JP2002280330A - Pickup method of chip-type component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of picking up chip-type components for surely reducing a contact area between chip-type components and adhesive agent layer of a dicing tape, and for picking up chip-type components, without picking up the components using a pickup stylus. SOLUTION: This chip-type component pickup method comprises a dicing process for dividing and isolating a plate component adhered to a dicing tape including a layer, which is deformed, when it is heated into a plurality of chip- type components; a heating and deforming process for deforming the dicing tape by heating it; a peeling process for accelerating deformation of the dicing tape and peeling the chip-type components from the dicing tape, by attracting the dicing tape with an absorbing member with the rear surface of the dicing tape holding a plurality of chip-type components, provided opposed to the attracting member which can attract the dicing tape; and a pickup process for attracting and grasping the chip-type components with an attracting collet from the upper surface of the chip type component, in order to pickup the components from the dicing tape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for picking up a chip-shaped component such as an electronic component, and more particularly, to a method for picking up a chip-shaped component such as an electronic component.
For example, in the process of manufacturing a small electronic component such as a semiconductor chip, when removing the chip-shaped component on the dicing tape, the chip-shaped component is sucked and gripped one by one without pushing up with a pin, which is conventionally performed. The present invention relates to a method for picking up a chip-shaped component that can be picked up (separated by suction).

[0002]

2. Description of the Related Art Conventionally, a plate-like component on which a number of components such as a semiconductor wafer are formed is fixed by adhering a dicing tape, and cut and separated (diced) into a plurality of chip-like components. Are doing. Then, the individual chip-shaped components divided by the die bonding step are picked up (taken up) from the dicing tape and mounted on a separately prepared film carrier tape for mounting electronic components such as a TAB tape by die bonding. It is supposed to.

[0003] When picking up a chip-shaped component from a dicing tape in this way, a pick-up needle is pushed up from the back of the dicing tape to separate the chip-shaped article from the dicing tape, and a suction crawl is applied from the upper surface of the chip-shaped component. A suction gripping method is employed. recent years,
Semiconductor wafers are designed to be extremely thin in order to improve mounting efficiency. For this reason, there is a high possibility that the chip-shaped component is damaged by the impact at the time of pushing up.

In view of such a situation, the present inventors have
JP-A-10-233373, JP-A-11-387
As disclosed in Japanese Patent Laid-Open Publication No. 5 (1999) -2005, a dicing tape and device capable of picking up a chip-like component from a dicing tape only by suction by a suction collet without picking up by a push-up needle at the time of pickup have been proposed.

That is, as shown in FIG. 4, a dicing tape 20 composed of a non-shrinkable film 24, a shrinkable film 21 and an adhesive layer 22 is adhered to a semiconductor wafer and diced into a plurality of chips 16. I do. At this time, FIG.
As shown in FIG.
1 is completely cut, and then the shrinkable film 21 is shrunk by heating. Thereby, as shown in FIG. 6, the contact area between the chip 16 and the pressure-sensitive adhesive layer 22 is drastically reduced, and the chip 16 is picked up from the dicing tape 20 without pushing up the semiconductor chip 16 with a push-up needle. It becomes possible.

[0006]

However, the back surface of the semiconductor wafer, that is, the surface on the side where the dicing tape is adhered, may be subjected to various processes.
In some cases, the adhesive strength with the dicing tape was higher than usual. In such a case, the contact area between the semiconductor chip 16 and the adhesive layer 22 of the dicing tape 20 can be reduced only by shrinking the shrinkable film 21 by heating as shown in FIG. In some cases, it is difficult to perform pickup using only the suction collet without pushing up using the pushing needle.

[0007] The present invention, even in the above situation,
An object of the present invention is to provide a method for picking up a chip-shaped component, which can surely reduce the contact area between the chip-shaped component and the pressure-sensitive adhesive layer of the dicing tape and can pick up the chip-shaped component without pushing up by a push-up needle. And

[0008]

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned problems and objects in the prior art. A dicing step of cutting and separating a plate-shaped component attached to a dicing tape having a layer to be cut into a plurality of chip-shaped components, a heating deformation process of heating and deforming the dicing tape, and a suction capable of sucking the dicing tape. The member is made to face the back surface of the dicing tape holding the plurality of chip-shaped components, and the dicing tape is sucked by the suction member, thereby promoting the deformation of the dicing tape, and the chip-shaped components are separated from the dicing tape. A peeling step of peeling,
A pick-up step of sucking and holding the chip-shaped component with a suction collet from the upper surface of the chip-shaped component and picking up the chip-shaped component from a dicing tape.

