JPS6248037A - Conveyor of diced wafer - Google Patents

Abstract

PURPOSE:To reduce in size a die mounting unit and to readily automatically convey a diced wafer by mounting the die while conveying the diced wafer by a striplike tape. CONSTITUTION:A diced wafer 1 is bonded together with a dicing tape 2 to a striplike tape 21, one end of the tape 21 is wound on a conveying roller, the tape 21 is wound on a roller, and a feeding claw 23 and a conveying pawl 24 are operated to convey the wafer 1 in the prescribed direction. When the wafer 1 arrives on a tape supporting pedestal 20 and is detected by a photosensor, the conveying roller is stopped. The tape 21 is interposed between tape retainers 25, 26 and the pedestal 20, and the tape 1 is secured to the pickup position of a pellet. The claw 23 and the pawl 24 and the retainer 25, 26 are operated in the prescribed sequence during the picking of the pellet and the mounting of the die by a vacuum collet 6.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a conveying device for diced wafers used in die mounting.

[Technical background of the invention]

From a wafer diced into multiple pellets, one pellet
In order to pick up ~ one by one and perform die mounting, a conveying device for diced wafers is used. FIG. 2 is a polygon cross-sectional view showing the schematic structure of a conventional conveying device. The tape 2 to which the diced wafer 1 is attached is placed on a tape fixing jig 3, and is firmly fixed to the jig 3 using a tape fixing ring 4. The tape fixing jig 3 has the ability to position the tape fixing ring 4 and stretch the tape 2. The tape fixing jig 3 to which the diced wafer 1 is fixed in this manner is attached to a predetermined position on a stand 5 of a die mounting device (not shown) by a person (operator). Therefore, the table 5 is configured to be moved to a predetermined position by an XY stage, and the diced pellets can be picked up.

When picking up pellets one by one from the diced wafer 1, suction is performed by the vacuum collet 6.

Then, the tape 2 is sucked and pressed by the holder 7 located on the opposite side of the vacuum collet 6, and at the same time is pushed up by the push-up pin 11. In this way, the pellets are separated from the tape 2 to some extent and are picked up by the vacuum collet 6.

FIG. 3 is a sectional view showing the detailed structure of the holder 7. As shown in FIG. The holder 7 has a structure that allows it to vacuum and support the tape 2 and at the same time push up the pellets on the tape 2. A vacuum port 8 is provided on the surface facing the tape 2, and the tape 2 is sucked and fixed by suction from a vacuum suction port 9. The boulder 7 has a push-up rod 11 housed in a vacuum cylinder 10 that also serves as a push-up rod guide.

A push-up pin 12 is provided on the top surface of the push-up rod 11, and this push-up pin 12 projects from the top surface of the vacuum cylinder 10 to push up the edges 1- of the tapes 20 set at opposing positions.

The pellets pushed up in this way are to some extent from tape 2! A! At the time of IJIli, the pellets 1- are sucked by the vacuum collet ~6. The pellet is then moved to a position for die mounting.

[Problems with contrarian technology]

In such a conventional device, die mounting 1- cannot be performed unless the tape fixing ring 4 is used. For this reason, the ring used in the previous Guissing step (2) must be used as is, which has the drawback of increasing the size of the die mounting device. Furthermore, since a ring is used, it is difficult to automatically transport diced wafers.

(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is possible to reduce the size of the die mounting device and to easily transport the diced wafer automatically. The purpose is to provide a conveyance device.

[Summary of the invention]

In order to achieve the above object, the present invention provides a strip tape to which a dicing tape to which a diced wafer is attached is attached, and a winding means for winding the strip tape in the longitudinal direction to move the diced wafer in a predetermined direction. and a detection means for detecting that the diced wafer has come to a predetermined position, and a stop means for stopping the movement of the strip tape when the detection means detects that the diced wafer has come to the predetermined position. A conveyance device is provided.

[Embodiments of the invention]

FIG. 1 is a sectional view of the main parts of a conveying device showing an embodiment of the present invention.

