JPS63221094A - Method of mounting ic card - Google Patents
Method of mounting ic cardInfo
- Publication number
- JPS63221094A JPS63221094A JP62054377A JP5437787A JPS63221094A JP S63221094 A JPS63221094 A JP S63221094A JP 62054377 A JP62054377 A JP 62054377A JP 5437787 A JP5437787 A JP 5437787A JP S63221094 A JPS63221094 A JP S63221094A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- wire bonding
- card
- chip
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 7
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）発明の分野
この発明は、ＩＣカードにＩＣチップを実装するための
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of the Invention The present invention relates to a method for mounting an IC chip on an IC card.
（ロ）発明の背景
ＩＣカードにＩＣチップを実装する場合、従来は第４図
に示すように、ワイヤボンディング用電極２１と接点端
子２２とをポリイミドなどの樹脂ベースフィルム２３の
上下に形成し、ボンディングワイヤ２４を用いＩＣチッ
プ２５をボンディングし、その後樹脂２６でワイヤボン
ディング部分を封止し、樹脂ベースフィルム２３を挟み
こむ状態で表面カバーシート２７、コアシート２８、裏
面カバーシート２９を圧着している。(B) Background of the Invention When mounting an IC chip on an IC card, conventionally, as shown in FIG. 4, wire bonding electrodes 21 and contact terminals 22 are formed above and below a resin base film 23 made of polyimide or the like. An IC chip 25 is bonded using a bonding wire 24, and then the wire bonding part is sealed with a resin 26, and a front cover sheet 27, a core sheet 28, and a back cover sheet 29 are crimped with the resin base film 23 sandwiched therebetween. There is.
従って、ワイヤボンディング用電極２１と接点端子２２
とを樹脂ベースフィルム２３の上下面に形成するから、
この基板の形態は両面基板となり、ワイヤボンディング
の際、樹脂ベースフィルム２３が超音波エネルギを吸収
したり、熱伝導が悪くなって、ワイヤボンディング部分
の不良が発生し、その結果ワイヤボンディングの信頼性
が損われ、また歩留りの悪化が発生する問題点があった
。Therefore, the wire bonding electrode 21 and the contact terminal 22
are formed on the upper and lower surfaces of the resin base film 23,
The form of this board is a double-sided board, and during wire bonding, the resin base film 23 absorbs ultrasonic energy and heat conduction becomes poor, causing defects in the wire bonding area, resulting in poor wire bonding reliability. There were problems in that the performance was impaired and the yield was also deteriorated.
加えて、上記両面基板を表面カバーシート２７、コアシ
ート２８で挟みつけた際の樹脂ベースフィルム２３との
接着性の問題がある。つまり上記シート２７．２８が直
接樹脂ベースフィルム２３を挟まないので、ワイヤボン
ディング用電極２１や接点端子２２の導体箔とシート２
７．２８の樹脂との接着力が弱く、さらには両面基板の
採用がｌＣカードのコストアップを招く欠慮があった。In addition, there is a problem of adhesion with the resin base film 23 when the double-sided substrate is sandwiched between the surface cover sheet 27 and the core sheet 28. In other words, since the sheets 27 and 28 do not directly sandwich the resin base film 23, the conductor foil of the wire bonding electrode 21 and the contact terminal 22 and the sheet 2
7.28 had a weak adhesive strength with the resin, and furthermore, the use of a double-sided board increased the cost of the LC card.
（ハ）発明の目的
この発明は上記の点に鑑み、ワイヤボンディング用およ
び接点端子形成用の基板としてリードフレームを用いる
ＩＣチップ実装方法の提供を目的とする。(c) Purpose of the Invention In view of the above points, the present invention aims to provide an IC chip mounting method using a lead frame as a substrate for wire bonding and contact terminal formation.