After performing the heating deformation step, the back surface of the dicing tape is suctioned by a suction member, thereby promoting the deformation of the dicing tape. Even
The chip-shaped component can be peeled from the dicing tape. Then, in this state, the chip-shaped component can be sucked and held by the suction collet from the upper surface of the chip-shaped component, and can be picked up from the dicing tape. At this time, since the contact area between the chip-shaped component and the pressure-sensitive adhesive layer of the dicing tape is extremely reduced, the chip-shaped component can be easily and reliably picked up.

Therefore, it is not necessary to use a pickup using a push-up pin as in the prior art, so that the chip-shaped component can be efficiently picked up without causing damage or cracking of the chip-shaped component. Further, the die bonding method for an electronic component according to the present invention is characterized in that the suction member is configured to vacuum-suction the back surface of the dicing tape corresponding to the entire surface of the plate member.

In this manner, the vacuum suction from the back surface of the tape in the peeling step is performed over the back surface of the dicing tape corresponding to the entire surface of the plate-like member. It can be peeled from the agent layer, and the time required for peeling can be reduced. Further, the die bonding method for an electronic component according to the present invention is characterized in that the suction member is configured to vacuum-suction the back surface of the dicing tape corresponding to one of the chip-shaped components.

With this configuration, the diced chip-shaped parts can be separated from the pressure-sensitive adhesive layer of the dicing tape individually for each chip, so that only high-quality chip-shaped parts can be selectively obtained. It is possible to select and pick up.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for picking up a chip-like component according to the present invention will be described below with reference to the accompanying drawings. The plate-like component applicable to the present invention is not limited to its material, and examples thereof include a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as an FPC, a metal material such as a precision component, or a composite material thereof. It can be applied to various articles.

A heat-deformable dicing tape usable in the present invention comprises, for example, a non-shrinkable film 24, a shrinkable film 21, and an adhesive layer 22, as shown in FIG. In this case, the pressure-sensitive adhesive layer 22 is preferably of an ultraviolet curable type so that the chip-shaped component after the heat deformation is easily peeled off. Such a dicing tape is disclosed in JP-A-10-233373 and JP-A-10-233373.
It is described in detail in JP-A-284446. Others
A pressure-sensitive adhesive tape in which a heating foaming agent is added to an arbitrary layer of the tape and the layer is deformed by heating and foaming may be used.

FIG. 1 is a sectional view of a first embodiment of a vacuum suction-peeling apparatus for carrying out a chip-like component pickup method of the present invention. As shown in FIG. 1, the vacuum suction-peeling device 7 includes a suction table 7a formed porous from a material such as ceramics, for example.
The vacuum line 5 is configured to suction-fix the back surface of a dicing tape 20, which will be described later, over the entire surface of the wafer by negative pressure under the action of a vacuum source such as a vacuum pump (not shown). The suction table 7a is formed of a porous material from a material such as ceramics as described above. In addition, a metal disk provided with a large number of suction holes is provided so as to be able to suction positions corresponding to all chips. May be used. In addition, various well-known suction table configurations can be adopted, such as using a table on which the upper surface of the table is formed with unevenness smaller than the chip size in addition to the smooth surface.

Although not shown, the vacuum suction / peeling device 7 is used to shrink the dicing tape 20 by heat.
A heating means may be provided. As the heating means, well-known heating means such as a structure in which a sheathed heater is arranged in a table, a rubber heater, or the like can be adopted, and there is no particular limitation. Further, a suction collet (not shown), which can be moved up, down, left and right, is disposed above the vacuum suction and peeling device 7 for suction and separation of the chips 16 of the dicing tape 20, and is provided with a vacuum pump (not shown). By the operation of (1), the chips 16 on the dicing tape 20 are suction-separated for each chip.

