JPS62296429A - Encapsulating metal mould for manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To protect a semiconductor device from a defect of lack of filling or from a void by a method wherein a cavity is provided around a pot for the purpose of controlling heat to be applied to resin during a resin injecting process. CONSTITUTION:A cavity 7 is provided around a pot 1 belonging in an encapsulating mould 2. Air or the like is caused to flow into the cavity 7 for the control of beat to be applied to resin tablets 4 by a heater 5. Accordingly, the resin, to be supplied to a semiconductor device encapsulating section through a runner 6 when a plunger 3 is lowered, may be controlled in its degree of beat-caused setting. In this way, possibility is lowered of the appearance of a semiconductor device being poor after its encapsulation (due to insufficient filling or to void), which simultaneously allows the semiconductor device to be provided with improved reliability.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a structure around a pot of an encapsulation mold for manufacturing semiconductor devices.

[Conventional technology]

The structure around the pot of the conventional encapsulation mold for manufacturing semiconductor devices is shown in FIGS. 2(A) and 2(B), respectively, as a plan view and a sectional view. is added through the enclosing mold 2 and pressed with the plunger 3.

The pressed resin melts and reaches the semiconductor sealing portion through the runner 6.

[Problem that the invention seeks to solve]

The biggest drawback of the conventionally used encapsulation mold for manufacturing semiconductor devices is that the heat capacity of the encapsulation mold is large, so too much heat is transferred to the resin, and the resin hardens too much. The condition of the resin sent to the semiconductor device changes, resulting in unfilled or void defects occurring in the semiconductor device.

[Means for solving problems]

The encapsulation mold for semiconductor manufacturing according to the present invention is constructed by providing a hollow part around the pot to allow air or the like to flow therein.

〔Example〕

The present invention will be explained in detail below with reference to the drawings. Figure 1 (A>
and (B) are a plan view and a sectional view showing one embodiment of the present invention. In the same figure, a hollow 7 is formed around a pot in an encapsulation mold 2, and by flowing air or the like into the hollow 7, the heat transmitted from the heater 5 to the resin 4 can be restricted and controlled. Therefore, the plunger 3 is lowered and the resin 4 is transferred to the runner 6.
It is possible to control the degree of thermosetting of the resin sent to the semiconductor device sealing part through the heat exchanger.

〔Effect of the invention〕

In this way, by creating a hollow around the pot of an encapsulation mold for manufacturing semiconductor devices, the degree of thermosetting of the resin can be controlled, reducing appearance defects (such as unfilled defects or void defects) after encapsulating semiconductor devices, and further It becomes possible to improve the reliability of the semiconductor device.

[Brief explanation of the drawing]

FIGS. 1(A) and 1(B) are a plan view and a sectional view, respectively, showing an embodiment of the present invention. Figure 2 (A) and (B)
) are a plan view and a sectional view showing a conventional example. 1...Pot, 2...Enclosed mold, 3.
... Plunger, 4 ... Resin tablet, 5 ... Heater, pre-load

Claims (1)

[Claims] An encapsulation mold for semiconductor device manufacturing, characterized by having a hollow space around the pot to control heat applied to resin during resin injection.