（ニ）発明の構成
この発明は、リードフレーム上にＩＣチップをワイヤボ
ンディングすると共に、このリードフレームに接点端子
を形成し、このリードフレームをカバーシートの間に圧
着するＩＣカードの実装方法のであることを特徴とする
。(D) Structure of the Invention The present invention is an IC card mounting method in which an IC chip is wire-bonded onto a lead frame, contact terminals are formed on this lead frame, and this lead frame is crimped between a cover sheet. It is characterized by
（ホ）発明の作用
この発明によれば、ＩＣチップのワイヤボンディング用
および接点端子形成用としてリードフレームを用いるの
で、該リードフレームに対するワイヤボンディング時の
超音波エネルギが樹脂部分に吸収されたり、また熱伝導
の悪化が発生しない。(E) Effects of the Invention According to the present invention, since a lead frame is used for wire bonding of an IC chip and for forming contact terminals, ultrasonic energy during wire bonding to the lead frame is absorbed by the resin portion, and No deterioration of heat conduction occurs.
（へ）発明の効果
従って、この発明によれば、ワイヤボンディング部分の
不良が発生せず、信頼性が高まり、歩留りを向上できる
。(f) Effects of the Invention Therefore, according to the present invention, defects do not occur in the wire bonding portion, reliability is increased, and yield can be improved.
構成が簡単になり、作業効率が良い。The configuration is simple and the work efficiency is high.
リードフレームの採用によりＩＣカードを強固なものに
製作できる。By using a lead frame, IC cards can be manufactured to be strong.
リードフレームの採用により接点端子を厚くできるから
、該接点の摩耗によっても高い信頼性を維持できる、等
の利点を有する。Adoption of a lead frame allows the contact terminal to be made thicker, which has the advantage of maintaining high reliability even when the contact is worn out.
（ト）発明の実施例 以下、この発明の一実施例を図面を用いて説明する。(g) Examples of the invention An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明にかかる実装方法で製作されたＩＣカ
ードの要部断面を示し、金属製リードフレーム１にＩＣ
チップ２がボンディングワイヤ３を用いてボンディング
されている。FIG. 1 shows a cross section of the main part of an IC card manufactured by the mounting method according to the present invention, in which an IC card is mounted on a metal lead frame 1.
A chip 2 is bonded using a bonding wire 3.
このリードフレーム１は第２図および第３図に示すよう
に予め所定の形状にフォーミングされており、耳部４を
用いて多数個連結され、ワイヤボンディングがこれら多
数個のリードフレーム１に連続的もしくは同時的に行な
えるようにしている。As shown in FIGS. 2 and 3, this lead frame 1 has been formed into a predetermined shape in advance, and a large number of these lead frames 1 are connected using ears 4, and wire bonding is applied to these many lead frames 1 in a continuous manner. Or they can be done simultaneously.
上記した所定の形状とは第２図から明らかなようにＩＣ
チップ２のボンディング部１ａとその上面に形成された
ワイヤボンディング用電極５が水平なフレームとして存
し、その両側から斜め上方へ脚部フレーム１ｂが延び、
その上端を台形状に折曲して上面に接点端子６を形成し
たものである。As is clear from FIG. 2, the above-mentioned prescribed shape is an IC.
The bonding part 1a of the chip 2 and the wire bonding electrode 5 formed on the upper surface thereof exist as a horizontal frame, and leg frames 1b extend diagonally upward from both sides of the frame.
Its upper end is bent into a trapezoidal shape and a contact terminal 6 is formed on the upper surface.
しかし、このリードフレーム１のフォーミング１はＩＣ
チップ２のワイヤボンディング後に施こすものとしても
良い。However, the forming 1 of this lead frame 1 is
It may be applied after the wire bonding of the chip 2.
上記リードフレーム１のフォーミング、および該リード
フレーム１にボンディングワイヤ３を用いてＩＣチップ
２をワイヤボンディング後に、第３図の破線７で囲む部
分に樹脂８をエールドし、ＩＣチップ２のワイヤボンデ
ィング部分を封止してＩＣモジュールを製作し、次に切
断ライン９に従って該ＩＣモジュールを耳部４から切り
離なす。After forming the lead frame 1 and wire bonding the IC chip 2 to the lead frame 1 using the bonding wire 3, resin 8 is applied to the area surrounded by the broken line 7 in FIG. An IC module is manufactured by sealing the IC module, and then the IC module is separated from the ear part 4 along the cutting line 9.
