JPS6295246A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS6295246A JPS6295246A JP60236841A JP23684185A JPS6295246A JP S6295246 A JPS6295246 A JP S6295246A JP 60236841 A JP60236841 A JP 60236841A JP 23684185 A JP23684185 A JP 23684185A JP S6295246 A JPS6295246 A JP S6295246A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- protective layer
- thermal head
- supply conductor
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 36
- 239000011241 protective layer Substances 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002356 single layer Substances 0.000 abstract description 4
- 238000005299 abrasion Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract description 2
- 239000008246 gaseous mixture Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 4
- 229910003070 TaOx Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910004479 Ta2N Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
「技術分野」
本発明は、例えばサーマルプリンタに用いられるサーマ
ルヘッドに関し、特にその保護層の改良に関する。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a thermal head used, for example, in a thermal printer, and particularly to improvements in its protective layer.
「従来技術およびその問題点」
従来より、サーマルヘッドは、部分グレーズ層が形成さ
れたガラス基板上に、ＴａＯｘなどからなるアンダーコ
ート層と、Ｔａ２Ｎなどからなる発熱抵抗体層と、Ａ１
． Ｎｉなどからなる給電用導体層と、保護層とが順次
積層されて構成されていた。ここで保護層は、給電用導
体層や発熱抵抗体層を酸化による劣化から防止し、かつ
、記録紙との摩擦に対する耐久性を付与する役割をなし
ており、例えば５ｉＱ２などからなる酸化防止層と、Ｔ
ａ２０５などからなる＃摩耗層との２層で構成されたも
のが一般的であった。"Prior Art and its Problems" Traditionally, thermal heads have been formed by forming an undercoat layer made of TaOx or the like, a heating resistor layer made of Ta2N or the like, on a glass substrate on which a partial glaze layer is formed, and an A1
．． A power supply conductor layer made of Ni or the like and a protective layer were sequentially laminated. Here, the protective layer has the role of preventing the power supply conductor layer and the heating resistor layer from deteriorating due to oxidation and providing durability against friction with the recording paper. and T
It was common to have a two-layer structure with a wear layer made of A205 or the like.
一方、サーマルヘッドにおいては１表面のラフな用紙に
も記録できること、高速記録を可能とすること、電池駆
動をも可能とすることなどが求められており、これらを
実現するためには、サーマルヘッドの熱効率を高めるこ
とが要求される。On the other hand, thermal heads are required to be able to record on paper with a rough surface, to be capable of high-speed recording, and to be battery-operated. It is required to increase the thermal efficiency of
しかしながら、上記従来のサーマルヘッドにおいては、
保護層が酸化防］ｌ：層と耐摩耗層との２層で構成され
ているので、熱伝導性が悪く、熱効率を向−ヒさせるネ
ックとなっていた。また、工程数が多いので、コスト高
となる欠点もあった。However, in the conventional thermal head described above,
Since the protective layer is composed of two layers: an oxidation-proofing layer and an abrasion-resistant layer, thermal conductivity is poor, which is a bottleneck that reduces thermal efficiency. In addition, since the number of steps is large, there is also a drawback that the cost is high.
「１発明の目的」
本発明の目的は、単一の層で必要とされる耐酸化性、耐
摩耗性を満足し、かつ、熱効率を向上させるようにした
保護層を有するサーマルヘッドを提供することにある。“1.Object of the Invention” The object of the present invention is to provide a thermal head having a protective layer that satisfies the required oxidation resistance and abrasion resistance in a single layer and improves thermal efficiency. There is a particular thing.
「発明の構成」
本発明のサーマルヘッドは、絶縁性基板上に、少なくと
も発熱抵抗体層と、給電用導体層と、保護層とを備え、
前記保護層が、 Ｓｉ、 Ｍｏ、 Ｎの３成分を含み、
比抵抗が１００Ω−ＣＩｌｌ以下である薄膜からなるこ
とを特徴とする。"Structure of the Invention" The thermal head of the present invention includes at least a heating resistor layer, a power supply conductor layer, and a protective layer on an insulating substrate,
The protective layer contains three components: Si, Mo, and N,
It is characterized by being made of a thin film having a specific resistance of 100Ω-CIll or less.
本発明のサーマルヘッドは、上記のような保護層を用い
ることにより、同じ膜厚の保護層を有する従来のサーマ
ルヘッドに比べて、より少ない印加電圧で同じ表面温度
を達成することができる。By using the above-described protective layer, the thermal head of the present invention can achieve the same surface temperature with less applied voltage than a conventional thermal head having a protective layer of the same thickness.
