JPS6243493A - Heat-conductive silicone grease - Google Patents
Heat-conductive silicone greaseInfo
- Publication number
- JPS6243493A JPS6243493A JP60182750A JP18275085A JPS6243493A JP S6243493 A JPS6243493 A JP S6243493A JP 60182750 A JP60182750 A JP 60182750A JP 18275085 A JP18275085 A JP 18275085A JP S6243493 A JPS6243493 A JP S6243493A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- silicone grease
- boron nitride
- grease
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004519 grease Substances 0.000 title claims abstract description 33
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 24
- 229910052582 BN Inorganic materials 0.000 claims abstract description 16
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 6
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 5
- 125000003118 aryl group Chemical group 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 15
- 238000010292 electrical insulation Methods 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- -1 amine compounds Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000002199 base oil Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910001337 iron nitride Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940065287 selenium compound Drugs 0.000 description 1
- 150000003343 selenium compounds Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Lubricants (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明はシリコーングリースに関する。さらに詳しくは
電気・電子機器類に組み込まれる各種電気・電子素子の
うち、熱を発生する素子を機器類に保存固定させる際に
放熱を目的として用いられる放熱用グリースであって、
優れた熱伝導性と電気絶縁性を兼備えた熱伝導性シリコ
ーングリースに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to silicone grease. More specifically, it is a heat dissipation grease that is used for the purpose of dissipating heat when storing and fixing heat-generating elements among various electrical and electronic elements incorporated in electrical and electronic equipment.
Related to thermally conductive silicone grease that has both excellent thermal conductivity and electrical insulation.
［発明の技術的背景とその問題点］
近年、各種電気・電子機器の小型化、高密度化に伴ない
、これらの機器に組み込まれる電気・電子素子、たとえ
ばパワートランジスター、サイリスター、整流器、トラ
ンスなどにおける発熱への対策が大きくクローズアップ
されている。[Technical background of the invention and its problems] In recent years, with the miniaturization and higher density of various electrical and electronic devices, the electrical and electronic elements incorporated in these devices, such as power transistors, thyristors, rectifiers, transformers, etc. Countermeasures against fever in Japan are attracting a lot of attention.
従来、このような熱を発生する電気・電子素子類を放熱
器や金属製シャシ−に固定する際の放熱対策として、放
熱用グリースが用いられている。Conventionally, heat dissipation grease has been used as a heat dissipation measure when fixing such heat-generating electric/electronic elements to a radiator or a metal chassis.
なかでも、基油にポリオルガノシロキサンを用いたシリ
コーングリースは、一般の炭化水素系の潤滑油を基油と
したグリースに比較して、温度変化に対するちょう度な
どの特性変化が少なく、さらに耐熱性が漫れているため
、多用されている。Among these, silicone greases that use polyorganosiloxane as the base oil have less change in properties such as consistency due to temperature changes than greases that use general hydrocarbon-based lubricating oils as the base oil, and also have higher heat resistance. It is widely used because it is widely used.
このようなグリース組成物を形成するための放熱用充填
剤としては、酸化亜鉛、酸化アルミニウムなどの金属酸
化物、ベントナイト、カーボンブラックなどが用いられ
ている。しかしながら、これらの充填剤はそれ自体の熱
伝導率があまり高くないため、配合量が少ないと余り良
い放熱効果を示さず、配合量を増して熱伝導性を良くす
ると、グリースが固くなりすぎて使用に適しづらいとい
う問題がある。また、充填剤として熱伝導率の高い金属
粉を用いると、熱伝導性が高くなるかわりに電気絶縁性
を失うという問題がある。As heat dissipating fillers for forming such grease compositions, metal oxides such as zinc oxide and aluminum oxide, bentonite, and carbon black are used. However, these fillers themselves do not have very high thermal conductivity, so if the amount added is small, they will not show very good heat dissipation effects, and if the amount added is increased to improve thermal conductivity, the grease will become too hard. The problem is that it is difficult to use. Further, when a metal powder with high thermal conductivity is used as a filler, there is a problem that electrical insulation is lost at the cost of increasing thermal conductivity.
すなわち、現在用いられている放熱用グリースでは、各
種電気・電子素子の発熱を充分に放熱していないという
問題があった。That is, the currently used heat dissipating grease has a problem in that it does not sufficiently dissipate the heat generated by various electrical and electronic elements.
［発明の目的］
本発明はこのような従来の問題を解決するためになされ
たもので、熱伝導性および電気絶縁性に優れたシリコー
ングリースを得ることを目的とする。[Object of the Invention] The present invention was made in order to solve such conventional problems, and an object of the present invention is to obtain a silicone grease having excellent thermal conductivity and electrical insulation.
［発明のｍ要］
すなわち本発明の熱伝導性シリコーングリースは、
（Ａ）一般式［ＲＩ Ｓ ｉ Ｏ＋ａ−ａ＋／２］ ｎ
（但し、式中Ｒ１は炭素数１〜１２のアルキル基、アル
ケニル基、および置換または非置換のアリール基からな
る群から選ばれた１価の基、ａは１．９〜２．７の数、
ｎは正数）で表わされるポリオルガノシロキサン １０
０重量部
（Ｂ）ボロンナイトライド ５０〜ｉ、ｏｏｏｉｌ １
部から成ることを特徴とする。[Main points of the invention] That is, the thermally conductive silicone grease of the present invention has the following formula: (A) General formula [RISiO+a-a+/2] n
(However, in the formula, R1 is a monovalent group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an alkenyl group, and a substituted or unsubstituted aryl group, and a is a number of 1.9 to 2.7. ,
polyorganosiloxane (n is a positive number) 10
0 parts by weight (B) Boron nitride 50~i, oooil 1
It is characterized by consisting of parts.
本発明の（Ａ）のポリオルガノシロキサン、一般式［Ｒ
Ａ ＳｉＣ（４−６１／２ Ｆ ｎにおけるＲ１は炭素
数が１〜１２のアルキル基、アルケニル基および置換ま
たは非置換のアリール基からなる群から選ばれた１価の
基である。炭素数が１２を越えると取扱いに不便が生じ
熱安定性が低下するので好ましくない。Ｒ’は同一のも
のでも異なるものでもよい。The polyorganosiloxane (A) of the present invention has the general formula [R
A SiC (4-61/2 F R1 in n is a monovalent group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an alkenyl group, and a substituted or unsubstituted aryl group. If it exceeds 12, it is not preferable because handling becomes inconvenient and thermal stability decreases.R' may be the same or different.
Ｒ１としては、メチル基、エチル基、プロピル基、ブチ
ル基、ペンチル基、ヘキシル基、オクチル基、デシル基
、ドデシル基のようなアルキル基、ビニル基、アリル基
のようなアルケニル基、フェニル基、塩素化フェニル基
のようなアリール基等が例示されるが、合成のし易さ、
耐熱性の点からメチル基が最も一般的に用いられる。R1 is an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, an octyl group, a decyl group, a dodecyl group, an alkenyl group such as a vinyl group or an allyl group, a phenyl group, Examples include aryl groups such as chlorinated phenyl groups, but ease of synthesis,
Methyl group is most commonly used from the viewpoint of heat resistance.
また上記（Ａ）の一般式中の ａが１．９より小さいと
硬くなるので使用できず、２．７より大きいと適正な粘
度範囲が得られない。また、上記（Ａ）の一般式のｎは
、以下に述べる粘度を満足させる数であることが好まし
い。Further, if a in the general formula (A) above is less than 1.9, the material becomes hard and cannot be used, and if it is larger than 2.7, an appropriate viscosity range cannot be obtained. Further, n in the general formula (A) above is preferably a number that satisfies the viscosity described below.
すなわちこれら（Ａ＞のポリオルガノシロキサンは、温
度２５℃において３０〜５００，０００ ａｓ ｔの粘
度を有することが望ましく、ざらに５０〜１００，００
０ｃ３ｔであることがより望ましい。３０ｃＳｔ未満で
はポリオルガノシロキサンの揮発性が大きくなり、かつ
得られたグリースが流れやすくなる場合があるため好ま
しくない。逆にその粘度がｓｏｏ、。That is, these polyorganosiloxanes (A>) desirably have a viscosity of 30 to 500,000 ast at a temperature of 25°C, and approximately 50 to 100,000 ast.
More preferably, it is 0c3t. If it is less than 30 cSt, the volatility of the polyorganosiloxane increases and the obtained grease may flow easily, which is not preferable. On the other hand, its viscosity is soooo.
００Ｃ８ｔを越えるものは、合成しにくく、かつ作業し
にくい場合があるので好ましくない。Those exceeding 00C8t are not preferable because they are difficult to synthesize and may be difficult to work with.
（Ｂ）のボロンナイトライドは、六角網面の積み重なり
の結晶構造を有する粉末で、極めて高い熱伝導率を示す
セラミックスである。このボロンナイトライドは製造方
法により種々の粒傍を有するものが得られるが、本発明
において良好な熱伝導率を有し、かつグリース状を保っ
た組成物を得るためには、粒径が０．０１〜１００μｍ
のものを使用することが好ましい。０．０１μｍ未満の
ボロンナイトライドは製造することが困難であり、また
（Ａ）のポリオルガノシロキサンと混合して均一なシリ
コーングリースを形成することが難しい場合がある。ま
た、１００μｍを超えると、得られる組成物がグリース
状を保ちにくくなり、また経時的な（Ａ）のポリオルガ
ノシロキサンの分Ｉｌｌが大きくなる場合があるので好
ましくない。Boron nitride (B) is a powder having a crystal structure of stacked hexagonal mesh planes, and is a ceramic exhibiting extremely high thermal conductivity. This boron nitride can be obtained with various grain sizes depending on the manufacturing method, but in the present invention, in order to obtain a composition that has good thermal conductivity and maintains a grease-like shape, the particle size must be 0. .01~100μm
It is preferable to use Boron nitride with a diameter of less than 0.01 μm is difficult to produce, and it may be difficult to mix it with the polyorganosiloxane (A) to form a uniform silicone grease. Moreover, if it exceeds 100 μm, it is not preferable because it becomes difficult for the resulting composition to maintain a grease-like appearance, and the amount of polyorganosiloxane (A) may increase over time.
なお、ボロンナイトライドは、同一の粒径を有するもの
を用いるより、０．０１〜１００μｌの粒径の範囲で何
種かのものをブレンドして使用する方が、より良好なグ
リース状組成物が１りられる。It should be noted that it is better to use a blend of several types of boron nitride in the particle size range of 0.01 to 100 μl than to use boron nitrides with the same particle size to create a better grease-like composition. You can get 1.
（Ｂ）のボロンナイトライドの配合量は、（Ａ）のポリ
オルガノシロキサン １００重量部に対し５０〜１，
０００重量部、さらに好ましくは６６〜１，０００重恐
部である。５０重量部未満では良好な熱伝導性が得られ
ず、また １，０００重邑都合超えても熱伝導率向上の
効果が少なくなるのみならず、（Ａ）と混合しずらくま
た得られる組成物が固すぎてグリース状を保てなくなる
。The blending amount of boron nitride (B) is 50 to 1,000 parts per 100 parts by weight of the polyorganosiloxane (A).
000 parts by weight, more preferably 66 to 1,000 parts by weight. If it is less than 50 parts by weight, good thermal conductivity cannot be obtained, and if it exceeds 1,000 parts by weight, not only will the effect of improving thermal conductivity be reduced, but it will also be difficult to mix with (A), and the resulting composition will deteriorate. Things get too hard and don't stay greasy.
本発明の熱伝導性シリコーングリースの組成物の基本組
成は以上のものであり、熱伝導性および電気絶縁性に浸
れ、かつ油分離の小さいシリコーングリースが得られる
が、さらに厳しい条件下での油分離の小さいグリースが
必要な場合はシリカ微粉末を共有することが好ましい。The basic composition of the thermally conductive silicone grease composition of the present invention is as described above, and a silicone grease with excellent thermal conductivity and electrical insulation properties and low oil separation can be obtained. If a grease with little separation is required, it is preferable to share fine silica powder.
このようなシリカ微粉末としては、煙霧質シリカおよび
それをオルガノシラン、ポリオルガノシロキサン、ポリ
オルガノシラザンなどで表面処理したものがあげられる
。このシリカ微粉末の配合量としては、（Ａ＞のポリオ
ルガノシロキサン １００ｆｆｉ ８部に対して１０
重山部以下が好ましく、さらに０．１〜１０重量部が好
ましい。１０重量部を超えると、組成物を固くしたり熱
伝導率を低くする。Examples of such fine silica powder include fumed silica and those surface-treated with organosilane, polyorganosiloxane, polyorganosilazane, and the like. The blending amount of this fine silica powder is 10 parts per 100ffi of polyorganosiloxane (A>).
It is preferably less than a heavy mountain part, and more preferably 0.1 to 10 parts by weight. If the amount exceeds 10 parts by weight, the composition becomes hard and the thermal conductivity becomes low.
