JPS5814625Y2 - Through-hole mask during solder dipping - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a through hole for masking through hole portions to which solder should not adhere when parts are soldered to a printed circuit board by a solder dip method.

Generally, when mounting components on a printed circuit board, the components are inserted into through holes on the printed circuit board and soldered to the board using a solder tape method.

After soldering, cleaning is performed using an organic solvent or the like to remove unnecessary flux.

However, parts that are sensitive to heat or parts that are sensitive to organic solvents during cleaning may have to be manually soldered separately to the Phnom board later (so-called retrofitting of parts).

In this way, if there are parts to be retrofitted, it is necessary to mask the through holes in the part where the retrofitted parts are mounted to prevent solder from adhering to them during solder dip.

For this purpose, conventional methods include masking the through holes by pasting masking tape, or inserting temporary parts with leads made of a material to which solder does not adhere into the through holes to prevent solder from filling the through holes. It has been adopted.

However, in the method of using masking tape, if an excess portion is masked after the tape is removed, it is troublesome to correct it, and the tape must be cut into small pieces to match the portion to be masked, which is troublesome.

Furthermore, there is a drawback that the pattern on the printed board is stretched after the tape is removed, causing the pattern to lift or peel off from the board.

In the method of using temporary parts, the lead diameter of the temporary part is approximately the same as the lead diameter of the actual part, and when the temporary part is pulled out after soldering, the diameter of the through hole is narrowed by the solder.

Therefore, it is difficult to insert parts for retrofitting.

Also, when using temporary parts with a large number of leads such as IC parts,
There are problems such as difficulty in removing it from the printed board.

The purpose of the present invention is to solve the above-mentioned problems, and the purpose is to provide a plate-shaped piece made of a material to which molten solder does not adhere, and on one side of the plate-shaped piece, two through holes of a printed circuit board are formed at a predetermined distance. and includes two protruding pins that can be inserted into and removed from the through holes, the plate-like piece has a size that masks a desired through hole of the printed board, and the protruding pins are inserted into the through holes. Solder must not adhere to the through-hole mask during solder dipping, which is characterized in that the plate-like piece is maintained closely to the printed board surface by a spring elasticity that depends on the distance between the two pins. This is accomplished by inserting the pin of the plate-like piece into the through hole from the soldering surface of the printed board to mask the through hole.

Next, details of the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the through-hole of the present invention, and FIG. 2 is a cross-sectional view of a through-hole mask inserted into the through-hole of a printed circuit board.

As shown in Fig. 1, the through-hole mask of the present invention is made by punching out a rectangular plate made of a material such as stainless steel to which molten solder does not adhere, and forming two protruding pins 2 from a plate-shaped piece 1. use.

The interval between the two pins 2 is prepared in accordance with a predetermined interval, for example, the maximum pitch, of the through holes to be masked.

As shown in FIG.
Insert pin 2 from the soldering side.

The pin 2 has a spring property, and when inserted into the through hole 4, this spring property prevents the through hole mask from falling off the printed board surface.

This is because the two pins 2 are inclined so that the opposite sides approach each other toward the tips as shown in the figure. The plate-shaped piece 1 is brought into contact with the upper part in a spring and elastically brings the plate-like piece 1 into close contact with the lower surface of the printed board 3 to mask the through-hole 4.

The pins 2 may be inclined so that their tips move away from each other, or may be curved in either direction, but they are held by spring elasticity that depends on the distance between the two pins.

Next, as shown in Fig. 2, for retrofitting, a through-hole mask is inserted into the through-hole 4 of the part where the component will be placed, and the printed board 3 is soldered.When the through-hole mask is removed after the solder dipping is completed, this part is There is no solder attached, so retrofitted parts can be easily installed.

In this embodiment, the pins 2 of the through-hole mask are formed by punching, but the pins may be separately fixed to a plate by welding or the like.

As explained above, according to the through-hole mask of the present invention, through-holes can be reliably masked in a very simple manner, and this has the effect of improving work efficiency and reliability in printed circuit board manufacturing.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of one embodiment of the through hole of the present invention;
The figure shows a cross-sectional view when a through-hole mask is inserted into a through-hole in a printed board. In the figure, 1 is a plate-like piece, 2 is a pin, 3 is a printed board,
4 indicates a through hole.

Claims (1)

[Scope of utility model registration request] A plate-like piece made of a material to which molten solder does not adhere is provided with two protruding pins on one side of the plate-like piece that can be inserted into and removed from two through-holes at a predetermined interval between the two through-holes of the printed board. The plate-like piece has a size that masks a desired through hole in the printed board, and the protruding pin, when inserted into the through hole, pushes against the printed board surface with a spring elasticity that depends on the distance between the two pins. A through-hole mask for solder dipping, characterized in that the plate-like pieces are closely maintained.