また、本発明のサーマルヘッドで用いられる保護層は、
耐酸化性があり、耐摩耗性にも優れているので、単一の
層で構成することができ、製造工程を少なくしてコスト
低減を図ることができる。Furthermore, the protective layer used in the thermal head of the present invention is
Since it has excellent oxidation resistance and wear resistance, it can be composed of a single layer, reducing the number of manufacturing steps and reducing costs.
なお、保護層の組成は、特に限定されないが、ＳｉとＭ
ｏの原子比率が３〜２：１で、残部がＮで構成されるこ
とが好ましく、さらに具体的には、Ｓｌ：３０〜４０ａ
ｔ％、Ｍｏ二ｌｏ〜２０ａｔ％、Ｎ：４５〜５５ａｔ％
とすることが好ましい。Note that the composition of the protective layer is not particularly limited, but may include Si and M.
It is preferable that the atomic ratio of o is 3 to 2:1, and the remainder is composed of N. More specifically, Sl: 30 to 40a
t%, Mo2lo~20at%, N:45~55at%
It is preferable that
本発明のサーマルヘッドは、例えば次のようにして製造
することができる。すなわち、部分グレーズ層が形成さ
れたガラス基板上に、アンダーコート層と、発熱抵抗体
層と、給電用導体層とを順次積層して形成し、給電用導
体層をエツチングしてパターン化する。そして、これら
の層上に、例えば５ｉＪ４ターゲツト上にＭｏチップを
置いた複合ターゲットを用い、ＡｒとＮ２の混合ガス雰
囲気中でスパッタリングすることにより、５ｉ−Ｎｏ−
Ｈの３° 成分からなる保護層を形成し、サーマルヘッ
ドを得ることができる。The thermal head of the present invention can be manufactured, for example, as follows. That is, an undercoat layer, a heating resistor layer, and a power supply conductor layer are sequentially laminated on a glass substrate on which a partial glaze layer is formed, and the power supply conductor layer is patterned by etching. Then, on these layers, 5i-No-
A thermal head can be obtained by forming a protective layer consisting of a 3° H component.
「発明の実施例」
第１図には、本発明によるサーマルヘッドの実施例が示
されている。"Embodiment of the Invention" FIG. 1 shows an embodiment of a thermal head according to the present invention.
すなわち、アルミナ基板１上に、ＴａＯｘからなるアン
ダーコート層２と、Ｔａ２Ｎからなる発熱抵抗体層３と
、ＡＩからなる給電用導体層４とをスパッタリングによ
り順次積層する。そして、給電用導体層４は、エツチン
グによりパターン化し、それによって発熱ドツト部Ａを
形成する。その後、Ａ「が５ Ｘ １Ｏ−３Ｔｏｒｒ、
Ｎ２がＩ Ｘｌ０−３Ｔｏｒｒの混合ガス雰囲気中で、
直径５インチの５ｉ３Ｎａターゲツト上にＭ。That is, an undercoat layer 2 made of TaOx, a heating resistor layer 3 made of Ta2N, and a power supply conductor layer 4 made of AI are sequentially laminated on an alumina substrate 1 by sputtering. The power supply conductor layer 4 is then patterned by etching, thereby forming the heating dot portions A. After that, A" is 5 X 1O-3Torr,
In a mixed gas atmosphere where N2 is I Xl0-3 Torr,
M on a 5-inch diameter 5i3Na target.
チップを５個置いた複合ターゲットを用いて、スパッタ
リングを行ない、５ｉ−Ｎｏ−Ｎの３成分からなる厚さ
２ ｇｍの保護層５を形成する。こうして得られたサー
マルヘッドに電力を印加し、印加した電力と発熱部のピ
ーク温度キの関係を測定した結果を第２図中ａ線に示す
。Sputtering is performed using a composite target on which five chips are placed to form a protective layer 5 having a thickness of 2 gm and consisting of three components of 5i-No-N. Electric power was applied to the thermal head obtained in this manner, and the relationship between the applied electric power and the peak temperature of the heat generating portion was measured, and the results are shown in line a in FIG.
一方、比較のため、第１図において、保護層として２
ｇｍ厚の５ｉＱ２膜を形成したサーマルヘッドと、保護
層として２ ｇｍ厚のＳｉ３Ｎ４膜を形成したサーマル
ヘッドをそれぞれ作製し、上記と同様にして印加した電
力と発熱部のピーク温度との関係を測定した。その結果
を第２図中す線（ＳｉＯ２膜）およびＣ線（Ｓｉ３Ｎ４
膜）に示す。On the other hand, for comparison, in Figure 1, 2
A thermal head with a 5iQ2 film with a thickness of 5gm and a thermal head with a Si3N4 film with a thickness of 2gm as a protective layer were fabricated, respectively, and the relationship between the applied power and the peak temperature of the heat generating part was measured in the same manner as above. did. The results are shown in Fig. 2 with the black line (SiO2 film) and the C line (Si3N4 film).
membrane).