また、酸化亜鉛、酸化アルミニウムなどの他の放熱性充
填剤を併用したり、必要に応じて通常のグリースに配合
される添加剤として、たとえばアミン系化合物やセレン
系化合物などの酸化防止剤、また油性向上剤などを本発
明の目的・効果を損わない限り任意量配合してもよい。In addition, other heat dissipating fillers such as zinc oxide and aluminum oxide may be used together, and if necessary, antioxidants such as amine compounds and selenium compounds may be used as additives added to ordinary grease. Any amount of oiliness improver etc. may be added as long as it does not impair the purpose and effect of the present invention.
本発明の熱伝導性シリコーングリースの製造は、たとえ
ば（Ａ）および（８）成分、さらに必要において充填剤
や添加剤などを配合し、撹拌装置付の加熱釜に仕込んで
均一になるよう撹拌し、さらに約 １００〜１６０℃で
加熱混練した後に常温に戻し、三本ロール、ペイントロ
ールなどを用いて均質化する方法、また加熱をせずに均
一にした組成物を三本ロール、ペイントロールなどで均
質化する方法などがあり、必要によって選ぶことができ
る。The thermally conductive silicone grease of the present invention is manufactured by, for example, mixing components (A) and (8), and fillers and additives if necessary, and placing the mixture in a heating pot equipped with a stirring device and stirring it until uniform. Furthermore, after heating and kneading at about 100 to 160°C, the mixture is returned to room temperature and homogenized using a three-roll roll, a paint roll, etc., or a method of homogenizing the composition without heating, using a three-roll roll, a paint roll, etc. There are several methods of homogenization, which you can choose depending on your needs.
［発−明の効果１
本発明によれば、従来の放熱用シリコーングリースにな
い、良好な熱伝導性と電気絶縁性に優れたグリースを得
ることができる。また、得られるグリースは油分離が小
さく、また従来の金属酸化物使用のシリコーングリース
と比較して比重が小さいなどの利点を有する。[Advantageous Effects of the Invention 1] According to the present invention, it is possible to obtain a grease that has good thermal conductivity and excellent electrical insulation properties, which are not found in conventional heat dissipation silicone greases. Furthermore, the resulting grease has advantages such as low oil separation and low specific gravity compared to conventional silicone greases using metal oxides.
［発明の実施例コ
以下、本発明を実施例により説明する。なお、実施例中
の部はすべて重債部を示し、また熱伝導率、ちょう度お
よび離油度は下記の装置または方法にて測定した。[Examples of the Invention] The present invention will be explained below with reference to Examples. In addition, all parts in Examples indicate heavy parts, and thermal conductivity, consistency, and oil separation were measured using the following apparatus or method.
熱伝導率：昭和電工■社製 Ｓ ｈｏｔｂｃｒｍ Ｑ
Ｔ Ｍ −ＤＩ迅速熱伝導率計
ちょう度：ＪＩＳ Ｋ ２２２０に準じ、混和ちょ
う度を測定
離油度 ：ＪＩＳ Ｋ ２２２０に準じ、１５０℃
、２４時間加熱
実施例１
式
で示される、２５℃における粘度が１，０００ ｃ３
ｔのポリジメチルシロキサン １００部とボロンナイ
トライド（デンカボロンナイトライド−ＧＰ、粒度１〜
５μ■、電気化学工業■装面品名）粉末１００部とを撹
拌器付加熱釜に仕込み、常温で撹拌して均一に混合した
後、さらに１５０℃で２時間加熱混合した。この混合物
を放冷して常温に戻した侵、ペイントロールで均質化し
てシリコーングリースＳ−１を得た。Thermal conductivity: S hotbcrm Q manufactured by Showa Denko
TM-DI Rapid Thermal Conductivity Meter Penetration: Measured worked penetration according to JIS K 2220 Oil separation: 150℃ according to JIS K 2220
, 24-hour heating Example 1 The viscosity at 25°C is 1,000 c3 as shown by the formula
100 parts of polydimethylsiloxane and boron nitride (Denka boron nitride-GP, particle size 1~
5μ■, Denki Kagaku Kogyo Co., Ltd.) 100 parts of the powder were placed in a hot pot with a stirrer, stirred at room temperature to mix uniformly, and then heated and mixed at 150°C for 2 hours. This mixture was allowed to cool to room temperature, and then homogenized using a paint roll to obtain silicone grease S-1.
比較例として、実施例１のポリジメチルシロキサン １
００部と酸化亜鉛粉末 １００部を、実施例１と同様の
方法で調製し、シリコーングリースＣ−１を得た。As a comparative example, polydimethylsiloxane 1 of Example 1
00 parts and 100 parts of zinc oxide powder were prepared in the same manner as in Example 1 to obtain silicone grease C-1.
