JPS63214941A - Optical recording medium manufacturing method and manufacturing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing an optical recording medium.

[Summary of the invention]

The present invention provides a method for manufacturing an optical recording medium capable of recording, reproducing, or erasing, by not providing a manufacturing adhesive at least on the opposite side of the recording surface of the transparent resin substrate, so that the transparent resin substrate can be removed during film formation. This makes it possible to significantly reduce temperature rise and gas emissions.

[Conventional technology]

A conventional method for manufacturing an optical recording medium is to fix a plastic substrate 6 using a stainless steel substrate holder 4 and a substrate support 5 and perform sputtering, as shown in FIG.

However, since the base plate 4 supporting the substrate is made of metal, the jig absorbs heat when the heat rays are emitted from the sputtering target. There was a problem that Il,o> was released.Therefore, as a conventional means, the film was formed at a film forming rate such that the substrate temperature rise during film forming was 50°C or less.

[Problem that the invention seeks to solve]

However, since the above-mentioned mainstream placement on the substrate holder surface is very likely to raise the temperature, the substrate temperature increases each time the power input to the target is increased during sputtering. As a result, even if the power input to the target is increased, the amount of gas released from the plastic substrate will increase, and the deterioration of the deposited film will be extremely accelerated. Furthermore, if the power input to the target is reduced in order to suppress the temperature rise, the film formation rate becomes slow, which poses a serious problem in that it takes too much time when mass production is considered.

The present invention is intended to solve these problems, and its purpose is to reduce the rise in substrate temperature even if the growth rate is increased, and to reduce the amount of gas released as much as possible. In addition, the present invention provides a method for producing an optical recording medium that can be sputtered in a short time by sputtering 81 ml, that is, has good characteristics as an optical recording medium even when sputtering is performed by increasing the power input to the target, and that can be mass-produced. It's there.

[Means for solving problems]

The method for manufacturing an optical recording medium of the present invention is based on Hikari! The Li recording medium manufacturing jig is characterized in that no manufacturing jig exists at least on the opposite side of the temporary transparent resin lA recording surface.

〔Example〕

FIG. 1 is a cross-sectional view of a substrate setting jig in an embodiment of the present invention, where 1 is a stainless steel substrate; 1 is a tilde; the portion corresponding to the recording surface is a hollow; 2 is a substrate surface; This is for fixing 6 boards.

First, in advance, the upper sea urchin in Figure 1 is made of I) C (polycarbonate).
The fixed substrate 3 is set in the sputter Hn.

After evacuating the tank to lXl0-@Torr, sputtering is started. First layer) lk: Al5j
N film 4-electrode c t o o .

Furthermore, the second layer is NdDyF c as a magneto-optical recording layer.
Co T i B 400 people and Δl5 to 3 layers 1
1000 iN films were deposited one by one.

Here I) The problem with the CIA temporary temperature rise is 1.
This is when forming the Al5jN film at the layer opening. In other words, 2A
91st N d D y F c Co T i I!
Since gas release from the substrate must be suppressed as much as possible when forming the second layer, the temperature rise of the substrate during the first layer formation must be suppressed as much as possible. This is a graph showing the relationship between the substrate temperature increase during film deposition by 1000 people and the power applied to the target. Experiments were conducted on four cases in which the power applied during film formation was 0.5, 1, 2, and 3 people w.
At that time, a thermo label (temperature measurement paper) is placed on the plastic substrate.
Install it and see the difference. 7 is the conventional temperature la' change, and 8 is the temperature change of the present invention. From this change diagram,
It can be seen that even if the input power is increased to increase the film formation rate, the production jig of the present invention can prevent the substrate temperature from increasing by 1.

FIG. 4 is a graph in which the horizontal axis represents the knife plate temperature and the vertical axis represents the amount of gas released. This graph shows that the amount of gas released increases as the substrate temperature rises. Therefore, it is desirable to form a film while keeping the substrate temperature as low as possible.

By hollowing out a part of the stainless steel board holder, which is the jig of the present invention, on the side opposite to the surface of the PC board,
The heat rays radiated in the vacuum chamber during film formation can pass through I) Ci&temporary. In other words, even if the input power is increased during sputtering, the temperature does not rise, so the original characteristics of the magneto-optical recording medium can be maintained.

The s2 sending method of the present invention is low temperature! Since the film can be formed with just one layer, the magneto-optical recording film is less susceptible to oxidation, resulting in a magneto-optical recording medium that is superior to conventional ones. It is possible to reduce costs.

〔Effect of the invention〕

As described above, according to the present invention, by hollowing out at least the substrate boulder on the side opposite to the recording surface of the plastic substrate, the temperature of the plastic substrate can be kept low even when the immersion power is increased during film formation, and the amount of gas released is This has the effect of increasing the production capacity by shortening the sputtering time and greatly reducing the equipment amortization cost.

In this example, polycarbonate was used for the transparent resin substrate, but the present invention is also effective for other materials such as I) MMA, epoxy resin, vinyl chloride resin, polymethylpentene, and even glass substrates. Any material that can be penetrated by heat rays emitted during film formation is effective. Further, although the sputtering method was used for the rL dry film formation method, it goes without saying that the present invention is effective for all vacuum film formation methods such as the vapor deposition method.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a board setting jig in an embodiment of the present invention. FIG. 2 is a sectional view of a substrate setting jig in a conventional optical recording medium manufacturing method. FIG. 3 is a diagram showing the relationship between the substrate temperature rise of the first layer Al5iN dielectric film and the target official power when compared to 1000 people. FIG. 4 is a change diagram in which the horizontal axis represents the substrate temperature and the vertical axis represents the gas release rate. 1...Substrate holder 2...Substrate support 3...I) C (polycarbonate) IA provisional 4...Substrate holder 5...Substrate support 6...I)C (polycarbonate) board 7...・Conventional temperature change 8...Temperature change of the present invention 14 people Representative of Seiko Epson Co., Ltd. Patent attorney Tsutomu Mogami and 1 other person I and 1 year old, 23 years old, Pcc 1 year old, 23 years old, Pcc

Claims (1)

[Claims] In a manufacturing jig for an optical recording medium that uses a transparent resin substrate and performs recording, reproduction, or erasing by irradiating light, the manufacturing jig does not exist at least on the opposite side of the recording surface of the transparent resin substrate. A method for manufacturing an optical recording medium characterized by: