JPS62285450A - Flat package for ic - Google Patents
Flat package for icInfo
- Publication number
- JPS62285450A JPS62285450A JP12813886A JP12813886A JPS62285450A JP S62285450 A JPS62285450 A JP S62285450A JP 12813886 A JP12813886 A JP 12813886A JP 12813886 A JP12813886 A JP 12813886A JP S62285450 A JPS62285450 A JP S62285450A
- Authority
- JP
- Japan
- Prior art keywords
- board
- package
- package body
- substrate
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は、■Ｃフラットパッケージの位置決めに関する
ものである。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to (1) positioning of a C flat package.
第３図は従来のＩＣ−７ラツトパツケージとそれが実装
されるＩＣ基板の装着部の斜視図である。FIG. 3 is a perspective view of a conventional IC-7 rack package and an IC board mounting section on which it is mounted.
図において、（１１はＩＣフラットパッケージ、（２）
はそのフラットパッケージ（１）の接続端子、（３）は
ＩＣ基板、（４）はＩＣ基板（３）上に形成された接続
用パターンである。In the figure, (11 is an IC flat package, (2)
is a connection terminal of the flat package (1), (3) is an IC board, and (4) is a connection pattern formed on the IC board (3).
上記のようなＩＣフラットパッケージ（１）をＩＣ基板
（３）に装着するには、まずＩＣフラントパツケ−ジ（
１１の四隅を人手により接続用パターン（４）上に合わ
せてその四隅部分を半田付けしたのち、他の四周の接続
端子（２）をその上方からレーザ光を順次照射すること
によって自動的に接続用パターン（４）と接続するよう
になっている。To attach the IC flat package (1) as described above to the IC board (3), first attach the IC flat package (1) to the IC board (3).
After manually aligning the four corners of No. 11 with the connection pattern (4) and soldering the four corners, the other four connection terminals (2) are automatically connected by successively irradiating laser light from above. It is connected to the pattern (4) for use.
また実装数が多数ある場合は、ロボットを１吏用しＩＣ
Ｔ７ラツトパツケージＦｉｌをロボットバッドで接続用
パターン（４）上に正確に押え付けた状態で上記のよう
にレーザ光を順次照射して接続する方法も採られている
。In addition, if there are a large number of ICs to be mounted, one robot can be used to
There is also a method of connecting by sequentially irradiating laser light as described above while the T7 rat package Fil is accurately pressed onto the connection pattern (4) with a robot pad.
しかしながら、実装数があまり多くない場合に上記のよ
うなロボットや自ＩｆｆＪＪ接続機を使用することは高
価につき無駄であるが、他面人手により■Ｃフラットパ
ッケージの四隅を位置決めする方法もそのためにかなり
の時間、手数を要し非能率的である。しかも人手による
位置決めの場合、高度の技術が作業者に要求されろ。However, if the number of mountings is not very large, using a robot or self-IffJJ connecting machine as described above is expensive and wasteful, but on the other hand, the method of manually positioning the four corners of the C flat package is also quite expensive. It is time consuming and inefficient. Moreover, when positioning is done manually, highly skilled workers are required.
本発明は上記のような問題点を解消するためになされた
もので、ＩＣ基板上への位置決めを簡素化できるＩＣフ
ラットパッケージを得ろことを目的とする。The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an IC flat package that can simplify positioning on an IC board.
本発明に係るＩＣフラントパッケージは、パッケージ本
体の裏面にＩＣ１ｌｊのスルーホールに嵌合する少なく
とも２ｇの突起を設けてなるものであるつ
〔作 用〕
本発明のＩＣフラ・ソトパッケージでは、パッケージ本
体の裏面に突設された突起をＩＣ基板のスルーホールに
嵌合すれば、接続端子とＩＣ基板上の接続用パターンと
を（４緘的に正確に位置決めできるので、その後し・−
ザ光を７ラツトバツケ一ン本体の周りに一巡させればＩ
Ｃフラントパッケージを簡単にＩＣ基板上に装着できる
。The IC flat package according to the present invention has a protrusion of at least 2 g on the back surface of the package body that fits into the through hole of the IC1lj. By fitting the protrusion protruding from the back side of the IC board into the through hole of the IC board, the connection terminal and the connection pattern on the IC board can be accurately positioned (4 lines).
If you let the light go around the body of the 7-point bag, I
The C-Flant package can be easily mounted on the IC board.