また、比較例として実施例１のポリジメチルシロキサン
１００部と酸化亜鉛粉末 ３００部、およびヘキサメ
チルジシラザンで処理した煙霧質シリカ１２部を、実施
例１と同様の方法で調製し、シリコーングリースＣ−２
を得た。As a comparative example, 100 parts of the polydimethylsiloxane of Example 1, 300 parts of zinc oxide powder, and 12 parts of fumed silica treated with hexamethyldisilazane were prepared in the same manner as in Example 1, and silicone grease C -2
I got it.
実施例２
式
で示されるポリオルガノシロキサン １００部と実施
例１に用いたボロンナイトライド粉末１５０部を、実施
例１と同様の方法で調整し、シリコーングリースＳ−２
を得た。Example 2 100 parts of the polyorganosiloxane represented by the formula and 150 parts of the boron nitride powder used in Example 1 were prepared in the same manner as in Example 1, and silicone grease S-2 was prepared.
I got it.
比較例として実施例２のポリオルガノシロキサン １
００部と酸化アルミニウム粉末 ４００部を、実施例
１と同様の方法で調整し、シリコーングリースＣ−３を
得た。Polyorganosiloxane 1 of Example 2 as a comparative example
00 parts and 400 parts of aluminum oxide powder were prepared in the same manner as in Example 1 to obtain silicone grease C-3.
実施例３
式
％式％
で示されるポリオルガノシロキサン １００ｉＪ ｆｆ
ｉ部と実施例１に用いたボロンナイトライド粉末１２０
部およびヘキサメチルジシラザンで処理した煙霧質シリ
カ５部を、実施例１と同様の方法で調整し、シリコーン
グリースＳ−３を得た。Example 3 Polyorganosiloxane represented by formula % formula % 100iJ ff
Part i and boron nitride powder 120 used in Example 1
1 part and 5 parts of fumed silica treated with hexamethyldisilazane were prepared in the same manner as in Example 1 to obtain silicone grease S-3.
（以下余白）
実施例４
式
％式％
で示されるポリオルガノシロキサン １００部と実施例
１に用いたボロンナイトライド ２３３部を、実施例１
と同様の方法で調整し、シリコーングリースＳ−４を得
た。(Left below) Example 4 100 parts of polyorganosiloxane represented by the formula % and 233 parts of the boron nitride used in Example 1 were added to Example 1.
Silicone grease S-4 was obtained in the same manner as above.
以上得られた本発明のグリースＳ−１〜Ｓ−４および比
較例のグリースＣ−１〜Ｃ−３について、熱伝導率、比
重、ちょう度および離油度を測定した。その結果を次表
に示す。Thermal conductivity, specific gravity, consistency, and oil separation were measured for the greases S-1 to S-4 of the present invention and the greases C-1 to C-3 of comparative examples obtained above. The results are shown in the table below.
（以下余白）(Margin below)
Claims (5)
ａ＿）＿／＿２］＿ｎ（但し、式中Ｒ＾１は炭素数１〜
１２のアルキル基、アルケニル基、および置換または非
置換のアリール基からなる群から選ばれた１価の基、ａ
は１．１〜２．７の数、ｎは正数）で表わされるポリオ
ルガノシロキサン１００重量部 （Ｂ）ボロンナイトライド５０〜１，０００重量部から
成ることを特徴とする熱伝導性シリコーングリース。(1) (A) General formula [R^1_aSiO_(_4_-_
a_)_/_2]_n (However, in the formula, R^1 is a carbon number of 1 to
a monovalent group selected from the group consisting of 12 alkyl groups, alkenyl groups, and substituted or unsubstituted aryl groups, a
is a number from 1.1 to 2.7, and n is a positive number) 100 parts by weight of a polyorganosiloxane (B) 50 to 1,000 parts by weight of boron nitride. .
００ｃＳｔである特許請求の範囲第１項記載の熱伝導性
シリコーングリース。(2) The viscosity of (A) at 25°C is 30 to 500.0
The thermally conductive silicone grease according to claim 1, which has a temperature of 00 cSt.
００ｃＳｔである特許請求の範囲第１項記載の熱伝導性
シリコーングリース。(3) The viscosity of (A) at 25°C is 50 to 100.0
The thermally conductive silicone grease according to claim 1, which has a temperature of 00 cSt.
