The cut portion 2 is formed by, for example, melting the resin of the cut portion 2 by passing the resin-impregnated base material 1 through a pair of upper and lower hot air nozzles 4 after cutting, as shown in FIG. In this case, the hot air temperature is 120 to 250°C, the diameter of the hot air nozzle is 2 to 8 mm, and the distance between the TFI fat-impregnated base material 1 and the nozzle tip is about 5 to 20 mm. others,
A drop prevention layer 3 is formed on the cut portion 2 by applying an adhesive or pasting a heat-melting tape.
この切断部２に落下防止層３が形成された樹脂含浸基材
１は所要枚数が重ねられ、その両面又は片面に金属箔が
配置され、このものが−組みとして複数組み上下二枚の
進行するベルト間に挟まれ、例えば１０−３０ｋｇ／ｃ
ｍ”、１５０−１７０℃で加熱加圧され、いわゆるダブ
ルプレスにより連続成形されたつ、あるいは、熱盤間に
挟まれ、例えば１０〜３０ｋｇ／ｃｔｓ２．４０〜９０
ｍ ｉｎ、１５０〜１７０°Ｃで加熱加圧されて積層成
形され積層板が製造される。この場合、樹脂含浸基材１
からは粉末が落下しないだけでなく、得られた積層板に
は打痕が全く発生しない。The required number of resin-impregnated base materials 1 on which the fall prevention layer 3 is formed on the cut portion 2 are stacked, metal foil is placed on both sides or one side, and these are stacked in multiple sets, with the upper and lower two sheets being stacked. Sandwiched between belts, e.g. 10-30kg/c
m'', heated and pressurized at 150-170°C, continuously formed by so-called double press, or sandwiched between hot plates, e.g. 10-30 kg/cts2.40-90
min, heated and pressurized at 150 to 170°C to form a laminate to produce a laminate. In this case, resin-impregnated base material 1
Not only does the powder not fall from the plate, but the resulting laminate does not have any dents at all.
［発明の効果］
本発明の樹脂含浸基材にあっては、切断部に樹脂粉及び
基材粉等の粉末の落下防止層を設けているので、切断部
からの粉末の落下がなく、作業環。[Effects of the Invention] In the resin-impregnated base material of the present invention, a layer to prevent powders such as resin powder and base material powder from falling from the cut portion is provided, so powder does not fall from the cut portion, making work easier. ring.
境を悪化させることがないだけでなく、積層成形に際し
て打痕を発生させることがない。Not only does it not deteriorate the surface quality, but it also does not cause dents during lamination molding.
第１図は本発明の一実施例を示す平面図、第２図は同上
の落下防止層の形成を示す説明図であって、１は樹脂含
浸基材、２は切断部、３は落下防止層である。
代理人 弁理士 石 １）侵 七
第１図
第２図
乙FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram showing the formation of the fall prevention layer as described above, in which 1 is a resin-impregnated base material, 2 is a cut portion, and 3 is a fall prevention layer. It is a layer. Agent Patent Attorney Ishi 1) Invasion Figure 7 Figure 1 Figure 2 B
Claims (1)
成形に際して所定寸法に切断される樹脂含浸基材であっ
て、切断部に樹脂粉及び基材粉等の粉末の落下防止層を
設けて成ることを特徴とする樹脂含浸基材。(1) A resin-impregnated base material that is formed by impregnating a base material with resin and drying it, and is cut into predetermined dimensions during laminated molding, with a layer to prevent powders such as resin powder and base material powder from falling on the cut part. A resin-impregnated base material comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164979A JP2504963B2 (en) | 1986-07-14 | 1986-07-14 | Method for producing resin-impregnated base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164979A JP2504963B2 (en) | 1986-07-14 | 1986-07-14 | Method for producing resin-impregnated base material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6322299A true JPS6322299A (en) | 1988-01-29 |
| JP2504963B2 JP2504963B2 (en) | 1996-06-05 |
Family
ID=15803523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61164979A Expired - Lifetime JP2504963B2 (en) | 1986-07-14 | 1986-07-14 | Method for producing resin-impregnated base material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504963B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63158217A (en) * | 1986-12-22 | 1988-07-01 | Hitachi Chem Co Ltd | Manufacture of laminated sheet |
| EP1267189A1 (en) | 2001-06-12 | 2002-12-18 | Borealis Technology Oy | Optical cable with improved tracking resistance |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113527A (en) * | 1979-02-23 | 1980-09-02 | Matsushita Electric Works Ltd | Production of resin-impregnated blank material |
| JPS61211006A (en) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | Manufacture of laminated sheet |
-
1986
- 1986-07-14 JP JP61164979A patent/JP2504963B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113527A (en) * | 1979-02-23 | 1980-09-02 | Matsushita Electric Works Ltd | Production of resin-impregnated blank material |
| JPS61211006A (en) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | Manufacture of laminated sheet |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63158217A (en) * | 1986-12-22 | 1988-07-01 | Hitachi Chem Co Ltd | Manufacture of laminated sheet |
| JP2518237B2 (en) * | 1986-12-22 | 1996-07-24 | 日立化成工業株式会社 | Laminated board manufacturing method |
| EP1267189A1 (en) | 2001-06-12 | 2002-12-18 | Borealis Technology Oy | Optical cable with improved tracking resistance |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504963B2 (en) | 1996-06-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |