JPS6295296A - Information memory card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an information storage medium for storing various information such as game software and learning software for computers, and in particular, a card-type substrate with an erasable lead. The present invention relates to an information storage card equipped with an only-memory IC chip.

[Prior Art] Conventionally, this type of information storage card has a read-only memory (hereinafter abbreviated as ROM) on a card-type substrate.

). This product functions as a software package and is sold with various software from the game software list stored in the ROM.

By purchasing an information storage card that stores the desired software, the purchaser can purchase the necessary software.

However, this information storage card is
Since the C-chip is expensive, the portion that functions as a package accounts for a high proportion of the overall price, causing a problem in that the price of software increases by the amount of the package.

In addition, since this information storage card has a structure in which software is fixedly stored in the ROM, in the case of game software, etc., when the user gets tired of it, it may be left unused after the 7th edition.
It is often thrown away. A similar tendency exists for other software such as learning software.

On the other hand, new software for games, learning, etc. is being announced one after another, and each time users purchase new software in the form of an information storage card, that is, they purchase the entire package including ROM. That will happen.

In this way, with conventional information storage cards, expensive ROMs are often left unused or thrown away, while at the same time it is unreasonable to have to purchase new software at a price that includes expensive ROMs. be.

In contrast, erasable read-only memory (hereinafter referred to as E)
It is abbreviated as FROM. ) is being considered.

This involves mounting an EFROM IC chip mounted on a printed circuit board in a recess provided on one side of a card type board, and at least a portion of the recess facing the E IC chip on the other side of the card type board. A window is provided through the side, and a material such as quartz glass that transmits ultraviolet rays for memory erasing is fitted into the window.

[Problems to be Solved by the Invention] However, this information storage card equipped with an EFROM has various drawbacks in practical use.

First, quartz glass is usually used as a material that can transmit ultraviolet rays for memory erasing, but this quartz glass has the drawbacks of being expensive, not easy to process, and easily damaged. .

Second, under normal conditions, it is necessary to attach a light-shielding sticker to the window member to prevent the memory contents from being erased, but if this light-shielding sticker is removed when erasing the memory, the adhesive stains will be removed from the window. It has the disadvantage that it remains on the surface of the member and scatters ultraviolet rays for memory erasing, impeding erasure. In this case, the dirt can be removed, but T and fln are applied, and there is a risk that the window member may be damaged or scratched when removing the dirt.

On the other hand, it is conceivable to use a synthetic resin that transmits ultraviolet rays as the window member. This resin has the advantage of being inexpensive and hard to break.

However, UV-transmitting resin has the disadvantage that its surface is more easily damaged than glass. Therefore, when removing adhesive stains when removing the light-shielding sticker, small scratches are likely to occur on the surface, and when these scratches occur, the ultraviolet rays used for memory erasing are scattered, reducing erasing efficiency. It takes time to erase.

In extreme cases, it may become impossible to erase.

The present invention was made to solve the above-mentioned problems, and can reliably protect IC chips from light under normal conditions without using window members that are easily damaged or scratched.
An object of the present invention is to provide an information storage card in which the light-shielding protection state can be easily released when erasing the memory without requiring time such as removing dirt with adhesive, and which does not reduce the erasing efficiency. do.

[Means for Solving the Problems] The first and second inventions of the present application include mounting an IC chip of an erasable read-only memory mounted on a print board in a recess provided on one side of a card-type substrate. At the same time, at least the portion of the recess facing the C chip,
The present invention is applied to an information storage card in which a penetrating window is provided on the other side of a card-type substrate so that a memory erasing light beam can pass therethrough. Each of the seven stages for solving the above problems has the following configuration.

First, the first invention provides the following steps: (a) a lid for closing the window is attached to the opening of the window h, and (b) a window of the card-type substrate including the lid is provided. The present invention is characterized in that a seal piece is attached to the side where the cover is located.

Moreover, the second invention of the present application is as follows.

(a) J: includes a lid that fits into the window and closes the window;
A convex portion for IJ2 and a concave portion for locking that engage with each other are provided, and the lid body is fitted into the window portion by engaging the convex portion for locking and the concave portion for locking. Let this be the sign of a cow.

[Function] The first invention of the present application shields and protects the IC chip housed in the recess from light by attaching to the opening of the window a lid that closes the window. This lid body may be made of any material, such as metal or synthetic resin, which can block light rays such as ultraviolet rays that erase the memory, and can be constructed at low cost. Further, this lid body is covered with a sealing piece and is securely fixed.

To erase the software stored in EFROM,
Just remove the lid. The lid can be easily removed by peeling off the seal piece. Moreover, at that time,
Since the window part is completely open, no adhesive stains remain in this part.

Moreover, in the second aspect of the present invention, the lid body is fitted into the window portion to close the window portion. The lid body and the window portion are provided with a locking protrusion and a locking recess that engage with each other on corresponding side surfaces. Therefore.

When fitting the lid into the window, by engaging the locking convex portion and the locking recess, both can be firmly and reliably fixed.

[Example] Embodiments of the present invention will be described with reference to the drawings.

Configuration of First Embodiment> Figs. 1 to 4 show a first embodiment of the information storage card of the present invention. Fig. 1 is a front view showing the external appearance of the information storage card of this embodiment, Fig. 2 is a rear view thereof, Fig. 3A is a perspective view showing the internal structure of the printed circuit board used in this embodiment, and Fig. 3B is a Figure 3C is a perspective view showing the lid body used in this example, Figure 3C is a perspective view showing the front side structure of the substrate used in this example, and Figure 3D is a perspective view showing the back side structure of the substrate used in this example. FIG. 3E is a perspective view showing an example of a sheet piece used in this embodiment, and FIG. 4 is an enlarged sectional view of a main part of the information storage card of this embodiment.

As shown in these figures, the information storage card of this embodiment is
An EFROM IC chip 1 is placed on the front side of the card type board l.
1 is mounted, and a window 5 is provided on the back side of the board 1 at a position facing the IC chip 11.
A cover 15 is attached to close the substrate 1, and a sealing piece 16 is attached to almost the entire area of the back surface of the substrate 1 except for one peripheral edge.

The substrate 1 is made of plastic, ceramic, etc.
One end of the connector is the insertion part 2 of the connector. The substrate 1
A recess 3 for storing a printed circuit board and a recess 4 for storing an IC chip are provided on the front insertion portion 2 side. On the other hand, on the back side of the substrate 1, a shallow recess 6 whose depth corresponds to the thickness of the sealing piece 1B to be attached is provided over almost the entire area of the substrate except for the peripheral edge, and In the recess 6, there are provided a window 5 that penetrates the IC chip storage recess 4 to the back side of the substrate 1, and a recess 5a provided at the opening of the window 5. Furthermore, in this embodiment, a hole 6a slightly deeper than the recess 6 is provided at the upper corner of the recess 6.

The window portion 5 communicates with the IC chip storage recess 4, and in this embodiment, is formed to have the same cross-sectional shape. The window 5 only needs to be located at a position facing the IC chip 11, so it is not necessarily necessary to have the same cross-sectional shape as the IC chip storage recess 4 as in this embodiment. For example, it may have a different shape, such as a circle, or may have a smaller cross-sectional area.

IC chip II is an EFROM on a semiconductor such as silicon.
It is configured by forming a computer, and stores various software such as game programs and learning programs. Also, this IC
The chip 11 emits light such as ultraviolet rays (ultraviolet rays in this embodiment)
By irradiating it, its memory contents can be erased, and new information can then be loaded.

As shown in FIG. 3A, this IC chip 11 is fixed to the back side of the printed circuit board 7 at a position a, and the electrode portion (not shown) and the wiring portion 9 previously provided on the back surface of the printed circuit board 7 are connected with gold wire. It is connected with a bonding wire 13 such as (
(See Figure 4). This wiring portion 9 is connected to a group of connection terminals 8a and 8b provided on the front side of the printed circuit board 7 via a through hole IO. Therefore, the IC chip 11 inputs and outputs information via these connection terminal groups 8a and 8b.

A protective frame 12 is provided around the IC chip 11 on the back surface of the printed circuit board 7, and a protective layer 14 is formed by filling the protective frame 12 with a resin that transmits ultraviolet rays (for example, silicone resin). to protect the EC chip 11 and its surrounding area.

The printed circuit board 7 on which the IC chip 11 is mounted is fitted into the printed circuit board storage recess 3 and fixed with an adhesive. At this time, the IC chip 11 is stored in the IC chip storage recess 4.

The lid 15 is made of a material that blocks erasing ultraviolet rays, such as metal or plastic. Further, although the shape of the lid body 15 is formed into a disc shape in this embodiment, it is needless to say that the shape is not limited to this. This lid body 15 is a window provided on the back side of the substrate 1. It is fitted into the opening recess 5d of B5. In this embodiment, only the width is fitted, but it may be fixed with an adhesive.

The sealing piece 16 is made of, for example, a metal foil or a synthetic resin sheet 7, and one side, that is, the pasting side, is coated with adhesive at 161%.
．． It is. This sticker piece! 6 is attached to the shallow recess 6 on the back side of the substrate l. Since this seal piece 16 has the function of fixing the lid 15, at least it has a larger area than the lid 15, and on the back side of the substrate 1,
It is desirable that the cover be attached so as to cover the lid body 15h and its outer periphery.

However, as long as the lid 15 has the function of fixing to a certain portion, it is not necessarily necessary to attach it to almost the entire back surface side of the substrate 1.

It is convenient to print information on the contents of the software stored in the EFROM, how to use it, etc. on the other side of the seal piece 1B, that is, on the non-stick side IEia.

Effects of the First Embodiment To modify the software of the information storage card of this embodiment configured as described above, an erasing device and a writing device are required. However, since these are expensive,9 they are usually installed at software stores.

Now, suppose that the owner of the information storage card configured as described above gets tired of the stored software such as games, etc., and takes this card and installs the software that controls the above-mentioned erasing device and writing device. Go to the store.

When you receive this card at the Hanbai store, first you will receive 1 sticker piece.
6 to A#. In this case, since the seal piece 16 is stuck in the recess 6 with a depth equivalent to its thickness, its peripheral edge is protected by the frame-shaped edge of the recess 6.
Hard to peel off. Therefore, using the hole 6a, the corner of the seal piece 16 is slightly peeled off, and the peeled part is used as a hook to peel off the entire seal piece. Thereby, the entire seal piece 16 can be easily peeled off.

With this peeling of the seal piece 1B, the lid 15 is removed from the recess 5.
deviate from a. This is because the lid 15 is bonded to the seal piece 16 with an adhesive.

In this manner, when the window 5 is opened, the information storage card is placed on the erasing device. In the erasing device, ultraviolet rays are emitted into the window portion 5, and the IC chip 11 is irradiated through the protective layer 14. As a result, the software stored in the IC chip 11 is erased. At this time, in the window part 5,
Since there is no glass etc., its own transmittance, and
There is no loss due to a decrease in transmittance due to dirt, and erasing can be performed efficiently.

After erasing the contents, new software is written using a writing device.

After writing, the lid 15 is fitted into the opening section 5a of the window 5, and the seal piece 16 is pasted thereon. This results in
The lid 15 is firmly fixed, and the IC chip 11 inside is protected from light.

Configuration of Second Embodiment> Figs. 5 to 6C show a second embodiment of the information storage card of the present invention. FIG. 5 is an enlarged sectional view of essential parts of the information storage card of this embodiment, FIG. 6A is a plan view showing an example of the lid body used in this embodiment, and FIG. 6B is a view of the window frame used in this embodiment. FIG. 6C is a plan view showing a cover glass used in this example.

The information storage card of this embodiment has the following features: the upper part of the IC chip 11 covered with the protective layer 14 is covered with the covering plate 17;
Another feature is that a window frame 18 is installed inside the lid body 15, and the other configurations are almost the same as those of the first embodiment. Therefore, in the following, descriptions of the same points as in the first embodiment will be omitted, and the description will focus on the characteristic points.

In this embodiment, as shown in FIG. 6A, a rectangular lid 1 is used.
5 is used. Therefore, unlike the case of the first embodiment, the opening section 5a of the window section 5 on the back surface of the substrate 1 is not circular, but has a shape that can be fitted with the lid body 15 shown in FIG. 6A (not shown). figure).

The window frame 18 is made of, for example, stainless steel, and is opened only at a position facing the IC chip 11 as a window 18a, and covers the other parts. This window frame 18 is fixed to the bottom surface of the recess 5a with adhesive or the like.

Although the window frame 18 is provided separately from the substrate 1 in this embodiment, it may be formed of the same material as the substrate 1.

The cover plate 17 is made of ultraviolet-transparent resin, ultraviolet-transparent glass, or the like, and is fixed to the protective frame 12 with an adhesive or the like.

