JP2569535B2 - Method and apparatus for manufacturing optical recording medium - Google Patents

Description

The present invention relates to a method and an apparatus for manufacturing an optical recording medium.

[Summary of the Invention]

The present invention relates to a method for manufacturing an optical recording medium capable of recording / reproducing or erasing, wherein a heat ray radiated when forming a film on a side to be a recording surface of a transparent resin substrate is directed to a side opposite to a recording surface of the transparent resin substrate. By allowing the light to pass therethrough, the temperature rise and outgassing of the transparent resin substrate during film formation can be significantly reduced.

[Conventional technology]

The conventional method of manufacturing an optical recording medium is a method of fixing a plastic substrate 6 by a stainless steel substrate holder 4 and a substrate holder 5 as shown in FIG.

However, since the jig 4 supporting the substrate is made of metal, the jig absorbs heat when radiating heat rays from the target by sputtering. That is, there is a problem that the substrate releases gas (O ₂ , H ₂ O) due to the influence. Therefore, as a conventional means, the film is formed at a film formation rate at which the temperature rise of the substrate during the film formation becomes 50 ° C. or less.

[Problems to be solved by the invention]

However, since the temperature of the above-described main placement on the substrate holder surface is very easy to increase, the substrate temperature increases each time the power supplied to the target is increased during sputtering. As a result, as the power applied to the target is increased, the amount of gas released from the plastic substrate increases, and the deterioration of the formed film is extremely accelerated.
In addition, when the power supplied to the target is reduced to suppress the temperature rise, the film forming speed becomes slow, and there is a serious problem that it takes too much time in consideration of mass production.

Therefore, the present invention solves such a problem,
The purpose is to increase the substrate temperature even if the film forming speed is increased, and to reduce the amount of gas release as much as possible. In addition, a method for manufacturing an optical recording medium which requires a short sputtering time, that is, maintains good characteristics as an optical recording medium even when sputtered by increasing the power applied to a target and can be mass-produced, and a method for manufacturing the same The present invention provides a manufacturing apparatus used for:

[Means for solving the problem]

The present invention is such that the transparent resin substrate is fixed to a substrate setting jig such that both surfaces thereof are exposed, so that heat rays radiated by sputtering or vapor deposition can be transmitted through the transparent resin substrate, and sputtering or vapor deposition is performed. A thin film is formed on the transparent resin substrate.

In addition, it has a substrate holder for fixing the transparent resin substrate,
In an optical recording medium manufacturing apparatus for manufacturing an optical recording medium by forming a thin film on a side to be a recording surface of the transparent resin substrate, the substrate holder is at least the opposite side of the transparent resin substrate on the side opposite to the recording surface. It is characterized in that the portion corresponding to the recording surface is hollowed out.

〔Example〕

FIG. 1 is a cross-sectional view of a substrate setting jig according to an embodiment of the present invention. Reference numeral 1 denotes a stainless steel substrate holder, and a portion corresponding to a recording surface is hollowed out. Reference numeral 2 denotes a substrate holder for fixing the substrate.

First, a PC (polycarbonate) substrate 3 previously fixed as shown in FIG. 1 is set in a sputtering apparatus. Then, the chamber is evacuated to 1 × 10 ⁻⁶ Torr and then sputtering is started. The first layer is an AlSiN dielectric film of 1000Å,
Further, an NdDyFeCoTi film 400Å is used as a magneto-optical recording layer as a second layer.
Then, an AlSiN film 1000Å is sequentially formed as a third layer.

Here, the temperature rise of the PC board poses a problem.
This is when the AlSiN film is formed. In other words, the second layer of NdDyFeC
Since the outgassing from the substrate must be suppressed as much as possible when forming the oTi film, the temperature rise of the substrate during the formation of the first layer must be suppressed as much as possible. FIG. 3 shows the first AlSiN dielectric film. Is a graph showing the relationship between the substrate temperature rise and the power input to the target during the film deposition at 1000 °. The power to be applied during film formation is 0,5,
Experiment with 1, 2, 3 kw and 4 cases. At that time, attach a thermo label (temperature measurement paper) to the plastic substrate and see the difference. 7 is the conventional temperature change, and 8 is the temperature change of the present invention. From this change diagram, it can be seen that even if the input power is increased to increase the film forming speed, the manufacturing jig of the present invention can prevent the substrate temperature from increasing.

