JPH01189991A - Method of mounting component on printed wiring board - Google Patents

Abstract

PURPOSE:To decrease the mandays of operation, and to prevent the rise of solder accurately to a through-hole for a subsequently mounted part by inserting a pin on soldering into the through-hole for the subsequently mounted component in a printed wiring board and soldering the part. CONSTITUTION:A wiring, a through-hole 2, etc., are formed to a printed board base material 3, and a solder resist 4 is applied to unnecessary sections in order to prevent the adhesion of solder. When components such as an IC, a capacitor, a resistor, etc., are mounted automatically, a tapered pin 1, which has heat resistance and solder release characteristics, is inserted simultaneously into the through-hole 2 for a subsequently mounted component, and the components are soldered. The pin 1 is drawn out, a lead terminal for the subsequently mounted part is inserted into the through-hole 2, and the part is soldered and mounted. Accordingly, no solder adheres on the through-hole 2 for the subsequently mounted component, the same effect as masking is acquired, and mandays performing the prevention of the rise of solder can be decreased largely.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for mounting components on a printed wiring board, and in particular, a method for mounting components on a printed wiring board in order to prevent solder from rising into through holes for components. Regarding component mounting methods.

[Conventional technology]

Conventionally, this type of component mounting method involves first automatically mounting components to be mounted on the surface by soldering, then inserting the lead terminals of the components to be mounted in the through-holes into the through-holes and automatically mounting them. The work was done in several stages, such as manually mounting parts that were not suitable for automatic mounting, such as switches.

When performing surface mounting soldering on a printed wiring board, the through-holes for the components were manually masked with tape to prevent solder from climbing up.

[Problem that the invention seeks to solve]

The above-mentioned conventional masking method for preventing solder from climbing up through-holes for parts has the following drawbacks.

(1) Since the masking work is a manual work,
It requires a large amount of man-hours.

(2) Because masking is done manually for each sheet,
There is a high risk of forgetting to mask areas that should be masked, or masking areas that should not be masked.

(3) In recent printed wiring boards with fine patterns, it is difficult to ensure the positional accuracy of masking.

An object of the present invention is to provide a method for mounting components on a printed wiring board, which requires fewer man-hours and can accurately prevent solder from rising into through-holes for components when retrofitted.

[Means for solving problems]

In the method for mounting components on a printed wiring board of the present invention, in the method for mounting components on a printed wiring board, during soldering, the printed wiring board is retrofitted by inserting a pin into a through hole for the component and soldering. Includes a step to prevent rising.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a first embodiment of the invention.

In the first embodiment, as shown in FIG. 1, after wiring, through holes 2, etc. are formed on a printed board base material 3, a solder resist is applied to prevent solder from adhering to unnecessary parts. Apply 4.

Next, when automatically mounting components such as ICs, capacitors, and resistors, at the same time, a pin 1 with a tapered tip that has heat resistance and solder removability is attached to the through hole 2 for the component.
Insert and solder.

Next, the pin 1 is removed, the lead terminal of the retrofitted component is inserted into the through hole 2, and the component is soldered and mounted.

In this manner, by inserting the pin 1 into the through-hole 2 for the component in the retrofitting, solder does not adhere to the through-hole 2 for the component in the retrofitting, and the same effect as masking can be obtained.

FIG. 2 is a sectional view of a second embodiment of the invention.

In the second embodiment, as shown in FIG. 2, wiring is carried out on the printed board base material 3 using the same method as in the first embodiment.

Through hole 2. After forming the solder resist 4 etc., the IC
When automatically mounting components such as , capacitors, resistors, etc., at the same time, the same pins 1 as in Example 1 are inserted into through holes 2 for retrofitting components and soldered.

Next, push the lead terminal 7 of the retrofit component 6 over the pin 1 and remove the pin 1. At the same time, insert the lead terminal 7 of the retrofit component 6 into the through hole 2 for the retrofit component, and solder it. By performing the attachment, the component 6 can be mounted later without requiring masking.

〔Effect of the invention〕

As explained above, the present invention has the following effects by automatically inserting pins into through holes as a method for preventing solder from rising into through holes for components during retrofitting.

(1) Retrofitting can significantly reduce the number of man-hours required to prevent solder from climbing into through-holes for components.

(2) Retrofitting can accurately prevent solder from rising into through-holes for components.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a first embodiment of the invention, and FIG. 2 is a sectional view of a second embodiment of the invention. 1... Pin, 2... Through hole, 3... Printed board base material, 4... Solder resist, 5... Solder, 6
... Retrofitted parts are parts, 7... Lead terminals.

Claims (1)

[Claims] A method for mounting components on a printed wiring board, which includes the step of inserting pins into through holes for retrofitted parts of the printed wiring board during soldering to prevent solder from climbing up. How to mount parts on.