JPH024247U - - Google Patents
Info
- Publication number
- JPH024247U JPH024247U JP8180688U JP8180688U JPH024247U JP H024247 U JPH024247 U JP H024247U JP 8180688 U JP8180688 U JP 8180688U JP 8180688 U JP8180688 U JP 8180688U JP H024247 U JPH024247 U JP H024247U
- Authority
- JP
- Japan
- Prior art keywords
- package
- resin layer
- utility
- semiconductor device
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例の断面図である。
１……捺印面、２……薄い樹脂層、３……パツ
ケージ本体、４……端子、５……捺印面、６……
パツケージ、７……端子。
FIG. 1 is a sectional view of an embodiment of the present invention. 1... Stamp surface, 2... Thin resin layer, 3... Package body, 4... Terminal, 5... Stamp surface, 6...
Package cage, 7...terminal.
Claims (1)
徴とする半導体装置。 A semiconductor device characterized by a structure having a thin resin layer on the surface of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180688U JPH024247U (en) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180688U JPH024247U (en) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024247U true JPH024247U (en) | 1990-01-11 |
Family
ID=31306576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8180688U Pending JPH024247U (en) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024247U (en) |
-
1988
- 1988-06-20 JP JP8180688U patent/JPH024247U/ja active Pending