JPS6280268A - Vacuum equipment for micromachining - Google Patents
Vacuum equipment for micromachiningInfo
- Publication number
- JPS6280268A JPS6280268A JP22009585A JP22009585A JPS6280268A JP S6280268 A JPS6280268 A JP S6280268A JP 22009585 A JP22009585 A JP 22009585A JP 22009585 A JP22009585 A JP 22009585A JP S6280268 A JPS6280268 A JP S6280268A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- chamber
- vacuum
- workpiece
- microfabrication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005459 micromachining Methods 0.000 title claims description 4
- 239000000758 substrate Substances 0.000 description 23
- 238000002360 preparation method Methods 0.000 description 18
- 238000010884 ion-beam technique Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は微細加工用真空装置に係り、特に、被処理物で
ある基板にスパッタ、あるいはイオンビーム加工などの
処理をするに好適な微細加工用真空装置に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a vacuum device for microfabrication, and particularly to a vacuum device for microfabrication that is suitable for performing sputtering or ion beam processing on a substrate as an object to be processed. Regarding vacuum equipment.
一般に、真空状態に保持された室容で、被処理物の基板
にスパッタ、あるいはイオンビーム加工などの処理を施
す装置では、処理性能を向上、あるいは安定させるため
、スパッタ、あるいはイオンビーム加工をする処理室は
、常に真空状態を保ちかつ、処理室以外に予備真空室を
設けて処理すべき基板の仕込、及び取出しを行っている
・このような装置としては、例えば特開昭59−208
836号公報に開示されているが、通常、複数の真空室
で構成され、各真空室はゲート弁で仕切られている。In general, equipment that performs processing such as sputtering or ion beam processing on substrates to be processed in a chamber maintained in a vacuum state uses sputtering or ion beam processing to improve or stabilize processing performance. The processing chamber is always maintained in a vacuum state, and a preliminary vacuum chamber is provided outside the processing chamber for loading and unloading substrates to be processed. Examples of such equipment include, for example, JP-A-59-208
As disclosed in Japanese Patent No. 836, it is usually composed of a plurality of vacuum chambers, each of which is separated by a gate valve.
第7図に上記した構成の詳細を示す。該図において、2
は真空室である処理室で、この処理室2内には微細加工
を施すターゲット13とヒータ14とが対向配置されて
いると共に、このターゲット13とヒータ14との間に
基板保持板9bを移送するための搬送装置5が設置され
ている。一方、1は予備真空室である仕込室で、この仕
込室1内には搬送装置4が設置されており、処理すべき
基板を保持している基板保持板9aを搬送装置4で処理
室2へ移送するか、又は処理された基板保持板9aを処
理室2から取出すためのものである。FIG. 7 shows details of the above-mentioned configuration. In the figure, 2
1 is a processing chamber which is a vacuum chamber, and in this processing chamber 2, a target 13 to be microfabricated and a heater 14 are arranged facing each other, and a substrate holding plate 9b is transferred between the target 13 and the heater 14. A transport device 5 is installed for the purpose of On the other hand, reference numeral 1 denotes a preparation chamber which is a preliminary vacuum chamber. A transfer device 4 is installed in this preparation chamber 1, and a substrate holding plate 9a holding a substrate to be processed is transferred to the processing chamber by the transfer device 4. This is for transferring the processed substrate holding plate 9a to or taking out the processed substrate holding plate 9a from the processing chamber 2.
そして、との仕込室1と処理室2とはゲート弁7で仕切
られている。The preparation chamber 1 and the processing chamber 2 are separated by a gate valve 7.
次に動作を詳細に説明する。まず、ゲート弁7を閉じた
状態で、処理室2を真空状態にし、仕込室1内の搬送装
@4に基板保持板9aを設置する。Next, the operation will be explained in detail. First, with the gate valve 7 closed, the processing chamber 2 is brought into a vacuum state, and the substrate holding plate 9a is installed in the transfer device @4 in the preparation chamber 1.
