JPS63179335U - - Google Patents
Info
- Publication number
- JPS63179335U JPS63179335U JP7201587U JP7201587U JPS63179335U JP S63179335 U JPS63179335 U JP S63179335U JP 7201587 U JP7201587 U JP 7201587U JP 7201587 U JP7201587 U JP 7201587U JP S63179335 U JPS63179335 U JP S63179335U
- Authority
- JP
- Japan
- Prior art keywords
- joint plate
- stile
- column
- upper stile
- engaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
第１図はこの考案の一実施例の分解斜視図、第
２図はその取付時の断側面図、第３図は従来例の
取付状態を下方から見た斜視図、第４図はその断
側面図、第５図はその下面図である。
１…支柱、２…ジヨイントプレート、３…上框
、４…係着部、６…固着手段、７…化粧カバー、
８…被係着部。
Fig. 1 is an exploded perspective view of one embodiment of this invention, Fig. 2 is a sectional side view of the device when it is installed, Fig. 3 is a perspective view of the conventional example as seen from below, and Fig. 4 is its cross section. A side view, and FIG. 5 is a bottom view thereof. DESCRIPTION OF SYMBOLS 1... Post, 2... Joint plate, 3... Upper stile, 4... Engagement part, 6... Fixing means, 7... Decorative cover,
8... Attached part.
Claims (1)
、このジヨイントプレートを上面に沿わせて一端
部を前記柱と略接触させかつ上面に係着部を有す
る上框と、前記ジヨイントプレートと上框とを固
着した固着手段と、前記ジヨイントプレートを覆
い前記上框の上面に沿つて配置されかつ前記上框
の前記係着部と係着した被係着部を有する化粧カ
バーとを備えたバルコニー上框取付構造。 a joint plate protruding from the side surface of the column; an upper stile that extends the joint plate along the upper surface so that one end substantially contacts the column; and has an engaging portion on the upper surface; and a decorative cover that covers the joint plate and is arranged along the upper surface of the upper stile and has an engaged part that is engaged with the engaging part of the upper stile. Balcony upper stile mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7201587U JPH0431396Y2 (en) | 1987-05-14 | 1987-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7201587U JPH0431396Y2 (en) | 1987-05-14 | 1987-05-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63179335U true JPS63179335U (en) | 1988-11-21 |
| JPH0431396Y2 JPH0431396Y2 (en) | 1992-07-28 |
Family
ID=30915088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7201587U Expired JPH0431396Y2 (en) | 1987-05-14 | 1987-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0431396Y2 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
| US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
| US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
| US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6998579B2 (en) | 2000-12-29 | 2006-02-14 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
| US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
| US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
| US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
| US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
| US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
| US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
| US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
| US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
| US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
| US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
| US6846516B2 (en) | 2002-04-08 | 2005-01-25 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
| US6875271B2 (en) | 2002-04-09 | 2005-04-05 | Applied Materials, Inc. | Simultaneous cyclical deposition in different processing regions |
| US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
| JP2007523994A (en) | 2003-06-18 | 2007-08-23 | アプライド マテリアルズ インコーポレイテッド | Atomic layer deposition of barrier materials |
-
1987
- 1987-05-14 JP JP7201587U patent/JPH0431396Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0431396Y2 (en) | 1992-07-28 |