JPS63152246U - - Google Patents
Info
- Publication number
- JPS63152246U JPS63152246U JP4358787U JP4358787U JPS63152246U JP S63152246 U JPS63152246 U JP S63152246U JP 4358787 U JP4358787 U JP 4358787U JP 4358787 U JP4358787 U JP 4358787U JP S63152246 U JPS63152246 U JP S63152246U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- phenol
- semiconductor chip
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例の断面図、第２
図は本考案の第２の実施例の断面図、第３図は従
来の混成集積回路装置の一例の断面図である。
１…回路基板、２…半導体チツプ、３…ボンデ
イングワイヤ、４…フエノールプリコート樹脂層
、５…外部リード、６…外装樹脂層、７…耐熱性
テープ、８…熱収縮性テープ、９…気泡。
FIG. 1 is a sectional view of the first embodiment of the present invention;
The figure is a sectional view of a second embodiment of the present invention, and FIG. 3 is a sectional view of an example of a conventional hybrid integrated circuit device. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Semiconductor chip, 3... Bonding wire, 4... Phenol precoat resin layer, 5... External lead, 6... Exterior resin layer, 7... Heat resistant tape, 8... Heat shrinkable tape, 9... Bubbles.
Claims (1)
体チツプ上に被覆されたフエノールプリコート樹
脂層とを備える混成集積回路装置において、前記
フエノールプリコート樹脂層を覆つて密着するテ
ープを有することを特徴とする混成集積回路装置
。 A hybrid integrated circuit device comprising a semiconductor chip mounted on a circuit board and a phenol precoat resin layer coated on the semiconductor chip, characterized by comprising a tape that covers and adheres to the phenol precoat resin layer. Hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4358787U JPS63152246U (en) | 1987-03-24 | 1987-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4358787U JPS63152246U (en) | 1987-03-24 | 1987-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63152246U true JPS63152246U (en) | 1988-10-06 |
Family
ID=30860584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4358787U Pending JPS63152246U (en) | 1987-03-24 | 1987-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63152246U (en) |
-
1987
- 1987-03-24 JP JP4358787U patent/JPS63152246U/ja active Pending
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