〔実施例］ 以下、本発明の一実施例を図により説明する。〔Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の実施例の裏面側の斜視図で、第２図は
ＩＣ基板上に装着したときの断面図である。図中、第３
図と同一符号は同一のものであろので説明は省略する。FIG. 1 is a perspective view of the back side of an embodiment of the present invention, and FIG. 2 is a sectional view when it is mounted on an IC board. In the figure, the third
Since the same reference numerals as those in the figure are the same, the explanation will be omitted.
（５）はパッケージ本体（１１の裏面に突設された突起
で、これらの突起（５）はＩＣ基板（３）に設けられた
スルーホール（６）に嵌合し１する。(5) are protrusions protruding from the back surface of the package body (11), and these protrusions (5) fit into through holes (6) provided in the IC board (3).
したがって、少なくとも２ｇの突起（５）をＩＣ基板（
３）に設けられた対応のスルーホール（６）に嵌合させ
れば、そのフラツトパ・ソケージ本体ｆｉｌはＩＣ基板
（３）上で正確に位置決めされ、接続端子（２）を接続
用パターン（４）の個々の端子上に正確に載置すること
ができる。その後は接続端子（２）上にレーザ光を順次
前ｑ（シながら周囲を一巡させればよく、フラットパッ
ケージ本体（１１をＩＣ基板（３）上に簡単にかつ正確
に実装することができろ。Therefore, the protrusion (5) of at least 2 g is attached to the IC board (
3), the flat panel socket cage main body fil is accurately positioned on the IC board (3), and the connecting terminal (2) is fitted into the corresponding through hole (6) provided in the connecting pattern (4). ) can be placed precisely on the individual terminals. After that, all you have to do is pass the laser beam around the connection terminal (2) sequentially while moving the laser beam around the connection terminal (2), and the flat package body (11) can be easily and accurately mounted on the IC board (3). .
以上のように本発明によれば、ＩＣフラットパッケージ
の裏面にＩＣ２！：板との位置決め用の突起を設けたの
で、人手による位置決めを簡単かつ正確に行うことがで
き、実装作業の能率向上に役立つものである。As described above, according to the present invention, the IC2! : Since a protrusion is provided for positioning with the board, manual positioning can be performed easily and accurately, which is useful for improving the efficiency of mounting work.
第１図は本発明の実施例の裏面側の斜視図、第２図は基
板上に装着したときの断面図、第３図は従来のＩＣフラ
ッｉ・パ″ソケージの斜視図である。
（１）： パッケージ本体、（２）：接続端子、ｆ３１
：ＩＣ基板、（４１：接続用バターノ、（５）：突起、
（６）ニスルーホール。
なＪ３、図中、同一符号は同一、又は相当部分を示す。
代理人 弁理士 佐 藤 正 年
３：ＩＣ差」反
５、矢 起
６：スル− 本−ルFig. 1 is a perspective view of the back side of an embodiment of the present invention, Fig. 2 is a cross-sectional view when it is mounted on a board, and Fig. 3 is a perspective view of a conventional IC flat I/P'' socket. 1): Package body, (2): Connection terminal, f31
: IC board, (41: connection batano, (5): protrusion,
(6) Nissru Hole. In the figures, the same reference numerals indicate the same or equivalent parts. Agent Patent Attorney Masaru Sato Year 3: IC Difference 5, Arrow 6: Through Main Rule
Claims (1)
合する少なくとも２個の突起を設けてなるＩＣフラット
パッケージ。An IC flat package that has at least two protrusions on the back surface of the package body that fit into through-holes on an IC board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12813886A JPS62285450A (en) | 1986-06-04 | 1986-06-04 | Flat package for ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12813886A JPS62285450A (en) | 1986-06-04 | 1986-06-04 | Flat package for ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62285450A true JPS62285450A (en) | 1987-12-11 |
Family
ID=14977338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12813886A Pending JPS62285450A (en) | 1986-06-04 | 1986-06-04 | Flat package for ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62285450A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5053855A (en) * | 1988-10-25 | 1991-10-01 | Mitsubishi Denki Kabushiki Kaisha | Plastic molded-type semiconductor device |
-
1986
- 1986-06-04 JP JP12813886A patent/JPS62285450A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5053855A (en) * | 1988-10-25 | 1991-10-01 | Mitsubishi Denki Kabushiki Kaisha | Plastic molded-type semiconductor device |
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