JPS6259461B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a method of manufacturing a hybrid integrated circuit.

Conventionally, hybrid integrated circuits have been manufactured as shown in FIGS. 1 and 2. That is, after printing solder paste at required locations on an insulating substrate, such as a circuit wiring board formed by thick film paste printing on one side of a ceramic substrate 1, integrated circuit elements (ICs), transistors, and diodes are printed on the solder paste. Mount semiconductor elements 2 such as capacitors, etc., heat them with a hot plate, etc., and solder them 4.
Along with cleaning, function trimming,
The method for taking out the outer leads of a hybrid integrated circuit, which is attached to a case (not shown) after undergoing processes such as characteristic checking, is as follows. First, as shown in FIG. 1A, an outer lead 5 having a head 6 is installed perpendicularly to an outer lead extraction electrode portion of a substrate 1, and soldered to the electrode portion. However, with this method, the leads 5 must be soldered one by one, which takes time and is not suitable for mass production.
Since the substrate 1 and the leads 5 are connected only by solder, there is a drawback that the adhesive strength against tension is weak.

There is a method shown in FIG. 1B that improves this adhesive strength. In this case, a hole 7 is provided in the part of the substrate 1 where the outer lead 5 is installed, and the lead 5 having a head 16 is inserted from the back side of the substrate 1. However, with this method, lead 5 is
Since the soldering part 4 is inserted one by one, the workability is poor, and since the contact area of the soldered part 4 on the surface of the board 1 is small, there is a drawback that it tends to become open. Therefore,
There is a method shown in FIG. 1C that has been improved to increase this contact area. This uses an outer lead 5 having a flange 8 in the middle, inserts this lead 5 from the surface of the substrate 1, and firmly fixes it by crushing the portion of the lead 5 that protrudes to the back side. However, this method also has the disadvantage that the leads 5 must be inserted one by one, and furthermore, the work step of crushing the protruding portions of the leads 5 on the back side of the substrate 1 is added.

Therefore, we have developed a second method that eliminates the complexity of soldering the leads 5 one by one to the electrode parts as described above, improves the adhesive strength against tension, and improves the floating from the substrate 1. There is a method as shown in the figure. In other words, in FIGS. 2A and 2B, solder paste is printed on the board 1 in advance, and the leads 5 are soldered to the solder paste part at the same time as the electronic components, thereby creating a lead frame in which multiple leads are integrated. It is used. In addition, in FIG. 2C, similarly to FIGS. 1B and 1C, a hole 7 is provided in the substrate 1 in advance, and the protrusion 9 of the lead 5 having a "T"-shaped tip is inserted into this hole 7.
It is soldered. Furthermore, Figure 2 D, E
In this method, a lead 5 having a concave tip is installed so that the recess 10 of the lead 5 grips the electrode part of the substrate 1, and is fixed by soldering in this state.

However, these lead frames have a stronger and easier attachment force to the substrate 1 than the lead pins shown in Fig. 1, but since each lead is integrated, it is necessary to attach the leads before checking the function trimming characteristics. Must be disconnected. In addition, in both the lead pins and lead frames in both Figures 1 and 2, the leads 5 protrude from the board 1, so the heat soldering, cleaning, and fusing after attaching the leads to the solder paste printed board are difficult. When checking the trimming characteristics, there was a problem that it was difficult to handle and the workability was extremely poor.

The present invention has been made in view of the above circumstances, and its purpose is to improve workability by soldering a metal piece to the electrode part from which the lead of the board is taken out, and welding the lead to this metal piece. Improve your
It is an object of the present invention to provide a method for manufacturing a hybrid integrated circuit that enables reliable and strong attachment of leads, improves reliability, and is excellent in mass production.

An embodiment of the present invention will be described below with reference to the drawings.

First, as shown in FIG. 3A, a circuit wiring board is formed by thick film paste printing on one side of a ceramic substrate 31 serving as an insulating substrate, and solder paste is printed on the electronic component mounting portion of this circuit wiring board. Next, active elements and passive elements, that is, semiconductor elements 32 such as ICs and transistors, capacitors 33, etc. are soldered to the parts provided with this solder paste, and at the same time, metal pieces 35 etc. are soldered to the electrode parts 34. do. This metal piece 35
is, for example, a copper (Cu) piece or an iron (Fe) piece plated with Ni or Sn. Next, after this soldering process is completed, processes such as cleaning and checking the function trimming characteristics are performed. Then the third
As shown in FIGS. B or C, a lead 37 or a lead frame 38 having a head 36 is automatically welded to the metal piece 35 using, for example, a welding machine. The leads 37 and lead frame 38 are, for example, soldered copper (Cu) wires.

As described above, the method of the present invention in which a metal piece is attached in advance and the lead is welded to the attached metal piece when attaching the lead has the following features.

With the exception of leads, all parts including metal pieces can be automatically mounted, and leads can also be automatically welded using a welding machine.
Therefore, there is no need for manual work in mounting parts, making it suitable for mass production.

Soldering, cleaning, function trimming, and characteristic checking processes are easier because there are no leads attached to the board, and handling is easier because the board can be stored in a magazine or the like during the process.

The leads are firmly welded using a welding machine, ensuring a secure connection and being more reliable than soldering.

Conventional lead pins and lead frames may require forming after the substrate leads are attached, depending on the direction in which the outer leads are taken out. However, according to the method of the present invention, any lead form can be selected, so forming the leads after attaching them to the substrate is not necessary.

Various effects such as these can be obtained.

[Brief explanation of the drawing]

1 and 2 are diagrams for explaining a conventional method for manufacturing a hybrid integrated circuit, and FIG. 3 is a diagram for explaining an embodiment of the method for manufacturing a hybrid integrated circuit according to the present invention. 31... Ceramic substrate, 32, 33... Electronic component, 34... Electrode section, 35... Metal piece, 36...
...Head, 37...Lead, 38...Lead frame.

Claims (1)

[Scope of Claims] 1. A method for manufacturing a hybrid integrated circuit, which comprises the steps of soldering a metal piece in advance and welding the lead to the metal piece when attaching the lead to the electrode portion of the hybrid integrated circuit board. 2. The method of manufacturing a hybrid integrated circuit according to claim 1, wherein the metal piece is a Cu or Fe plate plated with Ni or Sn. 3. The method of manufacturing a hybrid integrated circuit according to claim 1, wherein the metal piece is soldered in the same process as the electronic components of the hybrid integrated circuit.