In the vacuum suction peeling apparatus 7 of this embodiment, the vacuum suction from the tape back surface in the peeling step is performed over the entire surface of the wafer, so that the entire diced chip is peeled off from the adhesive layer of the dicing tape at once. And the time required for peeling can be reduced. FIG. 2 is a cross-sectional view of a second embodiment of a vacuum suction and peeling apparatus for carrying out the chip-like component pickup method of the present invention.

The vacuum suction peeling device 7 of this embodiment is provided with a suction socket 37 having a size corresponding to one chip 16 instead of the suction table 7a, and a plurality of suction sockets 37 on the upper surface 37a of the suction socket 37. The second embodiment is different from the first embodiment in that a suction hole 37b is provided so that vacuum suction from the tape back surface in a peeling step is performed for each chip by the action of negative pressure. In this case, the support member of the suction socket 37 or the dicing tape 20 is
The suction socket 37 can be opposed to each chip 16 by moving its relative position in the vertical and horizontal directions. In addition,
Other configurations are basically the same as those of the first embodiment, and thus detailed description thereof is omitted.

With this configuration, the diced chips can be separated from the pressure-sensitive adhesive layer of the dicing tape individually for each chip, so that only high quality chips can be selectively selected. It is possible to pick up. FIG. 3 is a sectional view of a third embodiment of a vacuum suction and peeling apparatus for carrying out the chip-like component pick-up method of the present invention.

The vacuum suction peeling apparatus 7 of this embodiment is provided with a suction socket 47 having a size corresponding to one chip 16 instead of the suction table 7a. The second embodiment is configured so as to have a suction opening 47a and a fixed wall 47b around the suction opening 47a, and to perform vacuum suction from the tape back surface in the peeling step for each chip by the action of negative pressure. It is different from the form. Note that the other configuration is basically the same as that of the second embodiment, and a detailed description thereof will be omitted.

With this configuration, the diced chips can be easily and reliably peeled from the pressure-sensitive adhesive layer of the dicing tape individually for each chip. It is possible to select and pick up. Hereinafter, with respect to the method of picking up chip-shaped components of the present invention using such a vacuum suction peeling device 7, an example in which a silicon wafer is used as a plate-like component and the silicon wafer is applied to the vacuum suction peeling device 7 shown in FIG. Will be described.

First, a silicon wafer is fixed to the ring frame 13 using a dicing tape 20 shown in FIG. Subsequently, the silicon wafer is cut into a large number of chips 16 in a dice shape using a dicing apparatus (FIG. 5). The cut and separated wafer is placed on a heating table while being supported by the ring frame, and heats the dicing tape 20 at 80 to 150 ° C. for about 30 to 120 seconds. Heating causes the shrinkable film 21 to shrink, and the dicing tape 20 undergoes heat deformation. When the adhesive force between the silicon wafer and the adhesive layer 22 is sufficiently small, the adhesive layer 2
In No. 2, the area of adhesion to the silicon wafer decreases with the shrinkage of the shrinkable film 21 (FIG. 6). However, when the bonding surface of the silicon wafer is mirror-finished by chemical etching, or when the organic film is formed and the adhesive strength is large, the chip 16 follows the deformation of the dicing tape 20 as shown in FIG. It may not be reduced.

Thereafter, the wafer supported by the ring frame is directly transferred to the suction table 7a of the vacuum suction and peeling device 7.
Change to. Subsequently, the suction table 7a of the vacuum suction and peeling device 7 is operated, and the back surface of the dicing tape 20 is sucked toward the suction table 7a by the action of the negative pressure. As a result, as shown in FIG. 8, the portions of the non-shrinkable film 24 and the shrinkable film 21 to which the chip 16 is still in contact and adhered are moved to the suction table 7a side, and the chip 16 is cut into a dicing tape. 20 can be completely separated. In FIGS. 7 and 8,
The thickness direction of the dicing tape 20 is exaggerated for convenience of explanation.

The pressure-sensitive adhesive layer 2 of the dicing tape 20
When an ultraviolet-curable pressure-sensitive adhesive is used in 2, the dicing tape 20 is irradiated with ultraviolet light to cure the pressure-sensitive adhesive layer 22 and reduce the adhesive strength. The ultraviolet irradiation is preferably performed before the heating deformation step, but may be performed after that. In this case, the negative pressure by the suction table 7a of the vacuum suction and peeling device 7 is set to 95 to 90% so as not to damage the chip 16.
It is desirable that the pressure be 1 KPa, preferably 90 to 10 KPa.

