JPS62293737A - Method for removing semiconductor small piece from resin sheet - Google Patents

Abstract

PURPOSE:To remove a semiconductor small piece having thin thickness and a large area excellently from a resin sheet by moving a push-up bar in the cross direction as the end section of the semiconductor small piece is left as it is pushed up by the push-up bar and reducing the area of bonding of the resin sheet and the semiconductor small piece. CONSTITUTION:A push-up bar 22 with a needle-like nose is lifted, the end section of a desired semiconductor small piece 21 to be removed is thrusted up up to predetermined height from a lower section through a resin sheet 20, the height of the push-up bar 22 is held, and the push-up bar 22 is shifted in the cross direction. The resin sheet 20 is peeled gradually from the back of the semiconductor small piece 21 with movement in the cross direction of the push up bar 22 at that time, thus reducing the contact area of the semiconductor small piece 21 and the resin sheet 20. Since the resin sheet 20 is peeled from the back of the semiconductor small piece 21 while the push-up bar 22 is transferred, excess stress is not applied to the semiconductor small piece 21. Accordingly, even the semiconductor small piece 21 having thin thickness and a large area is not cracked and is removed from the resin sheet, and the push-up bar 22 also does not break through the resin sheet 20.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention Industrial Application Field The present invention relates to a method for removing small semiconductor pieces from a resin sheet, and particularly relates to a method for removing small semiconductor pieces from a resin sheet, and in particular, small semiconductor pieces separated into individual pieces by dicing and arranged on an adhesive resin sheet. The present invention relates to a method for individually removing the adhesive resin sheets from the adhesive resin sheet.

Conventional Technology A conventional example is shown in FIG. 1 is an adhesive resin sheet (hereinafter referred to as
(simply referred to as a resin sheet), 2 is a small semiconductor piece, 3 is a push-up rod, and 4 is a suction jig. Individually divided semiconductor pieces 2 are already aligned on the whole surface of the resin sheet 1.
The resin sheet 1 is expanded and fixed at a constant interval in order to prevent the aligned semiconductor pieces 2 and other adjacent semiconductor pieces 1' from being cracked or chipped due to contact during pushing up.

In the conventional method, the center of the desired semiconductor chip 2 to be removed is pushed up from below to a predetermined height through the resin sheet 1 using a push-up rod 3 having a needle-like tip, and the semiconductor chip 2 and the resin sheet 1 are separated from each other. (Fig. 2 (A)), and then the suction jig 2 having suction and suction functions is used.
3 to attract and hold the semiconductor piece 2 and remove it from the resin sheet 1 (FIG. 2(B)).

The problem that the invention seeks to solve In the conventional method, the following problems occurred.

1) When a small semiconductor piece 2 with a small thickness and a large area was pushed up with a push-up rod 3, damage such as cracking of the semiconductor piece 2 occurred, reducing the yield (see Fig. 3). A
)).

2) If the pushing up speed and amount of pushing up of the pushing up bar 3 were inappropriate, the tip of the pushing up bar 3 would break through the resin sheet 1, extremely worsening the workability (Fig. 3 (B)).

In order to solve the above-mentioned problems, the present invention aims to effectively remove small semiconductor pieces with a small thickness and large area from a resin sheet without damaging the small semiconductor pieces and the resin sheet during pushing up. This is a method for removing small semiconductor pieces.

Means for Solving the Problems The present invention pushes up the end of a small semiconductor piece from below through a resin sheet with a push-up rod having a needle-like tip.
While maintaining this state, the push-up rod is moved in the horizontal direction to reduce the contact area between the semiconductor piece and the resin sheet, and the semiconductor piece is removed from the resin sheet.

Operation: The end of the semiconductor piece adhered to the resin sheet is pushed up with a push-up rod, and while this state is maintained, the push-up bar is moved laterally to reduce the adhesion area between the resin sheet and the semiconductor piece. With this method, the resin sheet is peeled off almost perpendicularly to the semiconductor piece, so that no excessive stress is applied to the semiconductor piece and the semiconductor piece is not damaged. Furthermore, since the push-up rod moves laterally, the force is not concentrated at one point on the resin sheet, so the push-up rod does not break through the resin sheet.

Embodiment An embodiment of the present invention is shown in FIG. 20 is a resin sheet, 21 is a small semiconductor piece, 22 is a push-up rod, and 23 is a suction jig. Semiconductor pieces 21 that have been individually divided by dicing or the like are lined up on the whole surface of the resin sheet 20, and when the semiconductor pieces 21 are pushed up, they are prevented from being damaged by cracking, chipping, etc. due to contact with other semiconductor pieces 21'. To do this, the resin sheet 20 is expanded and fixed with a space provided between the semiconductor/J% pieces.

To remove the semiconductor piece 21 from the resin sheet 20, first raise the push-up rod 22 having a needle-like tip, and then push the end of the desired semiconductor piece 21 to the resin sheet 2.
(Fig. 1(B)). Next, the height of the push-up bar 22 is maintained and the push-up bar 22 is moved in the lateral direction (Fig. 1 (Q)).
. At this time, as the push-up rod 22 moves in the lateral direction, the resin sheet 2o gradually peels off from the back surface of the semiconductor piece 21, and as a result, the contact area between the semiconductor piece 21 and the resin sheet 20 decreases. In addition, the resin sheet 20 is pushed up by a push-up rod 22.
is peeled off from the back surface of the semiconductor piece 21 while moving, so no excessive stress is applied to the semiconductor piece 21, so even a thin semiconductor piece 21 with a large area can be removed from the resin sheet without cracking. will not break through the resin sheet 2o.

Next, the push-up a22 is moved laterally from one end of the semiconductor piece 21 to the opposite end, and the suction jig 23 aligned with the semiconductor piece 21 to be removed is gradually lowered (Fig. 1q). , semiconductor piece 21 and resin sheet 2
When the contact area with o is the smallest, the suction jig 23
The small semiconductor piece 21 is attracted and held, and then removed from the resin sheet 20 (FIG. 1(E)).

Next, the moving direction of the push-up rod will be explained using FIG. 1 fF). The moving direction of the push-up rod that pushes up the semiconductor piece in FIG. 1 p is the valve opening direction of the semiconductor piece 21.
By performing the movement 26 in a direction that does not coincide with +7, that is, from corner to corner of the semiconductor piece 21, the semiconductor piece 2
1 from the resin sheet, no stress is applied in the valve opening direction, so damage due to cracking of the semiconductor piece 21 can be prevented. Furthermore, this is extremely effective for thin semiconductor pieces with large areas. It is.

Effects of the Invention From the above explanation, it is clear that according to the present invention, even an extremely thin semiconductor moon with a large area can be removed from the resin sheet without being damaged during pushing up. In addition, the push-up rod does not break through the push-in sheet, which increases the retention of small semiconductor pieces, improves work efficiency, and greatly reduces costs in semiconductor device manufacturing.

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing a method for removing a small semiconductor piece from a resin sheet in an embodiment of the present invention, and FIGS. 2 and 3 are process diagrams of a conventional method. 20...Resin sheet, 21...Semiconductor piece, 22...Pushing rod, 23...
Suction jig. Name of agent: Patent attorney Toshio Nakao and one other person
Figure 1 Figure 1 Figure 1 Figure 25 Sand movement Figure 2 Figure 3 Semiconductor device

Claims (2)

[Claims] (1) When removing small semiconductor pieces from the resin sheet on which the individual semiconductor pieces are aligned, push up the end of the desired semiconductor piece from below to a predetermined height using a push-up rod with a needle-like tip through the resin sheet. A method for removing a semiconductor piece from a resin sheet, comprising the steps of: moving the push-up rod laterally along the back surface of the semiconductor piece through the resin sheet to peel the semiconductor piece from the resin sheet. (2) A method for removing a small semiconductor piece from a resin sheet according to claim 1, wherein the push-up rod is moved in a direction different from the direction of the cleavage axis of the small semiconductor piece.