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JPS6275910U - - Google Patents

Info

Publication number
JPS6275910U
JPS6275910U JP1986159071U JP15907186U JPS6275910U JP S6275910 U JPS6275910 U JP S6275910U JP 1986159071 U JP1986159071 U JP 1986159071U JP 15907186 U JP15907186 U JP 15907186U JP S6275910 U JPS6275910 U JP S6275910U
Authority
JP
Japan
Prior art keywords
pressure
resin
transfer molding
sensitive element
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986159071U
Other languages
Japanese (ja)
Other versions
JPH0339218Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986159071U priority Critical patent/JPH0339218Y2/ja
Publication of JPS6275910U publication Critical patent/JPS6275910U/ja
Application granted granted Critical
Publication of JPH0339218Y2 publication Critical patent/JPH0339218Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はキヤビテイ内に置かれたリードフレー
ムの平面図、第２図は樹脂封止型半導体装置の斜
視図、第３図はトランスフアモールド成型装置の
概略断面図、第４図は従来のトランスフアモール
ド成型装置を説明するための図、第５図は本考案
実施例のトランスフアモールド成型装置を説明す
るための図である。 １……リードフレーム、５……モールドパツケ
ージ、７……樹脂封止型半導体装置、１１……ラ
ンナー、１２……ゲート、１３……キヤビテイ、
１４……上型、１５……下型、１６……カル、１
７，２３……注入プランジヤー、１９……ポツト
、２２ａ，２２ｂ……溝、２４……空洞、２５…
…感圧素子。 Fig. 1 is a plan view of a lead frame placed in a cavity, Fig. 2 is a perspective view of a resin-sealed semiconductor device, Fig. 3 is a schematic sectional view of a transfer molding machine, and Fig. 4 is a conventional FIG. 5 is a diagram for explaining the transfer molding apparatus according to the embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Lead frame, 5... Mold package, 7... Resin-sealed semiconductor device, 11... Runner, 12... Gate, 13... Cavity,
14...upper mold, 15...lower mold, 16...cal, 1
7, 23...Injection plunger, 19...Pot, 22a, 22b...Groove, 24...Cavity, 25...
...Pressure sensitive element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] トランスフアモールド成型を行うモールドプレ
ス内の樹脂に接する面に、薄い壁板を介してモー
ルド金型内の熱硬化性樹脂の圧力を検出する感圧
素子を設け、該感圧素子により検出された圧力に
応じて該樹脂の注入圧を制御するように構成され
たことを特徴とするトランスフアモールド成型装
置。 A pressure-sensitive element that detects the pressure of the thermosetting resin in the mold die is installed through a thin wall plate on the surface in contact with the resin in the mold press that performs transfer molding, and the pressure detected by the pressure-sensitive element is A transfer molding device characterized in that it is configured to control the injection pressure of the resin according to the pressure.
JP1986159071U 1986-10-16 1986-10-16 Expired JPH0339218Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986159071U JPH0339218Y2 (en) 1986-10-16 1986-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986159071U JPH0339218Y2 (en) 1986-10-16 1986-10-16

Publications (2)

Publication Number Publication Date
JPS6275910U true JPS6275910U (en) 1987-05-15
JPH0339218Y2 JPH0339218Y2 (en) 1991-08-19

Family

ID=31083159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986159071U Expired JPH0339218Y2 (en) 1986-10-16 1986-10-16

Country Status (1)

Country Link
JP (1) JPH0339218Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794541A (en) * 1993-09-27 1995-04-07 Toshiba Corp Resin sealing system for semiconductor
WO2018169388A1 (en) * 2017-03-16 2018-09-20 Besi Netherlands B.V. Plunger for feeding encapsulating material to a mould cavity
JP2019001122A (en) * 2017-06-19 2019-01-10 アピックヤマダ株式会社 Resin mold apparatus, and resin mold method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125565A (en) * 1976-04-14 1977-10-21 Hitachi Ltd Transfer molding machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125565A (en) * 1976-04-14 1977-10-21 Hitachi Ltd Transfer molding machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794541A (en) * 1993-09-27 1995-04-07 Toshiba Corp Resin sealing system for semiconductor
WO2018169388A1 (en) * 2017-03-16 2018-09-20 Besi Netherlands B.V. Plunger for feeding encapsulating material to a mould cavity
NL2018533B1 (en) * 2017-03-16 2018-09-24 Besi Netherlands Bv Plunger for feeding encapsulating material to a mould cavity
JP2019001122A (en) * 2017-06-19 2019-01-10 アピックヤマダ株式会社 Resin mold apparatus, and resin mold method

Also Published As

Publication number Publication date
JPH0339218Y2 (en) 1991-08-19

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