JPS62241390A - printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] <Industrial use minute hand> The present invention relates to printed wiring boards.

<Prior art> Currently, amidst the vast expansion of industrial electronics,
Printed wiring boards are important components that support ICs) - 11 Wr H, ttX - Printed wiring boards currently in use are made by impregnating glass fiber, Kevlar, etc. with epoxy resin, polyimide resin, etc. and then thermosetting them. As a post-processing process, a large number of pores are added to the board obtained by cutting and heating at desired locations. There is a need for printed circuit boards that can be manufactured.

<Problems to be Solved by the Invention> The present invention provides a printed wiring board made of an aromatic polysulfone resin composition that can be manufactured by injection molding even in the case of a complicated shape with many pores. It is.

<Means for Solving the Problems> The present inventors added one or more inorganic substances selected from calcium carbonate, magnesium carbonate, and a eutectic of calcium carbonate and magnesium carbonate to aromatic polysulfone. By blending a predetermined amount of inorganic short UUa with a length of less than 500 μm, a composition with improved plating properties and excellent heat-resistant rigidity can be obtained without deteriorating the properties of aromatic polysulfone, and this composition can be injection molded. It has been found that a printed wiring board having good physical properties can be obtained by this method.

That is, the present invention provides (~aromatic polysulfone 60-9
07<ffi%, fB) One or more parts of an inorganic substance selected from calcium carbonate, magnesium carbonate, and a eutectic of calcium carbonate and magnesium carbonate 8-80
The present invention relates to a printed wiring board formed by injection molding an aromatic polysulfone resin pellet consisting of 8 to 80% by weight of inorganic short fibers having a diameter of less than 500 μm.

The present invention is achieved by injection molding a composition consisting of the above-mentioned 8 ingredients, and when a composition consisting only of aroma emitting bottle 1,5/lefon and an inorganic substance is injection molded, Although the plating properties are improved, the heat-resistant rigidity required for a printed wiring board is not sufficient.On the other hand, when a composition consisting only of aromatic polysulfone and inorganic short fibers is injection molded, the heat resistance required for a printed wiring board is insufficient. Either the heat resistance rigidity is improved or the plating performance is not improved.

Aromatic polysulfones used in the present invention are defined as polyarylene compounds in which arylene units are randomly or orderly located with ether and sulfone linkages. For example, those having the following structural formulas (1) to (O) can be mentioned, but those having the structures (2), (2), and C are particularly preferable from the viewpoint of the balance between physical properties and processability.

■00802 Not Hs ti3 Furthermore, polymer 1 in 100CC of solution? Regarding dimethylformamide solutions containing dimethylformamide, those with a reduced viscosity of 0.8 or more and 0.6 or less measured at 25°C have good heat resistance, strength,
It is preferable from the viewpoint of the balance between physical properties such as rigidity and toughness and moldability.

The blending amount of aromatic polysulfone is 6% based on the total amount of aromatic polysulfone, inorganic substance, and inorganic ali fiber.
0 to 90% by weight is suitable. If it is less than 60% by weight, the molding processability, physical properties, and appearance of the molded product of the composition will be insufficient; If mff exceeds 1%, the adhesion strength and heat-resistant rigidity of the plated layer of the molded product will not be sufficient.

Fish and vegetables are selected from calcium carbonate, magnesium carbonate and eutectic forces of calcium carbonate and magnesium carbonate. What is a eutectic of calcium carbonate and magnesium carbonate?
It is called dolomite.

The blending amount of these inorganic substances is 8 to 80 mff based on the total amount of aromatic polysulfone, inorganic substances, and inorganic short fibers.
1% is appropriate. If the inorganic content is less than 8% by weight,
The adhesion strength of the plating layer is insufficient, 8011ffi%
If it exceeds this, the strength of the molded product will decrease. In order to more effectively improve the adhesion strength of the plating layer and maintain the strength of the molded product, the content is preferably 5 to 2011%.

Examples of the inorganic mN include glass fibers, potassium titanate whiskers, boron fibers, and silicon carbide fibers. Among these, potassium titanate whiskers are preferred.

The length of the inorganic short fibers is less than 600 μm.

Inorganic short fiber! If the length of the fibers is 500 μm or more, the appearance of the molded product and the plating layer will be poor, and the narrow precision wiring required for printed wiring boards will not be achieved, which is undesirable.

The blending amount of the inorganic short fibers is suitably 8 to 80% by weight based on the total amount of the aromatic polysulfone, the inorganic substance, and the inorganic short fibers. When the inorganic short fiber content is less than 8%, the effect of improving the heat machinability of the molded product is insufficient;
If it exceeds 801 t%, the appearance of the molded product and the plating will be poor, and the narrow precision wiring required for printed wiring boards will not be achieved. From the viewpoint of improving physical properties and appearance, 6 to 20% by weight is more preferable.

In producing the composition used in the present invention, it is possible to feed each fiber separately to a melt mixer, or to mix them in advance in a Henschel mixer, a ball IIE mixer, etc.
It can also be fed to a pre-mixer by means of a ribbon deender, etc.

Used in the present invention? d1 compound acid, antioxidants and heat stabilizers, ultraviolet absorbers, to the extent that the purpose of the present invention is not impaired,
One or more conventional additives such as lubricants, release agents, colorants such as dyes and pigments, flame release agents, flame retardant aids, and antistatic agents can be added.

Furthermore, a small amount of one or more thermoplastic resins (eg, polyethylene, polypropylene, polyamide, polycarbonate, modified polyphenylene oxide, etc.) and thermosetting resins (eg, phenol resin, epoxy resin, etc.) can be added.

