JPS62254457A - Lead frame for integrated circuit - Google Patents
Lead frame for integrated circuitInfo
- Publication number
- JPS62254457A JPS62254457A JP9997186A JP9997186A JPS62254457A JP S62254457 A JPS62254457 A JP S62254457A JP 9997186 A JP9997186 A JP 9997186A JP 9997186 A JP9997186 A JP 9997186A JP S62254457 A JPS62254457 A JP S62254457A
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead frame
- suspension
- integrated circuit
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
不発明はＩＣ用リードフレームに関し、特にアイランド
つり部に改良を加えたＩＣ用リードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an IC lead frame, and particularly to an IC lead frame with an improved island suspension.
従来のＩＣ用リードフレームは、第３図の縦断面図に示
す通り、ＩＣ素子を搭載するアイランド部１とフレーム
部３（外枠）とをつなぐアイランドつ６ｇ２が、フレー
ムｓ３と同一平面になるように設けられている。このと
きアイランド部１はボンディングワイヤーの垂れ下がシ
による接触◆故防止の為、通常はフレーム部３の面より
低くなるようにディンプル加工されている。In the conventional IC lead frame, as shown in the vertical cross-sectional view of FIG. 3, the island 6g2 that connects the island section 1 on which the IC element is mounted and the frame section 3 (outer frame) lies on the same plane as the frame s3. It is set up like this. At this time, the island portion 1 is usually dimpled so as to be lower than the surface of the frame portion 3 in order to prevent contact ◆ caused by the bonding wire hanging down.
ところでＩＣの樹脂モールド成形工程では、第４図の断
面図に示すとおり、樹脂パリ防止のためにリード部も含
めてアイランドつ９部２を樹脂モールド成形用の止金製
４と下金型５とではさみ、１００ ｋｇ／ｃＩＩＬ程度
の圧力で型細めを行っている。By the way, in the resin molding process of IC, as shown in the cross-sectional view of FIG. The shape is narrowed using scissors and a pressure of about 100 kg/cIIL.
また樹脂モールド成形時には、１７５℃程度の温度まで
リードフレームは加熱されている。Further, during resin molding, the lead frame is heated to a temperature of about 175°C.
したがって樹脂そ−ルビ成形時には、アイランドつり部
２には矢印の如くアイランド部１に向って大きな熱応力
が発生する。その結果従来のリードフレームは、７２．
トなアイランドつ９部２だけでは熱応力を吸収できず、
アイランド部Ｉｔ−上下にそり変形させてしまう欠点が
ある。Therefore, during resin molding, a large thermal stress is generated in the island suspension part 2 toward the island part 1 as shown by the arrow. As a result, the conventional lead frame is 72.
The thermal stress cannot be absorbed only by the strong island 9 part 2,
Island portion It - has the disadvantage of being warped vertically.
本発明のリードフレームは前述の熱応力を吸収する丸め
に、アイランドつり部にＩＣ素子を搭載するアイランド
面に対し垂直な方向に起伏する応力吸収用の屈曲部を有
している。The lead frame of the present invention has a stress-absorbing bent portion that is undulated in a direction perpendicular to the island surface on which an IC element is mounted on the island suspension portion, in the round shape for absorbing the thermal stress described above.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す平面図、第２図はその
ｘ−ｙＩｌｙｒ面図である。本発明のリードフレームは
、アイランドつ）部２の途中に、アイランド部１のＩＣ
素子搭５ｕｉｉに対し垂直方向に起伏する屈曲部２′が
形成され゛〔いる。この形成は、例えばアイランド部ｌ
のディンプル加工と同時に行うことができる。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is an x-yIlyr plane view thereof. The lead frame of the present invention has an IC of the island part 1 in the middle of the island part 2.
A bent portion 2' is formed which undulates in a direction perpendicular to the element tower 5uii. This formation is, for example, an island portion l.
This can be done at the same time as dimple processing.
以上説明したように本発明のリードフレームは、樹脂モ
ールド成形時の熱応力をアイランドつり部の屈曲部に吸
収させることにより、アイランド部のそり変形を防ぐこ
とができる。As described above, the lead frame of the present invention can prevent warping of the island portion by absorbing thermal stress during resin molding into the bent portion of the island suspension portion.
第１図は本発明のリードフレームの一実施例を示す平面
図、＃！２図はそのＸ−ＹＩｌ／ｒＩＴＪ図、第３図は
従来のリードフレームの縦断面図、第４図は従来のリー
ドフレームにおいてアイランド部が変形した場合の縦断
面図である。
１・・・・・・アイランド部、２・・・・・・アイラン
ドっ９部、２′・・・・・・屈曲部、３・・・・・・フ
レーム部、４・・・・・・上金型、５・・・・・・下金
型。
代理人 弁理士 内 原 ・ｔ１７ｉ′５を図
第 ２ 図FIG. 1 is a plan view showing an embodiment of the lead frame of the present invention, #! 2 is an X-YIl/rITJ diagram thereof, FIG. 3 is a longitudinal sectional view of the conventional lead frame, and FIG. 4 is a longitudinal sectional view of the conventional lead frame when the island portion is deformed. 1... Island part, 2... Island 9 part, 2'... Bent part, 3... Frame part, 4... Upper mold, 5...lower mold. Representative Patent Attorney Uchihara ・T17i'5 is shown in Figure 2.
Claims (1)
ム部とをつなぐアイランドつり部に屈曲部を設けたこと
を特徴とするＩＣ用リードフレーム。A lead frame for an IC, characterized in that a bent part is provided in an island hanging part that connects an island part and a frame part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9997186A JPS62254457A (en) | 1986-04-28 | 1986-04-28 | Lead frame for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9997186A JPS62254457A (en) | 1986-04-28 | 1986-04-28 | Lead frame for integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62254457A true JPS62254457A (en) | 1987-11-06 |
Family
ID=14261551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9997186A Pending JPS62254457A (en) | 1986-04-28 | 1986-04-28 | Lead frame for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62254457A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129849U (en) * | 1988-02-25 | 1989-09-04 | ||
| US6455348B1 (en) | 1998-03-12 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Lead frame, resin-molded semiconductor device, and method for manufacturing the same |
| US20100133672A1 (en) * | 2004-02-17 | 2010-06-03 | Delphi Technologies, Inc. | Dual-sided substate integrated circuit package including a leadframe having leads with increased thickness |
-
1986
- 1986-04-28 JP JP9997186A patent/JPS62254457A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129849U (en) * | 1988-02-25 | 1989-09-04 | ||
| US6455348B1 (en) | 1998-03-12 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Lead frame, resin-molded semiconductor device, and method for manufacturing the same |
| US20100133672A1 (en) * | 2004-02-17 | 2010-06-03 | Delphi Technologies, Inc. | Dual-sided substate integrated circuit package including a leadframe having leads with increased thickness |
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