JPS63199691A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS63199691A JPS63199691A JP62030657A JP3065787A JPS63199691A JP S63199691 A JPS63199691 A JP S63199691A JP 62030657 A JP62030657 A JP 62030657A JP 3065787 A JP3065787 A JP 3065787A JP S63199691 A JPS63199691 A JP S63199691A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- card
- metal film
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000010408 film Substances 0.000 description 14
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、カード本体のくぼみ部にＩＣチップを埋め込
んだＩＣカードに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card in which an IC chip is embedded in a recessed portion of a card body.
従来、ＩＣカードとしては、貫通孔が設けられた１枚の
塩化ビニール基板と貫通孔が設けられない他の１枚の塩
化ビニール基板とを熱溶着して一体とし、このようにし
て得られたカード本体の貫通孔によるくぼみ部に、接着
剤により、ＩＣチップを埋め込むようにしたものが知ら
れている。Conventionally, IC cards have been obtained by thermally welding one vinyl chloride substrate with through holes and another vinyl chloride substrate without through holes into one piece. It is known that an IC chip is embedded in a recess formed by a through hole in a card body using an adhesive.
ところで、かかるＩＣカードにおいては、ＩＣチップは
ガラスエポキシからなり、接着剤としては二液性のエポ
キシ系接着剤が用いられているが、この接着剤では、塩
化ビニール基板とガラスエポキシのＩＣチップとの接着
性は充分ではない。このために、ＩＳＯの曲げ試験を行
なうと、ＩＣチップの角部ではがれが生じたり、脱落し
たりするし、また、基板表面に接着されたオーバレイな
どに白化したすしを生じさせることになる。By the way, in such an IC card, the IC chip is made of glass epoxy, and a two-component epoxy adhesive is used as the adhesive. Adhesion is not sufficient. For this reason, when an ISO bending test is performed, the IC chip peels off or falls off at the corners, and whitening occurs on the overlay bonded to the substrate surface.
現状では、塩化ビニール基板とＩＣチップとの充分な接
着性が得られるような接着剤はみあたらず、上記のよう
な問題を避けることができなかった。At present, no adhesive has been found that can provide sufficient adhesion between a vinyl chloride substrate and an IC chip, making it impossible to avoid the above-mentioned problems.
本発明の目的は、かかる問題点を解消し、従来の接着剤
を用いて基板とＩＣチップとの接着性を高めることがで
きるようにしたＩＣチップを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an IC chip that solves these problems and can improve the adhesiveness between a substrate and an IC chip using a conventional adhesive.
上記目的を達成するために、本発明は、カード本体のく
ぼみ部内の底部に金属膜を設け、該金属膜にＩＣチップ
が接着するようにして、該ＩＣチップを該くぼみ部内に
埋め込むようにしたものである。In order to achieve the above object, the present invention provides a metal film at the bottom of the recess of the card body, and the IC chip is embedded in the recess by adhering the IC chip to the metal film. It is something.
Ｃ実施例〕 以下、本発明の実施例を図面によって説明する。C Example] Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明によるＩＣカードの一実施例を示す要部
断面図であって、１．２は基板、３はＩＣチップ、４は
金属膜、５は接着剤、６はくぼみ部である。FIG. 1 is a sectional view of essential parts of an embodiment of an IC card according to the present invention, in which 1.2 is a substrate, 3 is an IC chip, 4 is a metal film, 5 is an adhesive, and 6 is a recessed portion. .
同図において、塩化ビニールからなる基板１゜２は熱溶
着され、一体となってカード本体を形成している。この
カード本体には、基板１に貫通孔が設けられていること
により、くぼみ部６が設けられ、このくぼみ部６の底部
全体を覆うように、厚さ２０〜２５μｍのＡＩ、Ｃｕあ
るいはＦｅなどからなる金属膜４が設けられている。こ
のくぼみ部６内に、エポキシ系の接着剤５により、ガラ
スエポキシからなるＩＣチップ３が埋め込まれている。In the figure, substrates 1 and 2 made of vinyl chloride are thermally welded together to form a card body. This card body is provided with a recessed part 6 by providing a through hole in the substrate 1, and a material such as AI, Cu or Fe having a thickness of 20 to 25 μm is formed so as to cover the entire bottom of this recessed part 6. A metal film 4 made of is provided. An IC chip 3 made of glass epoxy is embedded in this recess 6 using an epoxy adhesive 5.
金属膜４はくぼみ部６の断面積よりも広く、基板１．２
を熱溶着する際に、これら基板１．２によって挟み込ま
れる。これにより、金属膜４はくぼみ部６の底部に堅固
に取りつけられている。The metal film 4 is wider than the cross-sectional area of the recessed part 6, and
When thermally welding the substrates 1.2, they are sandwiched between the substrates 1.2. Thereby, the metal film 4 is firmly attached to the bottom of the recess 6.
従来のＩＣカードにおいては、この実施例のように金属
膜４を設けずにくぼみ部６内にＩＣチップ３を埋め込ん
でいたが、ＩＣチップ６と基板２との接着強度（剥離強
度）は２〜５ ｋｇ／ ２５ ｍｍ程度であったが、こ
の実施例では、ＩＣチップ３と金属膜４とが接着するも
のであり、その接着強度は２０〜３０ｋｇ／２５ｍと従
来のＩＣカードの１０倍程度となり、カード本体とＩＣ
チップとの接着性が大幅に向上したことになる。In the conventional IC card, the IC chip 3 is embedded in the recess 6 without providing the metal film 4 as in this embodiment, but the adhesive strength (peel strength) between the IC chip 6 and the substrate 2 is 2. ~5 kg/25 mm, but in this example, the IC chip 3 and the metal film 4 are bonded, and the adhesive strength is 20~30 kg/25 m, which is about 10 times that of conventional IC cards. Then, the card body and IC
This means that the adhesion to the chip has been significantly improved.
