JPS6246983B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION When stacked with a plurality of ceramic substrates, the present invention provides an element fixing region formed on the ceramic substrate and inner lead portions formed on other ceramic substrates connected to external electrodes. This invention relates to a semiconductor container in which it is possible to easily determine whether a metallized layer is electrically connected to a specific terminal.

Figure 1 shows a plan view of three ceramic substrates constituting a conventional semiconductor container.
A is a first ceramic substrate, on the surface of which a metalized element fixing region 2 is formed.
This metallized element fixing region 2 is formed by a known metal powder baking method. 1B is a second ceramic substrate on which a predetermined miniaturized metallization layer 3 for forming an inner lead portion is formed;
An opening 4 is formed in the center thereof. 1C
1 is a third ceramic substrate, which is used to protect built-in elements, internal thin metal wires, etc., and has a metalized sealing band 5 formed therein, and an opening 6 formed in the center thereof. The first ceramic substrate 1A also has a device for connecting the element fixing region 2 to specific terminals of the metallized layer 3 formed on the second ceramic substrate 1B and connected to external electrodes (not shown). A conductive layer 7 is provided from a portion of the element fixing region 2. The connection between the conductive layer 7 of the first ceramic substrate 1A and, for example, a specific terminal 8 of the second ceramic substrate 1B is made using a conductive layer formed on the side surface of each laminated ceramic substrate 1A, 1B, 1C as shown in FIG. They are connected by layer 9.

Each of these ceramic substrates 1A, 1B, 1C
In a hollow semiconductor container constructed by laminating layers, the following method is used to clarify the connection between the element fixing region 2 and a specific terminal of the metallized layer 3. That is, for example, as shown in FIG. 3a, a specific mark 10 (for example, its terminal number) may be placed on the surface of the third ceramic substrate 1C, or a specific mark 10 (for example, its terminal number) may be placed on the second ceramic substrate 1B at or near the specific terminal as shown in FIG. Forming a mark 11 as shown in b,
The connection point was determined. Note that 12 shown in FIG. 3a is a semiconductor element, and 13 is the semiconductor element 1.
2 and the inner lead portion provided on the metallized layer 3.

However, with this method, the same dimensions,
There are multiple types of semiconductor containers that have openings with the same external shape, the same dimensions, and inner lead parts arranged in the same way, and which connect the element fixing region 2 and the specific terminals of the metallized layer 3 where the inner lead parts are formed. When it is necessary to create one, there are the following drawbacks. In other words, each ceramic substrate 1A, 1B, 1C
The printing masks required to form the element fixing region 2, metallized layer 3, and sealing band 5 on the top are those for the element fixing region, the metallized layer formation, the sealing band formation, and the element fixing region 2. Four types of markings are required to clearly indicate the connection between the terminal and the specific terminal of the metallized layer 3. Further, even if the printing mask and the printing mask are formed on the same mask, the number of printing masks must be increased depending on the connection between the element fixing region 2 and the metallized layer 3. In addition, a printing mask for forming a mark may be overlaid on a printing mask for forming a metallized layer or a sealing band, or a separate printing mask may be formed to cover the element fixing region 2 and metallization. When connecting specific terminals on layer 3, it was necessary to change the printing mask for fixing the elements and the printing mask for forming marks according to each connection.

Therefore, not only the number of printing masks used increases, but also the process requires a lot of time.

This invention was made in order to eliminate the above-mentioned drawbacks, and at the same time as forming an element fixing area on a substrate, a missing part that serves as a mark for indicating a connection point is formed, thereby eliminating the need for increasing the number of printing masks. This makes it possible to clearly indicate the connection point between the element fixing region and the specific terminal of the metallized layer. This invention will be explained below.

FIG. 4 is a plan view of a semiconductor container showing an embodiment of the present invention, in which the same reference numerals as in FIGS. 1 to 3 indicate the same parts, and 14 indicates the first ceramic substrate 1A.
This is a missing portion that serves as a mark for indicating a connection point formed at the boundary between the upper element fixing region 2 and the metallized layer 3. This missing portion 14 is located within the area of the opening 4 of the second ceramic substrate 1B and directly below the specific terminal of the metallized layer 3 connected to the element fixing region 2 of the second ceramic substrate 1B, and is located at the connection point. It is designed to clearly indicate.

In order to form such a missing portion 14, when forming the element fixing area 2 and the conductive layer 7 on the printing mask 15 for the element fixing area, as shown in FIG. Missing part 14 at the boundary with
All you have to do is make it.

With this structure, the printing mask for forming a predetermined metallized layer on each ceramic substrate only needs to be changed depending on the connection state, and only the printing mask for the element fixing area can be changed. It becomes possible to share the printing mask for the sealing band and the printing mask for the sealing band.

As explained above, the present invention creates a missing part that serves as a mark to clearly indicate the connection point between the element fixing area and a specific terminal of the metallized layer that becomes the inner lead part when forming the element fixing area and the conductive layer. Since the semiconductor container is formed by simultaneously forming the semiconductor container, it is possible to easily identify the connection point between the element fixing region and the specific terminal of the metallized layer. Further, there are advantages such as fewer printing masks are needed to form a predetermined metallized layer, and the process is therefore simplified.

[Brief explanation of the drawing]

Fig. 1 is a plan view of three ceramic substrates constituting a conventional semiconductor container, and Fig. 2 shows a method of connecting the device fixing region and specific terminals of the metallized layer when the ceramic substrates of Fig. 1 are stacked. FIGS. 3a and 3b are diagrams for explaining the arrangement of marks for indicating the connection points between the conventional element fixing region and a specific terminal of the metallized layer, and FIG. 4 is a partially enlarged perspective view of the present invention. FIG. 5 is a plan view of a printing mask used in forming the missing portion of the present invention. In the figure, 1A, 1B, 1C are ceramic substrates, 2
3 is an element fixing region, 3 is a metallized layer, 4 and 6 are openings, 5 is a sealing band, 9 is a conductive layer, and 14 is a missing portion. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] 1 An element fixing region formed by metallizing the surface of an insulating plate and a conductive layer led out from this element fixing region to an end of the surface of the insulating plate, and an element in the vicinity of the joint between the element fixing region and the conductive layer. a first substrate having a missing portion of metal in the bonded region;
is laminated on the surface of the substrate, has an opening through which at least a part of the element fixing area and the missing part are exposed at a portion facing the element fixing area, and has one end disposed at a position facing the missing part on the surface of the insulating plate. A semiconductor container comprising a second substrate formed by metallizing a lead layer provided thereon and electrically connected to the conductive layer.