JPH0258393U - - Google Patents
Info
- Publication number
- JPH0258393U JPH0258393U JP1988136788U JP13678888U JPH0258393U JP H0258393 U JPH0258393 U JP H0258393U JP 1988136788 U JP1988136788 U JP 1988136788U JP 13678888 U JP13678888 U JP 13678888U JP H0258393 U JPH0258393 U JP H0258393U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation electrode
- pad
- soldered
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図および第２図はそれぞれ本考案による放
熱電極の半田付け構造の一実施例を示す平面図お
よび第１図のＡ―Ａ断面図、第３図および第４図
はそれぞれ本考案の他の実施例を示す平面図およ
び第３図のＢ―Ｂ断面図、第５図および第６図は
それぞれ従来構造を示す平面図および断面図であ
る。
1 and 2 are a plan view and a cross-sectional view taken along the line AA in FIG. 1, respectively, showing an embodiment of the soldering structure of a heat dissipation electrode according to the present invention, and FIGS. A plan view and a sectional view taken along line BB in FIG. 3, and FIGS. 5 and 6 are respectively a plan view and a sectional view showing a conventional structure.
Claims (1)
属基板上に形成されたパツドに半田付けする構造
において、パツドの面積を放熱電極の２０％〜７
０％としたことを特徴とする放熱電極の半田付け
構造。 ２ 電子部品の底面に設けられた放熱電極を、金
属基板上に形成されたパツドに半田付けする構造
において、パツドを複数個に分割し、各パツドの
面積を放熱電極の１０％〜４０％とし、各パツド
に放熱電極の両側を半田付けしたことを特徴とす
る放熱電極の半田付け構造。[Claims for Utility Model Registration] 1. In a structure in which a heat dissipation electrode provided on the bottom of an electronic component is soldered to a pad formed on a metal substrate, the area of the pad is 20% to 7% of the heat dissipation electrode.
A soldering structure of a heat dissipation electrode characterized by a soldering temperature of 0%. 2. In a structure in which a heat dissipation electrode provided on the bottom of an electronic component is soldered to a pad formed on a metal substrate, the pad is divided into multiple pieces and each pad has an area of 10% to 40% of the heat dissipation electrode. , a heat dissipation electrode soldering structure characterized in that both sides of the heat dissipation electrode are soldered to each pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136788U JPH0258393U (en) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136788U JPH0258393U (en) | 1988-10-19 | 1988-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258393U true JPH0258393U (en) | 1990-04-26 |
Family
ID=31397622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988136788U Pending JPH0258393U (en) | 1988-10-19 | 1988-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258393U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016025228A (en) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | Circuit structure |
| JP2016122679A (en) * | 2014-12-24 | 2016-07-07 | 株式会社オートネットワーク技術研究所 | Circuit structure and manufacturing method thereof |
-
1988
- 1988-10-19 JP JP1988136788U patent/JPH0258393U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016025228A (en) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | Circuit structure |
| JP2016122679A (en) * | 2014-12-24 | 2016-07-07 | 株式会社オートネットワーク技術研究所 | Circuit structure and manufacturing method thereof |
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