そして第１図のようにカバーシート１０．１１間に挟ん
で圧着する。Then, as shown in FIG. 1, the cover sheets 10 and 11 are sandwiched and pressed together.
このような実装方法によれば、ワイヤボンディング用電
極５と接点端子６が共に金°属体であるリードフレーム
１上に形成され、樹脂層が存在しなくなるので、ワイヤ
ボンディング時に超音波エネルギが吸収されたり、熱伝
導が悪化することがなく、正確にワイヤボンディングを
施こすことがでせきる結果、高い信頼性が得られ、ボン
ディング不良によるＩＣカードの歩留りの低下をなくす
ることができる。According to this mounting method, both the wire bonding electrode 5 and the contact terminal 6 are formed on the lead frame 1 which is a metal body, and there is no resin layer, so ultrasonic energy is absorbed during wire bonding. As a result, wire bonding can be performed accurately without being damaged or heat conduction deteriorated, resulting in high reliability, and it is possible to eliminate a decrease in the yield of IC cards due to bonding defects.
リードフレーム１の採用により両面基板が必要とされず
、また従来の表面カバーシート、コアシート、裏面カバ
ーシートの如き多層シート構成が不要となるので、構造
が簡単で、ＩＣカード製造効率が良く、しかも安価に製
作できる。また、リードフレーム１が補強メンバーとし
て機能するから強度アップできる。Adoption of the lead frame 1 eliminates the need for a double-sided board, and also eliminates the need for a multilayer sheet structure such as the conventional front cover sheet, core sheet, and back cover sheet, resulting in a simple structure and high IC card manufacturing efficiency. Moreover, it can be manufactured at low cost. Further, since the lead frame 1 functions as a reinforcing member, the strength can be increased.
ざらに、リードフレーム１の肉厚選択により接点端子６
を厚くでき、接点寿命および信頼性が長く維持される。Roughly speaking, depending on the thickness of the lead frame 1, the contact terminal 6
The contact life and reliability can be maintained for a long time.
図面はこの発明の一実施例を示し、
第１図はこの発明にかかる実装方法で得られた■Ｃカー
ドの要部断面図、
第２図はリードフレーム部分の取出し図、第３図はリー
ドフレーム部分の平面図、第４図は従来方法で得られた
ＩＣカードの要部断面図である。
１・・・リードフレーム ２・・・ＩＣチップ３・・
・ボンディングワイＡ７
５・・・ワイヤボンディング用電極
６・・・接点端子
１０．１１・・・カバーシート
第１図The drawings show an embodiment of the present invention. Fig. 1 is a sectional view of the main part of the ■C card obtained by the mounting method according to the invention, Fig. 2 is an extracted view of the lead frame portion, and Fig. 3 is a view of the lead frame. FIG. 4 is a plan view of the frame portion and a sectional view of the main parts of an IC card obtained by a conventional method. 1...Lead frame 2...IC chip 3...
・Bonding wire A7 5...Wire bonding electrode 6...Contact terminal 10.11...Cover sheet Fig. 1
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62054377A JPS63221094A (en) | 1987-03-09 | 1987-03-09 | Method of mounting ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62054377A JPS63221094A (en) | 1987-03-09 | 1987-03-09 | Method of mounting ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63221094A true JPS63221094A (en) | 1988-09-14 |
Family
ID=12968986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62054377A Pending JPS63221094A (en) | 1987-03-09 | 1987-03-09 | Method of mounting ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63221094A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02261696A (en) * | 1989-03-31 | 1990-10-24 | Toppan Printing Co Ltd | Ic module |
| JPH0351196A (en) * | 1989-07-19 | 1991-03-05 | Ibiden Co Ltd | Printed wiring board for ic card |
-
1987
- 1987-03-09 JP JP62054377A patent/JPS63221094A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02261696A (en) * | 1989-03-31 | 1990-10-24 | Toppan Printing Co Ltd | Ic module |
| JPH0351196A (en) * | 1989-07-19 | 1991-03-05 | Ibiden Co Ltd | Printed wiring board for ic card |
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