JPH11323131A - Thermoplastic resin composition and heat-resistant tray for ic - Google Patents

Abstract

(57) [Problem] To provide a thermoplastic resin composition having excellent heat resistance and moldability, having antistatic properties or conductivity, and a heat resistant tray for IC. A thermoplastic resin composition comprising 5 to 65 parts by weight of carbon fiber with respect to 100 parts by weight of a resin component comprising 15 to 55% by weight of an aromatic polycarbonate resin and 85 to 45% by weight of an aromatic polysulfone resin. And a heat-resistant tray for ICs obtained by molding the same.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antistatic or conductive thermoplastic resin composition and a heat-resistant tray for IC.

[0002]

2. Description of the Related Art As a tray for transporting IC parts (chips), a vinyl chloride resin, a polystyrene resin, a polypropylene resin or the like having conductivity or antistatic property has been conventionally used. When mounting an IC component on a printed circuit board by soldering, if the IC package absorbs moisture, solder heat generates water vapor inside the IC, causing blisters, cracks, etc., and breaking the IC component. It is necessary to remove water at a temperature of ~ 150 ° C. Conventionally, in this drying step, it was necessary to transfer the IC parts from the transport tray to an aluminum die-cast tray. However, in recent years, trays that can be used for both transport and drying have been developed and spread from modified polyphenylene ether resins having conductivity or antistatic properties. However, in order to shorten the time required for drying the IC component, a high drying temperature of, for example, 150 ° C. or more is required. However, in the case of a tray made of denatured polyphenylene ether resin, the heat resistance, the warpage of the molded product and the molding Satisfactory workability was not obtained.

On the other hand, aromatic polycarbonate resin is a resin having excellent mechanical strength and dimensional accuracy, but has heat resistance of at most 1.
50 ° C. Therefore, various thermoplastic resin compositions obtained by mixing an aromatic polycarbonate resin and an aromatic polysulfone resin for the purpose of improving the heat resistance and the like have been disclosed. For example, Japanese Patent Publication No. 45-39181 discloses that a composition having excellent heat resistance and mechanical properties can be obtained by mixing an aromatic polysulfone resin and an aromatic polycarbonate resin. Also,
Japanese Patent Publication No. 49-13855 discloses that a composition comprising an aromatic polysulfone resin and an aromatic polycarbonate resin is superior in heat resistance and mechanical properties to ABS resin. JP-A-54-28361 discloses that a composition comprising an aromatic polycarbonate resin and an aromatic polysulfone resin having a weight average molecular weight of more than 60,000 has improved chemical resistance and deflection temperature under load as compared with each resin. It is disclosed. Also, Japanese Patent Application Laid-Open
JP-A-51739 discloses that a composition comprising an aromatic polysulfone resin and an aromatic polycarbonate resin having a specific structure has excellent mechanical properties and improved chemical resistance. However, these compositions described above often fail to provide satisfactory physical properties because the aromatic polycarbonate resin inhibits the excellent physical properties represented by the inherent heat resistance of the aromatic polysulfone resin. Further, each of the above publications does not describe the use of the composition in a heat-resistant tray for IC.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a thermoplastic resin composition having excellent heat resistance and moldability, having antistatic properties or conductivity, and a heat resistant tray for IC. .

[0005]

Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the present inventors have selected a specific amount of aromatic polycarbonate resin and aromatic polysulfone resin, and a specific amount of carbon fiber, The inventors have found that the above object can be achieved by forming a composition, and have reached the present invention.
That is, the present invention is as follows. (1) A thermoplastic resin composition obtained by blending 5 to 65 parts by weight of carbon fiber with 100 parts by weight of a resin component comprising 15 to 55% by weight of an aromatic polycarbonate resin and 85 to 45% by weight of an aromatic polysulfone resin. (2) the ratio of the melt viscosity of the aromatic polycarbonate resin as defined below (eta _a) and the melt viscosity of the aromatic polysulfone resin _{(η b) (η a /} η b) is a 0.5 to 2.0 The thermoplastic resin composition according to (1). η _a : melt viscosity of the aromatic polycarbonate resin measured at 340 ° C. and a shear rate of 1216 / sec. η _b : melt viscosity of the aromatic polysulfone resin measured at 340 ° C. and a shear rate of 1216 / sec. (3) The thermoplastic resin composition according to (2), wherein η _a / η _b is 0.8 to 1.8. (4) The thermoplastic resin composition according to (1), (2) or (3), wherein the aromatic polycarbonate resin is a copolycarbonate or a homopolycarbonate using at least 30 mol% of bisphenol A as a raw material for producing the aromatic polycarbonate resin. (5) The aromatic polysulfone resin has the following formula

[0006]

Embedded image The thermoplastic resin composition according to (1), (2), (3) or (4), which has a repeating unit represented by (1) of 80 mol% or more. (6) A heat-resistant tray for IC formed by molding the thermoplastic resin composition according to (1), (2), (3), (4) or (5).