仕込室1を真空状態にした後、ゲート弁7を開放し、搬
送装置4により基板保持板9aは、処理室2に移送され
、搬送装置5によって処理室2内の所定の位置に移送さ
れて基板保持板9bとなる。After the preparation chamber 1 is brought into a vacuum state, the gate valve 7 is opened, and the substrate holding plate 9a is transferred to the processing chamber 2 by the transfer device 4, and then transferred to a predetermined position in the processing chamber 2 by the transfer device 5. This becomes the substrate holding plate 9b.
ここで必要な加工(スパッタ、あるいはイオンビーム加
工)処理の後、基板保持板9bは搬送装置5により仕込
室1に戻され、ゲート弁7を閉じて。After the necessary processing (sputtering or ion beam processing), the substrate holding plate 9b is returned to the preparation chamber 1 by the transport device 5, and the gate valve 7 is closed.
装置外に取出される。この処理プロセスにより、処理室
2は常に真空状態が保持されるため、安定した加工処理
が可能になる。taken out of the device. Through this processing process, a vacuum state is always maintained in the processing chamber 2, so that stable processing can be performed.
しかし、このような従来装置では、高価なゲート弁7が
必要となる他、仕込室し、処理室2にそれぞれ搬送装置
4,5が必要であり、仕込室1から処理室2にゲート弁
7を越えて基板保持板を搬送する機構が必要である。However, in such a conventional device, in addition to requiring an expensive gate valve 7, transfer devices 4 and 5 are required in the preparation chamber and processing chamber 2, and the gate valve 7 is required from the preparation chamber 1 to the processing chamber 2. A mechanism is required to transport the substrate holding plate across the area.
第8図に生産性を向上させるため、第7図に示した構成
に、処理された基板保持板を取出す取出し室3を仕込室
1を別に設けた例を示す。この取出し室3にも搬送装置
6があり、処理室2とはゲート弁8で仕切られている。FIG. 8 shows an example in which, in order to improve productivity, the preparation chamber 1 is provided with a take-out chamber 3 for taking out processed substrate holding plates in the configuration shown in FIG. 7. This take-out chamber 3 also has a transfer device 6, and is separated from the processing chamber 2 by a gate valve 8.
この例では搬送装置が3組必要で、ゲート弁も2個所と
なり、構造は更に複雑となるため、上述した問題点が更
に顕著となる。In this example, three sets of conveying devices are required, and there are also two gate valves, making the structure even more complicated, and the above-mentioned problems become even more pronounced.
本発明は上述の点に鑑み成されたもので、その目的とす
るところは、高価なゲート弁を使用しないで、かつ、1
つの搬送装置で所定の機能が達成できる微細加工用真空
装置を提供するにある。The present invention has been made in view of the above-mentioned points, and an object of the present invention is to eliminate the use of expensive gate valves and to
An object of the present invention is to provide a vacuum device for microfabrication in which a predetermined function can be achieved with a single transfer device.
本発明は被処理物を微細加工する真空室内に設置されて
いる搬送装置の上方に、微細加工する前の被処理物を仕
込むか、又は微細加工した後の被処理物を取出す予備真
空室を配置することにより、所期の目的を達成するよう
に成したものである。The present invention provides a preliminary vacuum chamber above a transfer device installed in a vacuum chamber in which the workpiece is microfabricated, into which the workpiece is placed before being microfabricated, or from which the workpiece is taken out after micromachining. By arranging them, they are designed to achieve the intended purpose.
以下、図面の実施例に基づいて本発明の詳細な説明する
。尚、符号は従来と同一のものは同符号を使用する。Hereinafter, the present invention will be described in detail based on embodiments of the drawings. Incidentally, the same reference numerals are used for the same parts as in the past.
第1図に本発明の一実施例を示す。該図の如く本実施例
では処理室2内に配置されている搬送装置5の端部上方
に仕込室1を設置し、処理室2と仕込室1とは弁体10
で仕切って構成している。FIG. 1 shows an embodiment of the present invention. As shown in the figure, in this embodiment, the preparation chamber 1 is installed above the end of the transfer device 5 disposed in the processing chamber 2, and the processing chamber 2 and the preparation chamber 1 are connected to each other by a valve body 10.
