JPS63182529U - - Google Patents
Info
- Publication number
- JPS63182529U JPS63182529U JP7406687U JP7406687U JPS63182529U JP S63182529 U JPS63182529 U JP S63182529U JP 7406687 U JP7406687 U JP 7406687U JP 7406687 U JP7406687 U JP 7406687U JP S63182529 U JPS63182529 U JP S63182529U
- Authority
- JP
- Japan
- Prior art keywords
- mesh
- brazing material
- shaped
- brazing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例のメツシユ状ろう材
の部分拡大上面図である。第２図は第１図に示し
た一実施例のろう材を用いてのろう層被着工程を
示す斜視図で、第２図ａは放熱板にろう材を載せ
たところを示し、第２図ｂはろう層で被覆された
放熱板に半導体エレメントを載せるところを示す
。第３図は従来の板状ろう材を用いてのろう層被
着工程を示す斜視図で、第３図ａは放熱板にろう
材を載せたところを示し、第３図ｂはろう層で被
覆された放熱板に半導体エレメントを載せるとこ
ろを示す。１……放熱板、４……半導体エレメン
ト、１０……メツシユ状ろう材、１１……ろう層
、１２……線状ろう材。
FIG. 1 is a partially enlarged top view of a mesh-shaped brazing filler metal according to an embodiment of the present invention. FIG. 2 is a perspective view showing the process of applying a brazing layer using the brazing material of the embodiment shown in FIG. 1, and FIG. Figure b shows the mounting of a semiconductor element on a heat sink coated with a solder layer. Figure 3 is a perspective view showing the process of applying a brazing layer using a conventional plate-shaped brazing material. A semiconductor element is shown being placed on a coated heat sink. DESCRIPTION OF SYMBOLS 1... Heat sink, 4... Semiconductor element, 10... Mesh-shaped brazing filler metal, 11... Brazing layer, 12... Linear brazing filler metal.
Claims (1)
表面をろう層にて被覆するために用いられるもの
において、線状のろう材がメツシユ状にあまれた
ものであることを特徴とするメツシユ状ろう材。 A mesh-shaped brazing material used to cover at least one surface of members to be brazed to each other with a brazing layer, characterized in that the wire-shaped brazing material is formed into a mesh shape. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7406687U JPS63182529U (en) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7406687U JPS63182529U (en) | 1987-05-18 | 1987-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182529U true JPS63182529U (en) | 1988-11-24 |
Family
ID=30918950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7406687U Pending JPS63182529U (en) | 1987-05-18 | 1987-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182529U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020006653A (en) * | 2018-07-12 | 2020-01-16 | 日産自動車株式会社 | Joining method and joined body |
-
1987
- 1987-05-18 JP JP7406687U patent/JPS63182529U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020006653A (en) * | 2018-07-12 | 2020-01-16 | 日産自動車株式会社 | Joining method and joined body |