JPS63138743A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To protect a lead, and to prevent the deformation of the lead by forming a projecting section to a lower resin section and molding the lead in a section near the projecting section. CONSTITUTION:A projecting section is shaped on a lower resin section 7 by widening the breadth of a resin sealing section for one sealing mold. A mold is constituted of a molding top force 8 and a molding bottom force 9, a support fitting 11 relaxing bending stress applied to the joining section of an upper resin section 6 and a lower resin section 7 at the time of molding and a spring 12 adjusting bearing force. A lead is molded by lowering the molding top force 8, but the support fitting 11 is brought into contact with the shoulder of the lead at that time, and the lead is pressure-molded gradually by the spring 12. Accordingly, an IC package can prevent the deformation of the lead.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to surface mounting IC packages, particularly SOP (
Small 0utline Package) and QF
P (Quad Flat Package) O Regarding the external structure.

[Conventional technology]

Conventionally, in this type of IC package, the upper and lower encapsulation molds are made to have approximately the same width, and the side surface shape of the body is approximately square.

In addition, the lead shape was pulled out horizontally from the body and molded into a crank shape.

Figure 6 is an external view of the conventional SOP, (a) is a plan view, (b)
) is a front view, and (C) is a side view. QFPs also have the same lead shape, although there are lead wires protruding in four directions.

[Problem that the invention seeks to solve]

In the conventional SOP and QFP described above, the lead wires are identified only at the point where they are drawn out, and therefore the lead wires 10 have a problem in terms of strength against external pressure.

There is a drawback that the lead easily loses its deformation when external pressure is applied to the lead wire during transportation or attachment to a temporary print.

It is also possible to mold the lead wire 10 close to the lower resin part 13, but if it is bent in this state, the lower resin part 13
Since lead bending stress is applied to the joint between 3 and the upper resin part 6, resin cracks occur and the force ratio of the moisture resistance characteristics of the IC is affected, making it difficult to realize.

[Means for solving problems]

In the IC package of the present invention, a protrusion is provided in the lower resin part for the purpose of preventing deformation of the lead wire, and the lead wire is molded close to the protrusion.

〔Example〕

Next, an example of the SOP of the present invention will be shown and explained below.

1 to 5 are cross-sectional views of an embodiment of the present invention viewed from the side.

FIG. 1 shows the encapsulation mold, FIGS. 2 and 3 show the resin molding, FIG. 4 shows the lead molding mold, and FIG. 5 shows the lead molding state.

The encapsulation mold consists of an upper mold 1 and a lower mold 2, and the width of the resin-filled part of the lower mold 2 is made wider than that of the upper mold 1.
As shown in FIG. 2, the lead frame 3 on which the IC chip 4 has been mounted and subjected to the bonding process is sandwiched between the lower mold 1 and the lower mold 2, resin is poured into this, the encapsulation mold is removed,
FIG. 3 shows a cut of the lead frame to obtain an upper resin part 6, a lower resin part 7, and a lead wire 5 before molding.

FIG. 4 shows a lead molding die, which includes an upper molding mold 8, a lower molding mold 9, a supporting metal fitting 11 that relieves the bending stress applied to the joint between the upper resin part 6 and the lower resin part 7 during molding, and adjusts the supporting force. It is constituted by a spring 12.

The reed forming is performed by lowering the upper molding plate 8, and at this time, the support fitting 11 is placed on the shoulder of the reed.
It is gradually pressurized by the spring 13.

FIG. 5 shows the lead after molding.

〔Effect of the invention〕

As explained above, the present invention provides a protrusion on the lower resin part and molds the lead wire close to the protrusion, thereby maintaining the lead wire and effectively preventing lead deformation.

[Brief explanation of the drawing]

Figures 1 to 5 are explanatory views showing embodiments of the present invention.
The figure shows an encapsulating mold, FIGS. 2 and 3 show resin encapsulation, FIG. 4 shows a lead molding mold, and FIG. 5 shows a sectional view of a package after lead molding. l...Lower mold, 2...Lower mold, 3...
...Lead frame, 4...Chip, 5.
... Lead wire before molding, 6 ..., ..., upper resin part, 7 ... lower resin part, 8 ... lower mold,
9...Molding lower mold, lo...Lead wire after molding, 11°°°°...Supporting metal fittings, 12...
Spring. Figure 6 is an external view of the conventional SOP, (the top is the plan view, (the front view is the front view, and (C) is the side view. 6... Upper resin part, 13... Lower resin part,
10-°・・・Lead wire after molding. and Figure G

Claims (1)

[Claims] In a semiconductor device manufacturing method in which two encapsulation molds are combined and resin is encapsulated therein, a protrusion is provided by widening the resin-filled portion of one of the encapsulation molds, and a lead wire is attached to the protrusion. A method of manufacturing a semiconductor device characterized by close-proximity molding.