JPS63119593A - Printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to printed circuit boards used in various electronic devices.

Conventional technology Currently, as household appliances and electronic devices become smaller, high-density mounting on printed circuit boards is required. All aspects are being considered. However, there are limits to miniaturization with equivalent performance, and there are also problems such as the method of mounting the components and ensuring reliability of the pattern.

Hereinafter, a method for mounting a resistor in a conventional electronic component as described above will be described with reference to the drawings.

FIG. 4 shows a state in which two points A and B on the circuit are connected through a fixed resistance. 1 is a resistance with a certain value R. FIG. 5 shows a state in which the circuit shown in FIG. 4 is mounted on an actual board, and points A and B are opposite sides due to the design of the pattern. Here, 3 is an insulating substrate, 4
is the wiring pattern.

Problems to be Solved by the Invention However, in the above configuration, the mounting area of one resistor is inevitably determined by the size of the resistor, and it is difficult to implement high-density mounting within a limited board. This has the problem that it is inconvenient to do so.

In view of the above-mentioned problems, the present invention provides a printed circuit board in which the mounting area of the resistor can be reduced, the resistor can be further downsized, and the resistor can be mounted at high density.

Means for Solving the Problems In order to achieve this object, the printed circuit board of the present invention has the following features:
A hole is provided so as to penetrate through the insulating substrate, and a resistive material is embedded in the hole to electrically connect the wiring patterns on the front and back sides.

Function: With this configuration, the area occupied by the resistor on the printed circuit board becomes smaller, resulting in further miniaturization and higher density.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIGS. 1 and 2 are cross-sectional views of a printed circuit board according to an embodiment of the present invention. In FIG. 1, 6 is a paste-like resistor, 6 is an insulating substrate, and 7 is a wiring pattern.

The wiring pattern 7 is printed on both sides of the substrate 6. In order to connect both patterns 7 with a resistor, both patterns 7
A hole is made in the overlapping area, and the resistor 6 having a predetermined resistance value is poured into the hole to electrically connect both wiring patterns 7.

Note that FIG. 1 shows an example in which the resistor 6 is formed into a cylindrical shape, and FIG. 2 shows an example in which the resistor 6 is formed in a columnar shape. By changing the shape of the resistor in this way, the resistance value can be changed.

FIG. 3 shows another embodiment of the present invention, in which a resistor 6 is first embedded in a through hole provided in a substrate 6, and then a wiring pattern 7 is placed on the front and back of the substrate so that a portion overlaps with the resistor 5. The two are connected by printing.

As described above, according to this embodiment, in order to connect the front and back sides of a double-sided board with a resistor, a hole is provided in the board, and a paste-like resistor is embedded in the hole to achieve the connection. As a result, the mounting area is reduced.

Effects of the Invention As described above, according to the present invention, the wiring pattern on the front side and the wiring pattern on the back side can be connected by providing a hole in the substrate and embedding a resistor in the hole, thereby making it possible to connect the wiring pattern on the front side and the wiring pattern on the back side. Since the mounting area can be made smaller and higher-density packaging is possible than the method using the method, its practical effects are great.

[Brief explanation of the drawing]

1, 2, and 3 are cross-sectional views of a printed circuit board according to an embodiment of the present invention, FIG. 4 is a circuit diagram when A and B are connected by a resistor R, and FIG. FIG. 2 is a cross-sectional view of a front surface pattern and a back surface pattern of a substrate connected using a conventional fixed resistance element. 6...Resistor, 6...Insulating substrate, 7.
...Wiring pattern. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 5 - JeJL body Figure 2 Figure 4 Figure 5

Claims (1)

[Claims] A hole is formed so that the wiring pattern on one side of the board with the wiring pattern printed on both sides communicates with the wiring pattern on the other side, and the wiring pattern on each side is created by filling the inside of this hole with a material having a predetermined resistance value. A printed circuit board that is electrically connected.