It is divided into sections.
即ち、断面長方形状の左上方部に仕込室2を形成し、こ
の仕込室2が搬送装置5の端部に位置するようにして、
仕込室2と処理室1とを弁体10で仕切っているもので
ある。そして、仕込室2内には搬送装置が設置されてい
ない。他の構成は従来のものと同様である。That is, the preparation chamber 2 is formed in the upper left part of the rectangular cross section, and this preparation chamber 2 is located at the end of the conveyance device 5.
A preparation chamber 2 and a processing chamber 1 are separated by a valve body 10. Further, no conveyance device is installed in the preparation chamber 2. The other configurations are the same as the conventional one.
このような構成において、弁体10は、垂直方向に運動
して開閉動作を行い。弁体10が閉じた状態で処理室2
を真空状態にし、基板保持板9aを弁体10の上に設置
する。次に、仕込室1を真空状態にした後、弁体10を
下方向に運動させ、搬送装置5に基板保持板9aを移し
、搬送装置5により、基板保持板9bの状態とし、必要
な加工処理を行う、処理後、基板保持板9bを弁体10
の上に戻し、弁体10を上方に動作してシールした後、
基板保持板9aを取出す。In such a configuration, the valve body 10 performs opening and closing operations by moving in the vertical direction. Processing chamber 2 with valve body 10 closed
is placed in a vacuum state, and the substrate holding plate 9a is placed on the valve body 10. Next, after making the preparation chamber 1 into a vacuum state, the valve body 10 is moved downward, and the substrate holding plate 9a is transferred to the transfer device 5. After processing, the substrate holding plate 9b is attached to the valve body 10.
After returning the valve body 10 to the top and sealing it by moving the valve body 10 upward,
Take out the substrate holding plate 9a.
第2図〜第5図に弁体10の開閉状態を示す。The open and closed states of the valve body 10 are shown in FIGS. 2 to 5.
第2図、及び第3図は弁体10を閉じた状態、第4図、
及び第5図は弁体10が開放した状態で、搬送装置5は
紙面に垂直な方向に基板保持板9を搬送する。基板保持
板9は、実際には第2図、及び第3図に示すように、弁
体10上の支持装置12に設置され、弁体10の開放状
態では、第4図、及び第5図に示すように、支持装@1
2が90°回転し5基板保持板9を搬送装置5に移送す
る。FIGS. 2 and 3 show a state in which the valve body 10 is closed, and FIG.
In FIG. 5, the valve body 10 is in an open state, and the conveying device 5 conveys the substrate holding plate 9 in a direction perpendicular to the plane of the paper. The substrate holding plate 9 is actually installed on the support device 12 on the valve body 10 as shown in FIGS. 2 and 3, and when the valve body 10 is in the open state, as shown in FIGS. 4 and 5. As shown in
2 rotates 90° and transfers the 5-substrate holding plate 9 to the transfer device 5.
このような本実施例の構成とすることにより、高価なゲ
ート弁を使用する必要がなく、通常の弁体を用いて行え
、かつ、1組の搬送装置で所定の処理プロセスが達成で
きる。従って、経済性に優れていると共に、1つの搬送
装置でよいため、その制御が容易であり信頼性が向上す
る。With this configuration of this embodiment, there is no need to use an expensive gate valve, a normal valve body can be used, and a predetermined treatment process can be achieved with one set of conveying devices. Therefore, it is not only economically efficient, but also requires only one conveying device, which makes it easy to control and improves reliability.
第6図に本発明に他の実施例を示す。該図の実施例は、
基板保持板9bの取出し室3を、仕込室1とは反対側の
搬送装置5の上方に設置しているものである。FIG. 6 shows another embodiment of the present invention. The embodiment of the figure is
The take-out chamber 3 of the substrate holding plate 9b is installed above the transport device 5 on the opposite side to the preparation chamber 1.
