JPS6269508U - - Google Patents
Info
- Publication number
- JPS6269508U JPS6269508U JP16130985U JP16130985U JPS6269508U JP S6269508 U JPS6269508 U JP S6269508U JP 16130985 U JP16130985 U JP 16130985U JP 16130985 U JP16130985 U JP 16130985U JP S6269508 U JPS6269508 U JP S6269508U
- Authority
- JP
- Japan
- Prior art keywords
- sickle
- rail
- lock
- shaped lock
- roof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
Description
第１図はこの考案の第１実施例による要部拡大
断面説明図、第２図は第１図の―線における
ロツク機構を示す断面図、第３図ａ，ｂはこの考
案が適用される開閉式ドーム屋根の平面説明図で
ある。
１……固定屋根、２……中央開口、３……可動
屋根、１５，１６……中空レール、２１……鎌形
錠、２７，２８……ロツク穴。
Fig. 1 is an enlarged sectional view of the main part according to the first embodiment of this invention, Fig. 2 is a sectional view showing the locking mechanism taken along the line - in Fig. 1, and Figs. 3 a and b are to which this invention is applied. It is a plane explanatory view of a retractable dome roof. 1...Fixed roof, 2...Central opening, 3...Movable roof, 15, 16...Hollow rail, 21...Sickle-shaped lock, 27, 28...Lock hole.
Claims (1)
中央部に向けて移動可能にガイドされ、該開口を
開閉する複数の可動屋根とからなる開閉式屋根構
造において、隣接する可動屋根同士の接合縁に凹
凸状に係合する一対の中空レールを設けるととも
に、一方のレール内に鎌形錠を旋回可能に配置し
、他方のレールの係合面には前記鎌形錠に係合す
る一対のロツク穴を形成してなり、前記レールの
係合時において、前記鎌形錠を回動し、前記ロツ
ク穴に係合することで、前記可動屋根同士を引き
寄せ状態に連結するようにしたことを特徴とする
開閉式屋根。 In a retractable roof structure consisting of a fixed roof with an opening in the center and a plurality of movable roofs that are movably guided toward the center of the fixed roof opening and open and close the openings, a joint edge between adjacent movable roofs. A pair of hollow rails are provided that engage in a concave and convex manner, and a sickle-shaped lock is arranged in one rail so as to be able to rotate, and a pair of lock holes that engage with the sickle-shaped lock are provided in the engagement surface of the other rail. and when the rail is engaged, the sickle-shaped lock is rotated and engaged with the lock hole, thereby connecting the movable roofs in a drawn state. style roof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16130985U JPS6269508U (en) | 1985-10-23 | 1985-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16130985U JPS6269508U (en) | 1985-10-23 | 1985-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6269508U true JPS6269508U (en) | 1987-05-01 |
Family
ID=31087505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16130985U Pending JPS6269508U (en) | 1985-10-23 | 1985-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6269508U (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
| US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
| US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
| US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
| US7022948B2 (en) | 2000-12-29 | 2006-04-04 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
| US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
| US7115499B2 (en) | 2002-02-26 | 2006-10-03 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
| US7201803B2 (en) | 2001-03-07 | 2007-04-10 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
| US7208413B2 (en) | 2000-06-27 | 2007-04-24 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
| US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
| US7352048B2 (en) | 2001-09-26 | 2008-04-01 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
| US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
| US7595263B2 (en) | 2003-06-18 | 2009-09-29 | Applied Materials, Inc. | Atomic layer deposition of barrier materials |
-
1985
- 1985-10-23 JP JP16130985U patent/JPS6269508U/ja active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7208413B2 (en) | 2000-06-27 | 2007-04-24 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US7501344B2 (en) | 2000-06-27 | 2009-03-10 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US7501343B2 (en) | 2000-06-27 | 2009-03-10 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US7022948B2 (en) | 2000-12-29 | 2006-04-04 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
| US7094680B2 (en) | 2001-02-02 | 2006-08-22 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
| US7201803B2 (en) | 2001-03-07 | 2007-04-10 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
| US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
| US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
| US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
| US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
| US7352048B2 (en) | 2001-09-26 | 2008-04-01 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
| US7494908B2 (en) | 2001-09-26 | 2009-02-24 | Applied Materials, Inc. | Apparatus for integration of barrier layer and seed layer |
| US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
| US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
| US7115499B2 (en) | 2002-02-26 | 2006-10-03 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
| US7429516B2 (en) | 2002-02-26 | 2008-09-30 | Applied Materials, Inc. | Tungsten nitride atomic layer deposition processes |
| US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
| US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
| US7595263B2 (en) | 2003-06-18 | 2009-09-29 | Applied Materials, Inc. | Atomic layer deposition of barrier materials |