In a state where the vacuum suction is performed by the suction table 7a of the vacuum suction peeling device 7, the position of the chip 16 is detected by a sensor or the like, and the suction collet is moved left and right to be positioned and lowered. As a result, the chips 16 are individually sucked and die-bonded (mounted) to a separately prepared film carrier tape for mounting electronic components such as a TAB tape. At this time, since it is not necessary to use a push-up pin as in the related art, damage to the chip and adhesion of the adhesive to the lower surface of the chip can be prevented.

As described above, since the vacuum suction from the tape back surface in the peeling step is performed over the entire surface of the wafer, the entire diced chip can be peeled off from the adhesive layer of the dicing tape at once, and the time required for peeling is reduced. Can be shortened. In the above-described embodiment, a dicing tape having a shrinkable film is used as the dicing tape, and a type in which a chip is peeled to some extent by heat shrinkage is used. Various changes can be made without departing from the scope of the present invention, such as application to a dicing tape of a type in which an adhesive is weakened by irradiating an ultraviolet ray with a pressure-sensitive adhesive using a pressure-sensitive adhesive sheet using the same.

[0027]

【Example】

[0028]

Example 1 A polyolefin-based film having a thickness of 140 μm, a polyethylene terephthalate-based shrink film having a thickness of 25 μm, and a UV-curable pressure-sensitive adhesive layer having a thickness of 10 μm were formed on a mirror surface of a silicon wafer having a diameter of 8 inches and a thickness of 50 μm. Dicing tape ("Adwill N")
(Manufactured by Lintec Corporation) was fixed to the ring frame for 8-inch wafer via the adhesive.

The wafer fixed to the ring frame is cut by a dicing apparatus (“A-WD-4000B”, manufactured by Tokyo Seimitsu Co., Ltd.) so as to cut the wafer together with the wafer to a size of 65 μm from the adhesive layer surface of the dicing tape to a size of 10 mm × 1.
Dicing was performed to a chip having a size of 0 mm. Hereinafter, this structure is referred to as a “chip-mounted ring frame” for convenience.

After completion of the dicing, an ultraviolet irradiation device (“A
Using a “dwill RAD-2000m / 8” (manufactured by Lintec Corporation), the chip mounting ring frame was irradiated with ultraviolet light from the dicing tape side at a light amount of 245 mJ / cm ² . Next, the chip mounting ring frame is mounted with the dicing tape side facing the hot plate.
Heating was performed at 20 ° C. for 90 seconds.

Although the dicing tape was deformed by heat shrinkage, the chip followed the deformation of the dicing tape, and was hardly peeled off from the adhesive surface of the dicing tape. Then, the dicing tape side of the chip mounting ring frame is placed on an 8-inch wafer size mesh 1.
The wafer was mounted on a ceramic porous table No. 00, and the entire surface of the wafer was suctioned at a suction pressure (87 KPa (negative pressure)).

The chip is peeled off from almost the entire adhesive surface of the attached dicing tape, and a suction pen (manufactured by Fluoromechanic Co., pen tip: 1.8 mmφ, suction pressure: 31 KPa)
(Negative pressure), flow rate: 3.21 L / min), and all the chips could be sucked and gripped, and pickup was possible.

[0033]

[Comparative Example] In Example 1, after mounting the dicing tape to which the chip was adhered on the ceramic porous table, an attempt was made to pick up using the same suction pen as in Example 1 without performing suction, but the chip was peeled off. Could not be picked up without.

[0034]

Example 2 In the same manner as in Example 1, a silicon dummy wafer was diced to form a chip mounting ring frame, irradiated with ultraviolet light from the dicing tape side, heated with a hot plate, and heated and deformed. I let it. On the other hand, a large number of through-holes having a diameter of 50 μm were formed, and a square metal plate having a side of 12 mm was arranged on the upper surface of a hollow metal prism to form an adsorption stage as shown in FIG. The upper surface of the suction stage is brought into contact with one chip via a dicing tape, and a suction pressure (80
KPa (negative pressure)).