１００μｍである特許請求の範囲第１項記載の熱伝導シ
リコーングリース。(4) The particle size of boron nitride in (B) is 0.01~
The thermally conductive silicone grease according to claim 1, which has a diameter of 100 μm.
００重量部に対し６６〜１，０００重量部である特許請
求の範囲第１項記載の熱伝導性シリコーングリース。(5) The amount of boron nitride in (B) is (A) 1
The thermally conductive silicone grease according to claim 1, wherein the amount is 66 to 1,000 parts by weight based on 00 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60182750A JPH066715B2 (en) | 1985-08-20 | 1985-08-20 | Thermally conductive silicone grease |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60182750A JPH066715B2 (en) | 1985-08-20 | 1985-08-20 | Thermally conductive silicone grease |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6243493A true JPS6243493A (en) | 1987-02-25 |
| JPH066715B2 JPH066715B2 (en) | 1994-01-26 |
Family
ID=16123781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60182750A Expired - Lifetime JPH066715B2 (en) | 1985-08-20 | 1985-08-20 | Thermally conductive silicone grease |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066715B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03162493A (en) * | 1989-11-20 | 1991-07-12 | Shin Etsu Chem Co Ltd | Grease composition for heat dissipation |
| JPH07102274A (en) * | 1993-09-13 | 1995-04-18 | Dow Corning Corp | Grease composition comprising fluorinated polymer oil and hexagonal lattice boron nitride |
| JP2012520923A (en) * | 2009-03-16 | 2012-09-10 | ダウ コーニング コーポレーション | Thermally conductive grease, and method and device using the grease |
| US10683444B2 (en) | 2015-05-22 | 2020-06-16 | Momentive Performance Materials Japan Llc | Thermally conductive composition |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5041098A (en) * | 1973-08-15 | 1975-04-15 | ||
| JPS5155870A (en) * | 1974-10-14 | 1976-05-17 | Shinetsu Chem Ind Co | SHIRIKOONGURIISUSOSEIBUTSU |
| JPS54116055A (en) * | 1978-03-01 | 1979-09-10 | Toray Silicone Co Ltd | Thermally conductive silicone composition |
| JPS5592800A (en) * | 1978-12-29 | 1980-07-14 | Matsushita Electric Ind Co Ltd | Grease for oil damper |
| JPS55146688A (en) * | 1980-03-26 | 1980-11-15 | Hitachi Ltd | Magnetic bubble memory module for high-speed drive |
| JPS5736302A (en) * | 1980-08-14 | 1982-02-27 | Yokogawa Hokushin Electric Corp | Controller |
-
1985
- 1985-08-20 JP JP60182750A patent/JPH066715B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5041098A (en) * | 1973-08-15 | 1975-04-15 | ||
| JPS5155870A (en) * | 1974-10-14 | 1976-05-17 | Shinetsu Chem Ind Co | SHIRIKOONGURIISUSOSEIBUTSU |
| JPS54116055A (en) * | 1978-03-01 | 1979-09-10 | Toray Silicone Co Ltd | Thermally conductive silicone composition |
| JPS5592800A (en) * | 1978-12-29 | 1980-07-14 | Matsushita Electric Ind Co Ltd | Grease for oil damper |
| JPS55146688A (en) * | 1980-03-26 | 1980-11-15 | Hitachi Ltd | Magnetic bubble memory module for high-speed drive |
| JPS5736302A (en) * | 1980-08-14 | 1982-02-27 | Yokogawa Hokushin Electric Corp | Controller |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03162493A (en) * | 1989-11-20 | 1991-07-12 | Shin Etsu Chem Co Ltd | Grease composition for heat dissipation |
| US5100568A (en) * | 1989-11-20 | 1992-03-31 | Shin-Etsu Chemical Co., Ltd. | Heat-dissipating grease composition |
| JPH07102274A (en) * | 1993-09-13 | 1995-04-18 | Dow Corning Corp | Grease composition comprising fluorinated polymer oil and hexagonal lattice boron nitride |
| US6040277A (en) * | 1993-09-13 | 2000-03-21 | Dow Corning Corporation | Grease compositions employing fluorinated polymer oils and hexagonal lattice boron nitride |
| JP2012520923A (en) * | 2009-03-16 | 2012-09-10 | ダウ コーニング コーポレーション | Thermally conductive grease, and method and device using the grease |
| US10683444B2 (en) | 2015-05-22 | 2020-06-16 | Momentive Performance Materials Japan Llc | Thermally conductive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066715B2 (en) | 1994-01-26 |
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