The tape support stand 20, which has a substantially U-shaped cross section, is a holder 7.
It has a structure surrounding it and 4. Vacuum collets 6 are provided above the holder 7 to face each other, and the diced I-cutter 1 attached to the dicing tape 2 is conveyed between them. The conveyance of the diced wafer 1 is carried out by a winding operation in which the strip tape 21 is wound in the longitudinal direction by a winding roller (not shown) for conveyance, and a tape feeding pawl 23.
This is performed by a combination of the feeding operation by the tape conveying claw 24 and the conveying operation by the tape conveying pawl 24. Detection that the diced wafer 1 has come to a predetermined position 1, that is, a position for die mounting, is performed by an optical sensor (not shown).

When the wafer 1 is detected by the sensor, the conveyance of the band-shaped chip 721 is stopped, the tape pressers 25 and 26 move in the direction of the arrow in the figure, and the wafer 1 is positioned at the die mount position.

Next, the operation of the above embodiment will be explained. First, the wafer 1 for dicing is placed on the strip tape 2 along with the dicing tape 2.
1, and one end of this strip tape 21 is wound around a conveying roller.

Then, the diced wafer 1 is transported in a fixed direction by winding the strip tape 21 around a roller and operating the delivery pawl 23 and the transport pawl 24.

When the diced wafer 1 reaches the top of the tape support stand 20 and is detected by the optical sensor, the conveyance rollers are stopped and the band-like chip 721 is stopped and retracted. and,
The strip tape 21 is held between the tape presser 25, 26 and the tape support 20, and the dicing tape 1 is fixed at the pellet pickup position.

During pellet pickup by the vacuum collet 6 and die mounting 1 to 1, the pawls 23, 24 and tape pressers 25, 26 operate in a predetermined order.

That is, the pellet is picked up when the tape presser 25.26 is lowered to fix the strip tape 21, and when the tape presser 25.26 is raised, the pellet is picked up by the feeding pawl 23 and the transport pawl 24. : The diced wafer 1 is moved.

After finishing the die mounting of one sheet, the tape pressers 25 and 26 are turned upward, and the strip tape 21 is wound up on a conveyance roller together with the dicing tape 2 and the defective blades 1 to 1. Then, the next diced wafer is let onto the tape support stand 20 by the strip tape 21.

According to the above example, the pre-process (guiding process) and the die mounting process can be easily connected. Further, there is an advantage that the disposal of defective holes 1- becomes extremely easy.

The present invention is not limited to the above embodiments, and various modifications are possible. For example, the tape conveyance device is not limited to a claw; for example, a hole may be provided near the outside of the tape, and a bottle may be inserted into the hole to convey the tape using the bottle. It is also possible to adsorb the central surface of the tape.

〔Effect of the invention〕

As explained above, according to the present invention, the diced wafer is die-mounted while being conveyed on a strip of tape, so the die-mounting device can be downsized, and the diced wafer can be mounted easily. A conveying device for diced wafers that can easily carry out automatic conveyance is obtained.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of the main parts of a transfer device according to an embodiment of the present invention, FIG. 2 is a sectional view of the main parts of a conventional transfer device, and FIG. FIG. 3 is a cross-sectional view showing the detailed configuration of the holder. DESCRIPTION OF SYMBOLS 1... Diced wafer, 2o... Tape for dicing, 21... Tape for conveyance, 22... Tape support stand, 23... Pawl for tape feeding, 24... Pawl for tape conveyance, 25.26 River IQ2 feeding tape presser. Applicant's agent Mr. Sato Figure 1

Claims (1)

[Scope of Claims] 1. A strip tape to which a dicing tape to which a diced wafer is attached is attached, and a winding means for winding the strip tape in the longitudinal direction to move the diced wafer in a predetermined direction; A diced wafer comprising a detection means for detecting that the diced wafer has come to a predetermined position, and a stop means for stopping the movement of the strip tape when the detection means detects that the diced wafer has come to a predetermined position. conveyance device. 2. The diced wafer conveyance apparatus according to claim 1, wherein the detection means includes an optical sensor.