JPS6228780Y2 - - Google Patents
Info
- Publication number
- JPS6228780Y2 JPS6228780Y2 JP1980061788U JP6178880U JPS6228780Y2 JP S6228780 Y2 JPS6228780 Y2 JP S6228780Y2 JP 1980061788 U JP1980061788 U JP 1980061788U JP 6178880 U JP6178880 U JP 6178880U JP S6228780 Y2 JPS6228780 Y2 JP S6228780Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heat sink
- pad
- support piece
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
本考案は半導体装置用リードフレームに関し、
特に放熱板を有するパワーIC用リードフレーム
に関するものである。[Detailed description of the invention] The present invention relates to a lead frame for a semiconductor device.
In particular, the present invention relates to a power IC lead frame having a heat sink.
従来のパワーIC用リードフレームを第１図に
示す。リードフレーム１は一点鎖線で囲つた樹脂
封止部Ａの内部に半導体素子搭載用パツド（ステ
ージ）２および該搭載用パツド２上に固着される
半導体素子３の電極と金等からなるワイヤ４によ
り結線される複数の内部リード５を有している。
銅からなる放熱板６はリードフレーム１の両側の
対向する位置から突出する２対（４個）の支持片
７，７′を介してネジ８等によりリードフレーム
１に固定される。図面で上側の両支持片７は長く
中央付近まで延長されパツド２上のパターンに応
じていずれか一方にパツド２からのワイヤ４が接
続される。９は位置決め用及び送り用の孔であ
る。このような従来のリードフレームにおいて
は、第２図に示すように支持片７の先端部が浮き
上がりワイヤボンデイングができなくなる場合が
あり、またこの先端部が各工程で製造装置に接触
し円滑な搬送あるいは各種処理作業が達成できな
い場合があつた。 Figure 1 shows a conventional power IC lead frame. The lead frame 1 includes a semiconductor element mounting pad (stage) 2, an electrode of a semiconductor element 3 fixed on the mounting pad 2, and a wire 4 made of gold or the like, inside a resin sealing part A surrounded by a chain line. It has a plurality of internal leads 5 to be connected.
A heat sink 6 made of copper is fixed to the lead frame 1 with screws 8 or the like via two pairs (four) of support pieces 7, 7' protruding from opposing positions on both sides of the lead frame 1. Both support pieces 7 on the upper side in the drawing are long and extended to the vicinity of the center, and the wire 4 from the pad 2 is connected to one of them according to the pattern on the pad 2. 9 is a hole for positioning and feeding. In such a conventional lead frame, as shown in FIG. 2, the tip of the support piece 7 may lift up, making wire bonding impossible. Also, this tip comes into contact with manufacturing equipment in each process, making it difficult for smooth conveyance. Or there were cases where various processing tasks could not be accomplished.
本考案は上記の点に鑑みなされたものであつ
て、放熱板固定用支持片を確実に放熱板上に密着
させワイヤボンデイングその他の各処理工程に支
障を来たすおそれのないリードフレームの提供を
目的とする。このため本考案に係るリードフレー
ムにおいてはリードフレームの両側の対向する位
置から突出する支持片を連続一体形成している。 The present invention was devised in view of the above points, and its purpose is to provide a lead frame in which a support piece for fixing a heat sink can be firmly attached to the heat sink, and there is no risk of interfering with wire bonding and other processing steps. shall be. For this reason, in the lead frame according to the present invention, supporting pieces projecting from opposing positions on both sides of the lead frame are continuously and integrally formed.
第３図は本考案に係るリードフレームの一例を
示す平面図である。上側の支持片７はリードフレ
ーム１の両側に跨つて橋絡状に一体的に形成され
ている。下側の２つの支持片７′は放熱板６を保
持するためにのみ用いられネジ８により放熱板６
をリードフレーム１に固定支持する。上側の支持
片７の中央部にはパツド２上に搭載される半導体
素子２の電極と放熱板６とを連結するためのワイ
ヤ４がボンデイングされる。 FIG. 3 is a plan view showing an example of a lead frame according to the present invention. The upper support piece 7 is integrally formed in a bridging manner across both sides of the lead frame 1. The two lower support pieces 7' are used only to hold the heat sink 6, and the screws 8 are used to hold the heat sink 6.
is fixedly supported on the lead frame 1. A wire 4 for connecting the electrodes of the semiconductor element 2 mounted on the pad 2 and the heat sink 6 is bonded to the center of the upper support piece 7 .
このような構成のリードフレームを用いれば第
４図に示すように支持片７はその全長にわたつて
放熱板６上に確実に密着し従来の場合のようにワ
イヤボンデイング不能となる程浮き上ることはな
い。従つて半導体装置の各製造工程は円滑に行な
われ信頼性の高い製品が得られる。 If a lead frame having such a structure is used, the supporting piece 7 will be firmly attached to the heat sink 6 over its entire length, as shown in FIG. 4, and will float up to the point where wire bonding is impossible as in the conventional case. There isn't. Therefore, each manufacturing process of the semiconductor device can be carried out smoothly and highly reliable products can be obtained.
第１図は従来のリードフレームの平面図、第２
図は第１図の−断面図、第３図は本考案に係
るリードフレームの平面図、第４図は第３図の
−断面図である。
１……リードフレーム、２……半導体素子搭載
用パツド、４……ワイヤ、７，７′……支持片。
Figure 1 is a plan view of a conventional lead frame, Figure 2 is a plan view of a conventional lead frame.
1, FIG. 3 is a plan view of the lead frame according to the present invention, and FIG. 4 is a sectional view taken from FIG. 3. 1...Lead frame, 2...Semiconductor element mounting pad, 4...Wire, 7, 7'...Support piece.
Claims (1)
片を有し、該支持片の延長上に半導体素子搭載用
パツドからのワイヤを接続可能としたリードフレ
ームにおいて、放熱板支持片をリードフレームの
両側の対向する位置に橋絡状に一体形成してなる
ことを特徴とする半導体装置用リードフレーム。 In a lead frame that has support pieces for fixing the heat sink to the lead frame, and wires from a pad for mounting a semiconductor element can be connected to an extension of the support piece, the heat sink support pieces are attached to both sides of the lead frame. A lead frame for a semiconductor device, characterized in that it is integrally formed in a bridge shape at opposing positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980061788U JPS6228780Y2 (en) | 1980-05-08 | 1980-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980061788U JPS6228780Y2 (en) | 1980-05-08 | 1980-05-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56164562U JPS56164562U (en) | 1981-12-07 |
| JPS6228780Y2 true JPS6228780Y2 (en) | 1987-07-23 |
Family
ID=29656159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980061788U Expired JPS6228780Y2 (en) | 1980-05-08 | 1980-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228780Y2 (en) |
-
1980
- 1980-05-08 JP JP1980061788U patent/JPS6228780Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56164562U (en) | 1981-12-07 |
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