JPS6288393A - Circuit board pattern structure - Google Patents
Circuit board pattern structureInfo
- Publication number
- JPS6288393A JPS6288393A JP22926985A JP22926985A JPS6288393A JP S6288393 A JPS6288393 A JP S6288393A JP 22926985 A JP22926985 A JP 22926985A JP 22926985 A JP22926985 A JP 22926985A JP S6288393 A JPS6288393 A JP S6288393A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electrode
- pattern
- adhesive
- pattern structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000006258 conductive agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は回路基板のパターン構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a pattern structure of a circuit board.
本発明は回路基板のパターン構造において、電極部の形
状を櫛歯形に形成することにより、導電性接着剤の接着
強度を向上させ、信頼性の高い導通を得ることを目的と
するものである。An object of the present invention is to improve the adhesive strength of a conductive adhesive and obtain highly reliable conduction by forming electrode portions in a comb-teeth shape in a pattern structure of a circuit board.
従来の異方性導電膜等の導電性接着剤を介して電子部品
の電極との導通をとる方式の回路基板パターン構造は、
第２図の様に、電子部品の電極に対応した形状に形成す
るのが一般的であった。The conventional circuit board pattern structure that establishes electrical connection with the electrodes of electronic components through a conductive adhesive such as an anisotropic conductive film is
As shown in FIG. 2, it has generally been formed into a shape that corresponds to the electrodes of electronic components.
〔発明が解決しようとする問題点及び目的〕しかし、前
述の従来技術では、電子部品の′成極部と、回路基板の
成極部が向かい合って接続されるため、余分な接着剤の
逃げ場がなくなり本来の接着強度が得られない、確実な
導通が出来ない、という問題点を有する。[Problems and objects to be solved by the invention] However, in the above-mentioned prior art, the polarized part of the electronic component and the polarized part of the circuit board are connected facing each other, so there is no place for excess adhesive to escape. There are problems in that the original adhesive strength cannot be obtained and reliable conduction cannot be achieved.
そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、回路基板のパターンの電極部の
形状を櫛歯形に形成することにより、導電性接着剤の接
着強度を向上させ信頼の高い導通な得る回路基板パター
ン構造を提供するところにある。The present invention is intended to solve these problems, and its purpose is to improve the adhesive strength of the conductive adhesive by forming the electrode part of the circuit board pattern into a comb-shaped shape. The purpose of the present invention is to provide a circuit board pattern structure that provides highly reliable conductivity.
本発明の回路基板のパターン構造は１異方性導電膜等の
導電性接着剤を介して、電子部品の成極との導通をとる
回路基板のパターンにおいて、電極部を櫛歯形に形成し
たことを特徴とする特〔作用〕
本発明の上記構造によれば、圧着の際余分な接着剤は、
櫛歯形のパターンの間に回り込むため、電子部品の電極
部と、回路基板の電極部の間の導通剤が確実につぶされ
、信頼性の高い導通が得られる。さらに、櫛歯形のパタ
ーンの間に回り込んだ接着剤と、回路基板パターンとの
接着面積が大きくなるため、圧着強度が大巾に向上する
。The pattern structure of the circuit board of the present invention is as follows: 1. In the circuit board pattern that establishes conduction with the polarization of electronic components through a conductive adhesive such as an anisotropic conductive film, the electrode portions are formed in a comb-teeth shape. According to the above structure of the present invention, excess adhesive is removed during pressure bonding.
Since it wraps around between the comb-shaped patterns, the conductive agent between the electrode portion of the electronic component and the electrode portion of the circuit board is reliably crushed, resulting in highly reliable conduction. Furthermore, since the bonding area between the adhesive that has passed between the comb-shaped patterns and the circuit board pattern is increased, the bonding strength is greatly improved.
第１図は、本発明の実施例における回路基板のパターン
の電極部の平面図であって、櫛歯形に形成しである。FIG. 1 is a plan view of an electrode portion of a pattern of a circuit board according to an embodiment of the present invention, which is formed in a comb-teeth shape.
第４図は、本発明の実施例における電極接合部の断面図
であって、１は回路基板、２は回路基板電極パターン、
５は接着剤、４は導通剤、５は電子部品の電極部、６は
電子部品を示す。FIG. 4 is a sectional view of an electrode joint in an embodiment of the present invention, in which 1 is a circuit board, 2 is a circuit board electrode pattern,
5 is an adhesive, 4 is a conductive agent, 5 is an electrode portion of an electronic component, and 6 is an electronic component.
基板電極パターン２は櫛歯形に形成しであるため、接着
剤３の余分なものは、この間に回り込み、基板電極パタ
ーン２と、電子部品の電極部５は導通剤４を確実につぶ
されると共に、接着剤の接着面積が広くなるため、接着
強度が大巾に向上する。Since the board electrode pattern 2 is formed in a comb-teeth shape, the excess adhesive 3 wraps around between the parts, and the conductive agent 4 is reliably crushed between the board electrode pattern 2 and the electrode part 5 of the electronic component. Since the bonding area of the adhesive becomes wider, the bonding strength is greatly improved.
