JPS63202922A - Cleaner for semiconductor wafer - Google Patents

Abstract

PURPOSE:To prevent re-adhesion to the surface of an opposed wafer of dust, and to obviate the lowering of yield by removing dust adhering on the rear of the wafer by using changes into water and carbon dioxide of an organic compound due to the oxidative effect of O3. CONSTITUTION:A wafer to be treated 1 is carried to a wafer susceptor 4 in a cleaning chamber 6, and O3 is discharged from O3 discharge openings 3 formed to an O3 discharge nozzle 2 for an O3 discharger toward the rear of the wafer from the lower section of the wafer 1 and the rear of the wafer is washed. The surface of the wafer 1 is protected by a purge gas blown off from a purging nozzle 5, and an atmosphere in the cleaning chamber 6 is discharged from an exhaust opening 7; the wafer from which dust adhering on the rear is removed is forwarded to the next process. Accordingly, adhesion to the surface of the opposed wafer of dust on the rear in a wet process is prevented, thus improving yield.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device manufacturing apparatus, and particularly to a cleaning apparatus for cleaning the back surface of a semiconductor substrate.

[Conventional technology]

Conventionally, when cleaning semiconductor substrates (hereinafter referred to as wafers) after processing such as etching in the semiconductor device manufacturing process, dust adhering to the backside of the wafers is almost ignored.
The reality was that no countermeasures were taken.

[Problem that the invention seeks to solve]

In the conventional semiconductor device manufacturing process mentioned above, removing dust attached to the back side of the wafer was ignored, so during wet processes such as cleaning and cleaning, the dust attached to the back side of the wafer was removed by liquid. It is released into the interior of the wafer, and then re-adhered to the surface of the opposing wafer, causing a decrease in yield.

[Failure to solve the problem]

The wafer backside cleaning device of the present invention is equipped with an 03 discharge device that sprays 03 onto the wafer backside in order to remove dust attached to the wafer backside. It removes compounds by converting them into water and carbon dioxide.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention.

In FIG. 1, a wafer 1 to be processed is transferred to a wafer support 4 in a cleaning chamber 6, and then a 03 discharge nozzle 2 of an 03 discharge device is installed in a direction from the bottom of the wafer 1 toward the back surface of the wafer. From the discharge port 3, 03 is discharged and cleaned. The surface of the wafer 1 is protected from damage by the purge gas blown out from the purge nozzle 5. The atmosphere inside the cleaning chamber 6 is exhausted from the exhaust lower. As above,
The wafer from which the dust adhering to the back surface has been removed is sent to the next process.

〔Effect of the invention〕

As explained above, the wafer cleaning apparatus of the present invention has the effect of removing dust from the backside of the wafer, preventing the backside dust from adhering to the surface of the facing wafer during the wet process, and improving the yield. be.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention. 3...03 discharge port, 4...wafer support stand, bottom...purge nozzle, 6...cleaning chamber.

Claims (1)

[Claims] A semiconductor substrate cleaning apparatus comprising: a semiconductor substrate support that supports a semiconductor substrate to be cleaned in a cleaning chamber; and an O_3 discharge device that discharges O_3 onto the back surface of the semiconductor substrate supported by the substrate support.