このように構成してもその効果は上述した実施例と同様
であり、3つの室で構成された場合には、効果はさらに
大きなものになる。Even with this configuration, the effect is the same as that of the above-mentioned embodiment, and the effect becomes even greater when the chamber is configured with three chambers.
以上説明した本発明の微細加工用真空装置によれば、被
処理物を微細加工する真空室内に設置されている搬送装
置の上方に、微細加工する前の被処理物を仕込むか、又
は微細加工した後の被処理物を取出す予備真空室を配置
したものであるから、高価なゲート弁を使用することな
しに、かつ、1つの搬送装置で所定の機構が達成できる
ので、此種微細加用真空装置に採用する場合には非常に
有効である。According to the vacuum apparatus for micromachining of the present invention described above, the workpiece to be microfabricated is placed above the transfer device installed in the vacuum chamber in which the workpiece is microfabricated, or Because it is equipped with a preliminary vacuum chamber to take out the processed material after processing, it does not require the use of expensive gate valves, and the specified mechanism can be achieved with one conveyance device, making it possible to achieve this type of fine processing. It is very effective when used in vacuum equipment.
第1図は本発明の微細加工用真空装置の一実施例を示す
断面図、第2図は第1図に示す実施例における弁体が閉
じた状態の平面図、第3図はその断面図、第4図は第1
図に示す実施例における弁体が開放した状態の平面図、
第5図はその断面図、第6図は本発明の他の実施例を示
す断面図、第7図、及び第8図は)れぞれ従来例を示す
断面図である。
1・・・仕込室、2・・・処理室、3・・・取出し室、
4,5゜6・・・搬送装置、7,8・・・ゲート弁、9
,9a、9b・・・基板保持板、10.11・・・弁体
、12・・・支持装置、13・・・ターゲット、14・
・・モータ。Fig. 1 is a sectional view showing an embodiment of the microfabrication vacuum device of the present invention, Fig. 2 is a plan view of the embodiment shown in Fig. 1 with the valve body closed, and Fig. 3 is a sectional view thereof. , Figure 4 is the first
A plan view of the valve body in the illustrated embodiment in an open state,
FIG. 5 is a sectional view thereof, FIG. 6 is a sectional view showing another embodiment of the present invention, and FIGS. 7 and 8 are sectional views showing conventional examples. 1... Preparation room, 2... Processing room, 3... Unloading room,
4,5゜6... Conveyance device, 7,8... Gate valve, 9
, 9a, 9b... Substrate holding plate, 10.11... Valve body, 12... Support device, 13... Target, 14...
··motor.
Claims (1)
配置され、微細加工する前の前記被処理物を仕込むか、
又は微細加工した後の前記被処理物を取り出す予備真空
室と、該予備真空室から真空室への被処理物の搬送、又
は前記真空室から予備真空室への被処理物の搬送を行う
搬送装置とを備え、前記各室が所定の真空状態に保持さ
れている微細加工用真空装置において、前記真空室内の
搬送装置の上方に、前記予備真空室を配置したことを特
徴とする微細加工用真空装置。 2、前記予備真空室の底部は、該予備真空室と前記真空
室との間を真空シールし、かつ、ほぼ上下方向に動作す
る弁体で構成され、該弁体に設置された前記被処理物は
、前記弁体の開放動作による下降運動によって前記予備
真空室から前記真空室内の搬送装置に移送されるか、又
は前記弁体の閉止動作である上昇運動によって前記真空
室内の搬送装置から前記予備真空室に移送されることを
特徴とする微細加工用真空装置。 3、前記予備真空室は、微細加工する前の前記被処理物
を仕込む仕込室と微細加工した後の前記被処理物を取出
す取出し室とから成り、該仕込室と取出し室を、前記真
空室内の搬送装置へ端部上方にほぼ平行して設けたこと
を特徴とする特許請求の範囲第1項、又は第2項記載の
微細加工用真空装置。[Claims] 1. A vacuum chamber for micromachining a workpiece; and a vacuum chamber arranged adjacent to the vacuum chamber, into which the workpiece is placed before microfabrication;
Alternatively, a preliminary vacuum chamber for taking out the workpiece after microfabrication, and transportation for transporting the workpiece from the preliminary vacuum chamber to the vacuum chamber, or transportation for transporting the workpiece from the vacuum chamber to the preliminary vacuum chamber. A vacuum apparatus for microfabrication, wherein each of the chambers is maintained in a predetermined vacuum state, wherein the preparatory vacuum chamber is disposed above a transfer device in the vacuum chamber. Vacuum equipment. 