以上述べたように発明によれば、電極部を櫛歯形に形成
することにより、導電性接着剤の接着強度を向上させ、
信頼の高い導通を得る効果がある。As described above, according to the invention, the adhesive strength of the conductive adhesive is improved by forming the electrode part in a comb-like shape,
This has the effect of obtaining highly reliable conduction.
第１図は本発明の回路基板パターｙＳ造を示す平面図。
第２図は従来の回路基板パターン構造を示す平面図。
第３図は従来の電極部導通構造を示す断面図。
第４図は本発明の電極部導通構造を示す断面図。
１・・・・・・回路基板
２・・・・・・回路基板電極パターン
２′・・・・・・従来の回路基板電極パターン６・・・
・・・接着剤
４・・・・・導通剤
５・・・・・・電子部品の電極部。
面 Ｗも一捧才及ハ・ターン右ｈｔ・茅正７図才 １
図
デ
ナ ７ｖ込
イ是１ミのｌ交オカｂ茗戸二→トＬよＬζ（乙〉「、７
υがＹ〜自パ」ｔ ：３ 閣
ｅ賜鼎４に格１に才・靭眸陥鮨
千 十 菌FIG. 1 is a plan view showing the circuit board pattern yS structure of the present invention. FIG. 2 is a plan view showing a conventional circuit board pattern structure. FIG. 3 is a sectional view showing a conventional electrode conduction structure. FIG. 4 is a sectional view showing the electrode conduction structure of the present invention. 1...Circuit board 2...Circuit board electrode pattern 2'...Conventional circuit board electrode pattern 6...
... Adhesive 4 ... Conductive agent 5 ... Electrode part of electronic components. Men W Mo Issho Sai and Ha Turn Right ht Kaya Masa 7 Illustrations 1
Diagram Dana 7v included is 1mi's l exchange b Myoto 2 → To L yo Lζ (Otsu>", 7
υ is Y ~ self-pa"t: 3 Cabinet e gift 4 to case 1 to sai・络朸陨 sushi 100 bacteria
Claims (1)
との導通をとる回路基板のパターンにおいて、電極部を
櫛歯形に形成したことを特徴とする回路基板のパターン
構造。A pattern structure of a circuit board, which is characterized in that an electrode part is formed in a comb-teeth shape in a pattern of a circuit board that establishes conduction with an electrode of an electronic component via a conductive adhesive such as an anisotropic conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22926985A JPS6288393A (en) | 1985-10-15 | 1985-10-15 | Circuit board pattern structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22926985A JPS6288393A (en) | 1985-10-15 | 1985-10-15 | Circuit board pattern structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6288393A true JPS6288393A (en) | 1987-04-22 |
Family
ID=16889462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22926985A Pending JPS6288393A (en) | 1985-10-15 | 1985-10-15 | Circuit board pattern structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6288393A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04267387A (en) * | 1991-02-22 | 1992-09-22 | Tatsuta Electric Wire & Cable Co Ltd | flexible printed board |
| JP2006303176A (en) * | 2005-04-20 | 2006-11-02 | Matsushita Electric Ind Co Ltd | Circuit board connection part and circuit board connection structure |
| WO2008018160A1 (en) * | 2006-08-07 | 2008-02-14 | Nippon Avionics Co., Ltd. | Method and apparatus for connecting printed wiring boards |
| WO2013063888A1 (en) * | 2011-11-05 | 2013-05-10 | Tpk Touch Systems (Xiamen) Inc. | Pin structure and pin connection structure thereof |
| WO2015037496A1 (en) * | 2013-09-10 | 2015-03-19 | 堺ディスプレイプロダクト株式会社 | Connection structure for electroconductive body, and display device |
-
1985
- 1985-10-15 JP JP22926985A patent/JPS6288393A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04267387A (en) * | 1991-02-22 | 1992-09-22 | Tatsuta Electric Wire & Cable Co Ltd | flexible printed board |
| JP2006303176A (en) * | 2005-04-20 | 2006-11-02 | Matsushita Electric Ind Co Ltd | Circuit board connection part and circuit board connection structure |
| WO2008018160A1 (en) * | 2006-08-07 | 2008-02-14 | Nippon Avionics Co., Ltd. | Method and apparatus for connecting printed wiring boards |
| WO2013063888A1 (en) * | 2011-11-05 | 2013-05-10 | Tpk Touch Systems (Xiamen) Inc. | Pin structure and pin connection structure thereof |
| WO2015037496A1 (en) * | 2013-09-10 | 2015-03-19 | 堺ディスプレイプロダクト株式会社 | Connection structure for electroconductive body, and display device |
| CN105531878A (en) * | 2013-09-10 | 2016-04-27 | 堺显示器制品株式会社 | Connection structure for electroconductive body, and display device |
| JPWO2015037496A1 (en) * | 2013-09-10 | 2017-03-02 | 堺ディスプレイプロダクト株式会社 | Conductor connection structure and display device |
| US9814141B2 (en) | 2013-09-10 | 2017-11-07 | Sakai Display Products Corporation | Connection structure of conductors and display apparatus |
| CN105531878B (en) * | 2013-09-10 | 2018-07-17 | 堺显示器制品株式会社 | Conductor connection structure and display device |
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