By covering the protective layer 14, this covering plate 17 protects the window portion 5 when it is open.

This prevents the layer 14 from becoming soiled. Although it is not easy to remove dust adhering to the protective layer 14J because the protective layer 14 is easily damaged, dust adhering to the covering plate 17F can be easily removed with a brush or the like.

Second part! Effects of the Embodiment> The effects of this embodiment are basically the same as those of the first embodiment. The difference is that when the lid 15 is removed,
Window frame! 8 remains, the erasing ultraviolet rays are applied through the window 18a of the window frame 18 and through the cover plate 17.

Note that the window frame 18 is opened only at a position facing the IC chip 11 as a window 18a, and the other portions are covered, thereby reducing the bending of the lid body 15 placed thereon.

Configuration of Third Embodiment> FIG. 7 shows a third embodiment of the information card of the present invention. FIG. 7 is an enlarged sectional view of the main parts of the information storage card of this embodiment with the lid removed.

The information storage card of this embodiment is characterized by a structure in which the lid body 19 is fitted into the window portion 5 without using a seal piece. The other configurations are almost the same as those of the first embodiment.

In the case of this embodiment, the shallow recess 6 on the back surface of the substrate l does not necessarily need to be formed, but a seal piece may be pasted thereon for reinforcement, to explain the content of newly hidden software, or to explain its handling. In this case, it is convenient to form the recess 6 in order to prevent the seal piece from peeling off.

The lid 19 of this embodiment is made of the same material as the substrate 1, and its outer shape is set to approximately match the cross-sectional shape of the window 5 to which it is to be fitted. Furthermore, locking convex portions 20 are provided protruding from a plurality of locations on the outer surface. In this embodiment, the locking convex portion 20 is provided near the bottom surface of the lid, but it goes without saying that the locking convex portion 20 is not limited to this position. In this embodiment, the locking convex portion 20 is a plurality of protrusions.
It may be a protrusion that goes around the outer surface of the lid 19.

The lid 19 can be formed into various shapes as long as it matches the cross-sectional shape of the window 5 to which it fits.

For example, as shown in FIG. 8, it can be made into a disk shape. Further, in this example, the locking convex portion 20 is not a plurality of protrusions, but a protrusion extending around the outer surface of the lid body 19. If the locking recess 20 is a protrusion, its mechanical strength increases, and in the case of a disc-shaped lid, positioning with the locking recess 21 described later becomes unnecessary, which is convenient.

Further, as shown in FIG. 9, the lid body 19 may be provided with a hole 22 for locking a jig for convenience in removal.

In this embodiment, the window portion 5 is formed by punching out the bottom surface of the IC chip storage recess 4, and has an inner surface that engages with the locking convex portion 20 when the lid body 19 is fitted. A hole-shaped locking recess 21 is provided at a corresponding position.

However, this locking recess 21 may be formed in the shape of a groove that goes around the inner surface of the window portion 5. If the concave groove shape is used, it is possible to cope with the case where the above-mentioned locking convex part 20 is a protrusion, and also it is possible to eliminate the need for positioning even when the above-mentioned locking convex part 20 is a plurality of protrusions. It's convenient. Further, the above-mentioned locking convex portion 20 is provided on the window portion 5, and the locking recess 21 is provided on the lid body 18.
It is also possible to have a configuration in which

A locking protrusion (or protrusion) 23 is provided on the lower side of the locking recess 21 to prevent the lid 19 from falling when the lid 19 is fitted.

Moreover, the cross-sectional shape of the window portion 5 can be made into one of various shapes according to the shape of the attachment body 19 to be fitted, similarly to the lid body 19 described previously. What is shown in FIG. 1O is an example.

That is, in the case shown in the figure, the window portion 5 is an IC chip □.

The IC chip 11 is formed to be smaller in cross section than the recess 4 for storing the recess 4 and open at a position facing the IC chip 11 inside the outer periphery of the recess 4 . Furthermore, a locking protrusion 23 is provided at the lower part of the window portion 5 to prevent the lid body 19 from falling.

Operation of the third embodiment> The operation of this embodiment is basically exactly the same as that of the first embodiment. The difference lies in the attachment and detachment of the lid based on the difference in the fixing structure of the lid.

When rewriting the software of the information storage card of the present embodiment, the lid 19 is removed from the window 5 by suction using a suction cup, a vacuum chuck, or the like. In this case, when the lid body 19 has a jig locking hole 22 as shown in FIG.