FIG. 4 is a graph in which the horizontal axis represents the substrate temperature and the vertical axis represents the gas release amount. From this graph, it can be seen that the gas release amount increases as the substrate temperature increases. Therefore, it is desired to form a film while keeping the substrate temperature as low as possible.

The jig of the present invention, by hollowing out the stainless steel substrate holder part on the opposite side to the recording surface of the PC substrate,
Heat rays radiated in the vacuum chamber during film formation can pass through the PC substrate. That is, since the temperature does not increase even if the input power at the time of sputtering is increased, the original characteristics of the magneto-optical recording medium can be secured.

The manufacturing method of the present invention is capable of forming a film while maintaining a low temperature, making it difficult for the magneto-optical recording film to be oxidized, obtaining a magneto-optical recording medium superior to the conventional one, and increasing the input power. The film time can be shortened and the cost can be reduced.

〔The invention's effect〕

As described above, according to the present invention, a film is formed by mounting a transparent resin substrate such as a plastic substrate on a substrate holder in which at least a portion corresponding to a recording surface opposite to a recording surface of the transparent resin substrate is hollowed out. Thereby, the heat rays radiated at the time of film formation pass through the transparent resin substrate, and even if the film formation speed is increased by a sputtering method or a vapor deposition method, the temperature rise of the transparent resin substrate during the film formation can be prevented. Therefore, the amount of gas released during film formation can be suppressed, and deterioration of the formed film can be prevented. Therefore, an optical recording medium of excellent quality can be provided in a short time and at low cost. Further, according to the present invention, since the temperature of the plastic substrate can be kept low and the amount of outgassing can be suppressed even if the input power at the time of film formation is increased, the capacity of the number of sheets to be produced can be improved by shortening the film formation time, and the depreciation cost of the apparatus accompanying it. Has the effect of a significant down.

In this example, polycarbonate was used for the transparent resin substrate, but in addition to these, PMMA, epoxy resin, vinyl chloride resin, polymethylpentene, etc., and even the glass substrate, the present invention is effective. Any substance that can transmit the heat rays to be applied is effective. Although the sputtering method is used for the vacuum film forming method, it goes without saying that the present invention is effective for all vacuum film forming methods such as the vapor deposition method.

[Brief description of the drawings]

FIG. 1 is a sectional view of a jig for setting a substrate according to an embodiment of the present invention. FIG. 2 is a sectional view of a jig for setting a substrate in a conventional method for manufacturing an optical recording medium. FIG. 3 is a diagram showing the relationship between the substrate temperature rise and the power input to the target when the first AlSiN dielectric film is formed at 1000 °. FIG. 4 is a change diagram in which the horizontal axis represents the substrate temperature and the vertical axis represents the gas release amount. DESCRIPTION OF SYMBOLS 1 ... Substrate holder 2 ... Substrate cover 3 ... PC (polycarbonate) substrate 4 ... Substrate holder 5 ... Substrate cover 6 ... PC (polycarbonate) substrate 7 ... Conventional temperature change 8 ... Temperature of the present invention change

Claims (2)

(57) [Claims] The transparent resin substrate is fixed to a jig for exposing both sides of the transparent resin substrate so that heat rays radiated by sputtering or vapor deposition can pass through the transparent resin substrate. Forming a thin film on the transparent resin substrate by the method described above. 2. An optical recording medium manufacturing apparatus, comprising: a substrate holder for fixing a transparent resin substrate; and forming an optical recording medium by forming a thin film on a recording surface side of the transparent resin substrate. The apparatus for manufacturing an optical recording medium, wherein the holder has at least a portion corresponding to the recording surface on the side opposite to the recording surface of the transparent resin substrate, which is hollowed out.