As a result, only the sucked chip was almost peeled off from the adhesive surface of the dicing tape. Subsequently, pickup was performed with a suction pen in the same manner as described above. As a result, the chip could be gripped by suction, and pickup was possible.

[0036]

According to the present invention, the deformation of the dicing tape can be promoted by sucking the back surface of the dicing tape by the suction member after the heat deformation step, and the peeling can be performed only by the heat deformation step. The chip-like component can be peeled off from the dicing tape even for a difficult plate-like component.

Then, in this state, the chip-shaped component can be sucked and gripped by the suction collet from the upper surface of the chip-shaped component, and can be picked up from the dicing tape. On this occasion,
Since the contact area between the chip-shaped component and the adhesive layer of the dicing tape is extremely reduced, the chip-shaped component can be easily and reliably picked up. Therefore, there is no need to use a pickup using a push-up pin as in the related art, so that the chip-shaped component can be efficiently picked up without causing damage or cracking of the chip-shaped component.

Further, according to the present invention, the vacuum suction from the back surface of the tape in the peeling step is performed over the back surface of the dicing tape corresponding to the entire surface of the plate-shaped member. It can be peeled from the pressure-sensitive adhesive layer of the dicing tape, and the time required for peeling can be reduced. Furthermore, according to the present invention, the diced chip-shaped components can be individually separated for each chip from the pressure-sensitive adhesive layer of the dicing tape, so that only high-quality chip-shaped components are selectively selected. This is an extremely excellent invention which has many unique and remarkable effects such as being able to be picked up.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of a vacuum suction-peeling apparatus for carrying out a chip-like component pickup method of the present invention.

FIG. 2 is a cross-sectional view of a second embodiment of a vacuum suction peeling apparatus for carrying out the chip-like component pick-up method of the present invention.

FIG. 3 is a sectional view of a third embodiment of a vacuum suction-peeling apparatus for carrying out a chip-like component pickup method according to the present invention.

FIG. 4 is a partially enlarged sectional view of a dicing tape used in the present invention.

FIG. 5 is a schematic cross-sectional view when dicing a semiconductor wafer.

FIG. 6 is a schematic cross-sectional view when a dicing tape to which a semiconductor wafer chip is adhered is thermally shrunk.

FIG. 7 is a schematic cross-sectional view showing a state in which a dicing tape to which a semiconductor wafer chip is adhered is thermally contracted.

FIG. 8 is a schematic cross-sectional view showing a state in which a dicing tape to which a semiconductor wafer chip is adhered according to the present invention is thermally contracted and the entire surface is peeled off by vacuum suction.

[Explanation of symbols]

 7 Vacuum suction peeling device 7a Suction table 13 Ring frame 14 Wafer 16 Chip 20 Dicing tape 21 Shrinkable film 22 Adhesive layer 24 Non-shrinkable film 37 Suction socket 37a Upper surface 37b Suction hole 47 Suction socket 47a Suction opening 47b Fixed wall

Continued on the front page F term (reference) 5F031 CA13 FA05 FA07 GA23 MA34 MA38

Claims (3)

[Claims] A dicing step of cutting and separating a plate-shaped component attached to a dicing tape having a layer deformed by heating into a plurality of chip-shaped components; and a heating deformation step of heating and deforming the dicing tape. To a suction member capable of sucking the dicing tape, the back surface of the dicing tape holding the plurality of chip-shaped components is opposed to each other, and the dicing tape is sucked by the suction member to promote deformation of the dicing tape. A chip removing step of removing a chip-shaped component from a dicing tape; and a pickup process of sucking and holding the chip-shaped component with a suction collet from an upper surface of the chip-shaped component, and picking up the chip-shaped component from the dicing tape. How to pick up parts. 2. The method for picking up a chip-like component according to claim 1, wherein the suction member is configured to vacuum-suction the back surface of the dicing tape corresponding to the entire surface of the plate-like component. . 3. The chip-shaped component according to claim 1, wherein the suction member is configured to vacuum-suction the back surface of the dicing tape corresponding to one of the chip-shaped components. Pickup method.