The lid body 19 can be removed using the locking hole 22 with a jig.

In addition, in the case where a seal piece is attached as in the case of the first embodiment, the lid body 19 has a locking protrusion 20 and a locking recess 21. are engaged with each other, so it cannot be removed only by the adhesive force with the seal piece.Therefore, after peeling off the seal piece as described in the operation of the first embodiment, the lid body is removed as described in E. Remove 18.

After writing new software, close the lid 19 to the window 5.
Fit into. At this time, the lid 19 is pushed in until the locking protrusion 20 and the locking recess 21 are engaged. Here, even if the lid body 19 is further pushed in with the locking protrusion 20 and the locking recess 21 engaged, the lid body 19 will come into contact with the locking protrusion 23 and the lid body 19 will be pushed in further.
9 is prevented from falling.

In addition, after the lid body 19 is fitted into the window part 5, a sealing piece may be attached. As in the case of the first embodiment, it is convenient to print instructions on how to use the newly written software, content guide, etc. on this seal piece.

[Effects of the Invention] The present invention does not use a window member that is easily damaged or scratched, and can reliably protect the IC chip from light under normal conditions, while erasing the memory.

This has the effect of realizing an information storage card in which the light-shielding protection state can be easily released without requiring the trouble of removing stains with adhesive, and in addition, the erasing efficiency is not reduced.

[Brief explanation of drawings]

FIG. 1 is a front view showing the front appearance of the information storage card of this embodiment, FIG. 2 is a rear view thereof, FIG. 3A is a perspective view showing the internal structure of the printed circuit board used in this embodiment, and FIG.
Figure B is a perspective view showing the lid used in this example;
Figure 3C is a perspective view showing the front side structure of the substrate used in this example, Figure 3D is a perspective view showing the back side structure of the substrate used in this example, and Figure 3E is used in this example. A perspective view showing an example of a sheet piece, FIG. 4 is an enlarged sectional view of the main part of the information storage card of this embodiment, FIG. 5 is an enlarged sectional view of the main part of the information storage card of this embodiment, and FIG. FIG. 6B is a top view showing an example of a window frame used in this example, FIG. 6C is a top view showing an example of a cover plate used in this example, and FIG. The figure is an enlarged sectional view of the main part of the information storage card of this embodiment with the lid removed, FIGS. 8 and 9 are top views showing other structures of the lid, and FIG. 10 is the third embodiment. FIG. 3 is an enlarged cross-sectional view of a main part showing a modification example of FIG. 1... Board 3... Recess for storing printed circuit board 4... Recess for storing IC chip 5... Window 6... Recess 7... Printed circuit board 11...-IC chip! 4...Protective layer 15.19...Lid body 16...Seal piece 17..., Covering plate 18...Window frame
2o...Latching convex part 21...Locking recess
22...Latching Hole Applicant SEGA Enterprises Co., Ltd. Agent Patent Attorney Iwao Mishina Fig. 1 8σ Fig. 3A Fig. 38 Fig. 5 Fig. 6A Fig. 6B Fig. 6C Fig. 7

Claims (1)

[Claims] (1) An erasable read-only memory IC mounted on a printed circuit board in a recess provided on one side of a card-type board.
At the same time as mounting the chip, at least the above I in the recessed part
In an information storage card configured such that a window penetrating the other side of the card-type substrate is provided in a portion facing the C-chip so that a light beam for memory erasing can pass therethrough, the opening of the window has a window section. an information storage card, comprising: a lid body for closing the window; and a seal piece is pasted on the side of the card-type substrate including the lid body on which the window is provided. . (2) The information storage card according to claim 1, wherein a metal plate is used as the lid, and a seal piece is attached to fix the metal plate to the window opening. (3) An erasable read-only memory IC mounted on a printed circuit board is placed in a recess provided on one side of the card-type board.
In an information storage card, in which a chip is mounted and a window is provided in at least a portion of the recessed portion facing the IC chip to pass through the other surface of the card type substrate so that a light beam for memory erasing can pass therethrough, a lid that fits into the window and closes the window; the lid and the window each have a locking protrusion and a locking recess on corresponding side surfaces that engage with each other; An information storage card characterized in that the lid body is fitted into the window portion by engaging the locking protrusion and the locking recess.