In molding the printed wiring board of the present invention, the injection molding method is not particularly limited. Resin temperature in injection molding: 880-880℃, mold temperature: 120-16℃
An example is 0°C.

Various methods have been proposed for forming conductive circuits on printed wiring boards, and one example is a semi-additive method.

Circuit formation by the semi-additive method is achieved through the following steps. The entire surface of the printed wiring board manufactured by injection molding of the present invention and having pores is plated with copper having a thickness of about 0.8 to 0.5 μm by electroless button plating. After printing a negative image of the desired circuit pattern with resist Φ ink, the entire surface including the pores is plated with copper to a thickness of about 50 μm by electrolytic plating. Finally, the resist ink printed area and the copper film plated on its upper surface are removed by the action of an etching solution, and a desired circuit is formed on the printed wiring board.

In addition, W-free, Pji copper plating method and electrolytic plating method are as follows:
For example, this can be done as follows.

(Operation of electroless plating) ■ Adjustment of base material Injection molded product is heated to 180 to 200℃ for 8 to 5 hours with hot air 1i1
Anneal in i fA oven.

■Degreasing 0PO-260 Cleaner L (Okuno Pharmaceutical tA) 100
Immerse in wdll solution at 65°C for 5 minutes.

■Water washing■Etching Immerse in a mixed solution of 400 P/l of chromic anhydride and 220 P/L of concentrated sulfuric acid at 78-82°C for 80 minutes.

■ Washing with water ■ Neutralization Immerse for 5 minutes at room temperature in a mixed solution of 50 ml of concentrated hydrochloric acid and 20 me/l of Top Catch C-200 (manufactured by Okuno Pharmaceutical Co., Ltd.).

■Washing C) Conditioning 0PC-850 Condage Adventure-M (manufactured by Okuno Pharmaceutical) 30
ψ′! Immerse in the solution for 8 minutes at 80°C.

■Water washing (φImmerse in Bridip concentrated hydrochloric acid 15011IVl! solution for 2 minutes at room temperature.

Φ・Catalyzing concentrated hydrochloric acid 150'l and 0PC-BO catalyst M (J
l! 50 (manufactured by Noh Pharmaceutical Co., Ltd.) for 5 minutes at room temperature.

0Water wash [phase] Accelerating 0PC-555 Accelerator M (manufactured by Okuno Pharmaceutical) 100
td7'l solution [1c, 7 molecules IJJ immersion at 28°C.

■Washing Q5゛・No t11! , Deplating TMP Chemical Copper Plating New 100 (manufactured by Okuno Pharmaceutical Co., Ltd.) solution is immersed for 7 minutes at room temperature to form a copper film of 0.8 to 0.5 μm.

(wL electroplating operation) 1ii Electrolessly plated specimen in 1c acid copper 200 V/solution was used as a cathode and phosphorous-containing copper was used as an anode, and current was applied for 110 minutes at a current density of 3 A/d to plate a thickness of 50 μm. Forms a film.

<Example> Examples 1 to 6 and Comparative Examples 1 to 4 Compositions of polyether sulfone (polyether sulfone 8600F manufactured by IOI), inorganic fibers, and inorganic staple fibers having as basic structure shown in Table 1 After mixing and melt-kneading at a temperature of 880° C. using a twin-screw extruder (PCM-80 manufactured by Ikegai Iron Works), the strands were cooled with water and then cut to obtain pellets.

The obtained pellets were injection molded using a Nestal 47/2g injection molding machine manufactured by Sumitomo Heavy Industries, with a cylinder temperature of 840 to 860.
℃, mold temperature 150°C], a tensile strength test piece, a heat distortion temperature test piece, and an IPC multipurpose spod were obtained.

Circuit formation on the engineering PC multi-purpose board was carried out in the following steps.

0.8 to the IFC multipurpose board using the method described above.
Electroless copper plating with a thickness of μm was formed on the entire surface. Then,
In order to form a negative image of the circuit, a photoresist (Odil 8E525 manufactured by Tokyo Ohka Kogyo Co., Ltd.) was coated in the desired shape and developed with Ω light to form a resist mask. Electrolytic plating was formed on the entire surface.

Next, the photoresist and the electroplated film formed thereon were removed using a photoresist stripping solution containing methylene chloride as the main component, and the areas where the photoresist had been formed were removed using spack etching Kl containing ammonium persulfate as the main component. The electroless copper plating film was removed to form the desired circuit. Then, the adhesion strength of the plating film was measured on a five-line width circuit section of the IPC multipurpose board.

The glass fiber used had a length of 200 μm and a diameter of 13 μm, and the potassium titanate whisker had a length of 15 μm.
μm, with a diameter of 0.8 μm.

The results are shown in Table 1.

Examples 7-8 and Comparative Examples 5-6 240 polysulfones having fi3 structure (UOC Co. p, Ude/Pt
7oO), inorganic substances and inorganic short llA fibers were mixed in the proportions shown in Table 2, the pelletizing temperature was 800°C, and the injection molding cylinder temperature was 380 to 850°C. I did the same operation.

The results are shown in Table 2.

Danger

Claims (1)

[Scope of Claims] (A) 60 to 90% by weight of aromatic polysulfone; (B) one or more inorganic substances selected from calcium carbonate, magnesium carbonate, and eutectic of calcium carbonate and magnesium carbonate; A printed wiring board formed by injection molding an aromatic polysulfone resin composition comprising: 80% by weight and (C) 8 to 80% by weight of inorganic short fibers having a length of less than 500 μm.