2. The bottom of the preparatory vacuum chamber is configured with a valve body that vacuum-seals between the preparatory vacuum chamber and the vacuum chamber and operates approximately in the vertical direction, and the to-be-processed object installed on the valve body The object is transferred from the preliminary vacuum chamber to the transfer device in the vacuum chamber by a downward movement caused by the opening operation of the valve body, or from the transfer device in the vacuum chamber by the upward movement caused by the closing movement of the valve body. A vacuum device for microfabrication characterized by being transferred to a preliminary vacuum chamber. 3. The preliminary vacuum chamber consists of a loading chamber in which the workpiece is loaded before microfabrication and a takeout chamber for taking out the workpiece after microfabrication, and the loading chamber and takeout chamber are connected to the vacuum chamber. A vacuum device for microfabrication according to claim 1 or 2, characterized in that the vacuum device is provided substantially parallel to the upper end of the conveying device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22009585A JPS6280268A (en) | 1985-10-04 | 1985-10-04 | Vacuum equipment for micromachining |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22009585A JPS6280268A (en) | 1985-10-04 | 1985-10-04 | Vacuum equipment for micromachining |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6280268A true JPS6280268A (en) | 1987-04-13 |
Family
ID=16745846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22009585A Pending JPS6280268A (en) | 1985-10-04 | 1985-10-04 | Vacuum equipment for micromachining |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6280268A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0158660U (en) * | 1987-10-05 | 1989-04-12 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61130485A (en) * | 1984-11-28 | 1986-06-18 | Mitsubishi Electric Corp | Vacuum monitor device |
-
1985
- 1985-10-04 JP JP22009585A patent/JPS6280268A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61130485A (en) * | 1984-11-28 | 1986-06-18 | Mitsubishi Electric Corp | Vacuum monitor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0158660U (en) * | 1987-10-05 | 1989-04-12 | ||
JPH0745561Y2 (en) * | 1987-10-05 | 1995-10-18 | 日新電機株式会社 | Ion processing device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW502284B (en) | Multichamber system of etching facility for manufacturing semiconductor device | |
KR960008969A (en) | Semiconductor processing system | |
JPH05160241A (en) | Board processor | |
JPH04190840A (en) | Vacuum treatment device | |
EP1052681B1 (en) | Apparatus for processing wafers | |
JPS61112312A (en) | Vacuum continuous processing equipment | |
JP2003516622A (en) | Front-end loader transporter with small installation area | |
JPS6280268A (en) | Vacuum equipment for micromachining | |
JPH02271643A (en) | Wafer transfer device | |
JPH02140948A (en) | Vacuum processor | |
JPS60113428A (en) | semiconductor manufacturing equipment | |
JPH03155619A (en) | Vacuum processor | |
JPH0831506B2 (en) | Substrate transfer device | |
JP2550787B2 (en) | Semiconductor device manufacturing equipment | |
JP4227235B2 (en) | Substrate processing equipment | |
JPH03273606A (en) | semiconductor manufacturing equipment | |
JPS6240370A (en) | Substrate transfer mechanism for vacuum device | |
JPS60102744A (en) | Vacuum treater | |
JP2639093B2 (en) | Ion processing equipment | |
JPH0569162U (en) | Cluster type thin film processing equipment with buffer | |
JPS62252128A (en) | Substrate introduction equipment for semiconductor manufacturing equipment | |
JPH10256352A (en) | Device for positioning substrate | |
JPS60160139A (en) | Shifting process | |
JPS62188778A (en) | vacuum equipment | |
JP4568108B2 (en) | Vacuum thin film device |