第２図から明らかなように、保護層としてＳｉ−Ｍｏ−
Ｎを用いた本発明のサーマルヘッドは、同じ表面温度を
得るために必要な印加電力が０．２〜０．３ ｗ／ｄａ
ｔ程度少な程度中むことが分る。As is clear from Fig. 2, Si-Mo-
The thermal head of the present invention using N requires an applied power of 0.2 to 0.3 w/da to obtain the same surface temperature.
It can be seen that there is a slight drop in the temperature by about t.
次に、第１図において、保護層５として７ ｐ−ｍ厚の
５ｉ−Ｎｏ−Ｎ膜を形成したサーマルヘッドを作製した
。また、比較のため、保護層として２ ｇｍ厚の５ｉＱ
２膜と５ ｐ−ｒｎ厚のＴａＯｘ膜とを積層したサーマ
ルヘッドを作製した。これらのサーマルヘッドを用いて
ＳＳＴ試験および印字試験を行なった結果、両者はいず
れも同等な性能を示した。Next, as shown in FIG. 1, a thermal head was fabricated in which a 7 pm thick 5i-No-N film was formed as the protective layer 5. For comparison, 2 gm thick 5iQ was used as a protective layer.
A thermal head was fabricated by laminating two films and a TaOx film with a thickness of 5 p-rn. As a result of conducting an SST test and a printing test using these thermal heads, both showed equivalent performance.
なお、第１図に示すサーマルヘッドでは、便宜上ガラス
グレーズ層を省略したが、発熱部Ａに対応するアルミナ
基板１上にガラスグレーズ層を部分的に設けてよいこと
は勿論である。Note that in the thermal head shown in FIG. 1, the glass glaze layer is omitted for convenience, but it goes without saying that the glass glaze layer may be partially provided on the alumina substrate 1 corresponding to the heat generating portion A.
「発明の効果」
以−ヒ説明したように、本発明によれば、Ｓｉ−Ｍｏ−
Ｎの３成分からなる保護層を用いたので、保護層が＃酸
化性および耐摩耗性に優れており、単一の層で構成でき
、製造工程が簡略化される。また、２層構造の保護層を
有する従来のサーマルへラドに比べて熱効率を向上させ
ることができる。"Effects of the Invention" As explained below, according to the present invention, Si-Mo-
Since a protective layer consisting of the three components of N is used, the protective layer has excellent oxidation resistance and wear resistance, can be composed of a single layer, and the manufacturing process is simplified. In addition, thermal efficiency can be improved compared to conventional thermal helmets having a two-layered protective layer.
第１図は本発明のサーマルヘッドの実施例を示す断面図
、第２図はサーマルヘッドの発熱部に印加した電力と発
熱部のピーク温度との関係を示す図表である。
図中、■はアルミナ基板、２はアンダーコート層、３は
発熱抵抗体層、４は給電用導体層、５は保護層である。FIG. 1 is a sectional view showing an embodiment of the thermal head of the present invention, and FIG. 2 is a chart showing the relationship between the electric power applied to the heat generating part of the thermal head and the peak temperature of the heat generating part. In the figure, ■ is an alumina substrate, 2 is an undercoat layer, 3 is a heating resistor layer, 4 is a power supply conductor layer, and 5 is a protective layer.
Claims (2)
電用導体層と、保護層とを備えたサーマルヘッドにおい
て、前記保護層が、Ｓｉ、Ｍｏ、Ｎの３成分を含み、比
抵抗が１００Ω−ｃｍ以下である薄膜からなることを特
徴とするサーマルヘッド。(1) A thermal head comprising at least a heating resistor layer, a power supply conductor layer, and a protective layer on an insulating substrate, in which the protective layer contains three components of Si, Mo, and N, and has a specific resistance. 1. A thermal head comprising a thin film having a resistance of 100 Ω-cm or less.
ＳｉとＭｏの原子比率が３〜２：１で、残部がＮで構成
されたものであるサーマルヘッド。(2) In claim 1, the protective layer is
A thermal head with an atomic ratio of Si and Mo of 3 to 2:1, with the balance being N.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60236841A JPS6295246A (en) | 1985-10-23 | 1985-10-23 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60236841A JPS6295246A (en) | 1985-10-23 | 1985-10-23 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6295246A true JPS6295246A (en) | 1987-05-01 |
Family
ID=17006582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60236841A Pending JPS6295246A (en) | 1985-10-23 | 1985-10-23 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6295246A (en) |
-
1985
- 1985-10-23 JP JP60236841A patent/JPS6295246A/en active Pending
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