JPS63180953U - - Google Patents
Info
- Publication number
- JPS63180953U JPS63180953U JP1987071846U JP7184687U JPS63180953U JP S63180953 U JPS63180953 U JP S63180953U JP 1987071846 U JP1987071846 U JP 1987071846U JP 7184687 U JP7184687 U JP 7184687U JP S63180953 U JPS63180953 U JP S63180953U
- Authority
- JP
- Japan
- Prior art keywords
- resistant resin
- semiconductor device
- moisture
- filled
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は本考案の一実施例を示す半導体装置の
平面図、第２図は第１図のＡ―Ａ′断面図、第３
図は第１図のＢ―Ｂ′断面図である。
２……シリコン素子（半導体素子）、３……プ
リズムウエハ（プリズム）、７……穴部、８……
耐湿性樹脂。
FIG. 1 is a plan view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A' in FIG.
The figure is a sectional view taken along line BB' in FIG. 2... Silicon element (semiconductor element), 3... Prism wafer (prism), 7... Hole, 8...
Moisture resistant resin.
Claims (1)
部に穿設された穴部へ耐湿性樹脂を充填したこと
を特徴とする半導体装置の封止構造。 A sealing structure for a semiconductor device, characterized in that a hole formed in a part of a prism formed to cover a semiconductor element is filled with a moisture-resistant resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071846U JPH0648884Y2 (en) | 1987-05-14 | 1987-05-14 | Semiconductor device sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071846U JPH0648884Y2 (en) | 1987-05-14 | 1987-05-14 | Semiconductor device sealing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63180953U true JPS63180953U (en) | 1988-11-22 |
| JPH0648884Y2 JPH0648884Y2 (en) | 1994-12-12 |
Family
ID=30914769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987071846U Expired - Lifetime JPH0648884Y2 (en) | 1987-05-14 | 1987-05-14 | Semiconductor device sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648884Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121285A (en) * | 1981-01-20 | 1982-07-28 | Fujitsu General Ltd | Light coupling device |
-
1987
- 1987-05-14 JP JP1987071846U patent/JPH0648884Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121285A (en) * | 1981-01-20 | 1982-07-28 | Fujitsu General Ltd | Light coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648884Y2 (en) | 1994-12-12 |