これにより、ＩＳＯ規格に定められた曲げ試験などで外
力が加わっても、ＩＣカードの剥離や脱落などがなくな
り、ＩＣカードの信顛性が大幅に高まることになる。This prevents the IC card from peeling or falling off even when external forces are applied during bending tests stipulated by ISO standards, greatly increasing the reliability of the IC card.
第２図は第１図に示した実施例の製造方法を示す説明図
である。FIG. 2 is an explanatory diagram showing a manufacturing method of the embodiment shown in FIG. 1.
同図において、基板２と貫通孔７を有する基板１とを金
属膜４を挾んで重ね合わせ、両者を熱溶着して一体化す
る。このとき、金属膜４は貫通孔７全体をふさぐように
する。これにより、金属膜４の周囲全体が基板１．２に
よって挟み込まれる。In the figure, a substrate 2 and a substrate 1 having a through hole 7 are stacked on top of each other with a metal film 4 in between, and the two are thermally welded to be integrated. At this time, the metal film 4 is made to cover the entire through hole 7. As a result, the entire periphery of the metal film 4 is sandwiched between the substrates 1.2.
次に、貫通孔７と基板２の表面とで形成された第１図の
くぼみ部６内にＩＣチップ３を取り付け、接着剤を流し
込んでＩＣチップ３を埋め込む。ＩＣチップ３はくぼみ
部６の底部にある金属膜に接着される。Next, the IC chip 3 is attached to the recess 6 in FIG. 1 formed by the through hole 7 and the surface of the substrate 2, and an adhesive is poured to embed the IC chip 3. The IC chip 3 is bonded to the metal film at the bottom of the recess 6.
なお、上記実施例では、金属膜４としては、金属蒸着フ
ィルムを用いてもよいが、この金属蒸着フィルムをテー
プに貼付けし、あるいはテープに金属を蒸着して用いて
もよい。In the above embodiment, a metallized film may be used as the metal film 4, but this metallized film may also be attached to a tape, or a metal may be vapor-deposited onto the tape.
以上説明したように、本発明によると、カード本体とＩ
Ｃチップとの接着強度が大幅に高まり、外力に対してＩ
Ｃチップの剥離、脱落などが防止できて、高倍転性のＩ
Ｃカードを提供することができる。As explained above, according to the present invention, the card body and the
The adhesive strength with the C chip has been significantly increased, and I
C-chip can be prevented from peeling off or falling off, and has high conversion characteristics.
A C card can be provided.
第１図は本発明によるＩＣカードの一実施例を示す要部
断面図、第２図は第１図に示した実施例の製造方法を示
す説明図である。
１．２・−−一−−−・基板、３・−・−ＩＣチップ、
４・−−−−−−一金属膜、５・−・−・・・接着剤、
６−・・−くぼみ部、７−・−・−貫通孔。FIG. 1 is a sectional view of a main part showing an embodiment of an IC card according to the present invention, and FIG. 2 is an explanatory diagram showing a method of manufacturing the embodiment shown in FIG. 1.2・---1---・Substrate, 3・---IC chip,
4.-----metal film, 5.--adhesive,
6-- recessed portion, 7-- through hole.
Claims (2)
埋め込むようにしたＩＣカードにおいて、該くぼみ部の
底部に金属膜を設けたことを特徴とするＩＣカード。(1) An IC card in which an IC chip is embedded in a recessed portion of a card body using adhesive, characterized in that a metal film is provided at the bottom of the recessed portion.
通孔を有しない第２の基板とが接着されてなって、前記
くぼみ部は該貫通孔と該第２の基板の表面とからなり、
前記金属膜は該貫通孔の断面積よりも広く、かつ該第１
、第２の基板によって挟持されていることを特徴とする
特許請求の範囲第（１）項記載のＩＣカード。(2) The card body is formed by adhering a first substrate having a through hole and a second substrate having no through hole, and the recessed portion is separated from the through hole and the surface of the second substrate. Become,
The metal film is wider than the cross-sectional area of the through hole, and
, an IC card according to claim 1, wherein the IC card is sandwiched between two substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62030657A JPS63199691A (en) | 1987-02-14 | 1987-02-14 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62030657A JPS63199691A (en) | 1987-02-14 | 1987-02-14 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63199691A true JPS63199691A (en) | 1988-08-18 |
Family
ID=12309837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62030657A Pending JPS63199691A (en) | 1987-02-14 | 1987-02-14 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63199691A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6222871B2 (en) * | 1978-04-17 | 1987-05-20 | Tetra Pak Dev | |
| JPS63176197A (en) * | 1987-01-16 | 1988-07-20 | 株式会社東芝 | Portable memory medium |
-
1987
- 1987-02-14 JP JP62030657A patent/JPS63199691A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6222871B2 (en) * | 1978-04-17 | 1987-05-20 | Tetra Pak Dev | |
| JPS63176197A (en) * | 1987-01-16 | 1988-07-20 | 株式会社東芝 | Portable memory medium |
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