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The aromatic polycarbonate resin used in the present invention has a general formula:

[0008]

Embedded image And a mixture thereof having a repeating unit represented by the formula: In the formula, A is a divalent aromatic group which is a residue of a raw material dihydric phenol. The dihydric phenols that can be used to produce such aromatic polycarbonates are mononuclear or polynuclear aromatic compounds containing two hydroxyl groups that are directly bonded to aromatic carbon atoms as functional groups. Examples of dihydric phenols include:
2,2-bis (4-hydroxyphenyl) propane (bisphenol A), bis (4-hydroxyphenyl) methane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 2,2- (3 5,3 ′, 5′-tetrachloro-4,4′-hydroxyphenyl) propane,
2,2- (3,5,3 ′, 5′-tetrabromo-4,
Examples include, but are not limited to, 4'-hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclohexane, hydroquinone, resorcinol, dihydroxydiphenyl, and the like. The aromatic polycarbonate resin is preferably a copolycarbonate or homopolycarbonate using at least 30 mol% of bisphenol A. The terminal structure is determined according to each production method, and includes, for example, OH and OC (CH ₃ ) ₃ , but is not limited thereto. An example of a commercially available product is Sumitomo Dow Co., Ltd. product name Caliber 200-
3 and the like, but are not limited thereto. The melt viscosity of the aromatic polycarbonate resin used in the present invention when measured at 340 ° C. and a shear rate of 1216 / sec is preferably 2,000 to 10,000 poise, more preferably 2,000 to 6,000 poise. If the melt viscosity exceeds 10,000 poise, molding is difficult because the melt viscosity of the composition is high.

The aromatic polysulfone resin used in the present invention is a polystyrene in which an arylene unit, an ether bond and a sulfone bond are essential constituent units, and the arylene unit is located randomly or orderly together with the ether and sulfone bonds. Defined as an arylene compound. Representative examples include those having the following repeating units, but are not limited thereto.

[0010]

Embedded image [The compound (II) includes a random copolymer. Where:
R1 represents an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 3 to 10 carbon atoms, a phenyl group or a halogen atom, and p is a positive number of 0 to 4. m and n indicate the average number of repeating units, and m and n are from 0.1 to 100.
Is a positive number. Each R1 on the same or different nuclei may be different from each other. Each p may be different from each other. ]

[0011]

Embedded image (This compound includes a random copolymer. In the formula, R 1 represents an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 3 to 10 carbon atoms, a phenyl group or a halogen atom, and p represents 0 to 4 Q, m, and n indicate the average number of repeating units, and q is a positive number of 1 to 3, m, and n.
Is a positive number from 0.1 to 100. Each R1 on the same or different nuclei may be different from each other. Each p may be different from each other. The aromatic polysulfone resin used in the present invention includes:
(M / m + n) in the repeating unit represented by (II) or (III) is preferably 0.8 or more. Further, q in the structural unit of (III) is preferably 1. Among these, those having a repeating structural unit of (I) and (II) are preferable, and those having a repeating structural unit of (I) are more preferable. As examples of commercially available products, those of (I) include Sumika Excel PES3600P, 4100P, etc., which are trade names of Sumitomo Chemical Co., Ltd.
(II) is AMOCO's trade name UDELP-1
700 and the like, but are not limited to these. Further, the terminal structure is determined according to the production method of each resin, and includes, for example, Cl, OH, OR (R is an alkyl group) and the like, but is not limited thereto.

The melt viscosity of the aromatic polysulfone resin used in the present invention, when measured at 340 ° C. and a shear rate of 1216 / sec, is preferably from 1,000 to 6000 poise, more preferably from 1,000 to 3,000 poise. If the melt viscosity exceeds 6000 poise, the composition has a high melt viscosity, which makes molding difficult, which is not preferable. The melt viscosity ratio (η _a / η _b ) of the aromatic polycarbonate resin (a) and the aromatic polysulfone resin (b) used in the present invention measured at 340 ° C. and a shear rate of 1216 / sec is 0.5. It is preferably from 2.0 to 2.0, more preferably from 0.8 to 1.8, and even more preferably from 1.0 to 1.6. The amount of the aromatic polycarbonate resin blended in the resin composition of the present invention is 15 to 55% by weight based on the total weight of the aromatic polysulfone resin and the aromatic polycarbonate resin.
And more preferably 25 to 45% by weight.
If the amount of the aromatic polycarbonate resin is more than 55% by weight, the heat resistance of the composition is inferior.

The carbon fiber used in the present invention has a chemical composition of 9%.
0% or more is a fibrous substance composed of carbon, and polyacrylonitrile, pitch, regenerated cellulose or the like can be used as a raw material. A fibrous precursor spun using these raw materials, which has been treated at 1000 to 2000 ° C or graphitized at 2000 to 3000 ° C, is generally used because it exhibits high strength and high elasticity. Although the fiber length and fiber diameter of the carbon fiber used in the present invention are not particularly limited, those having a fiber length of 30 μm to 6 mm and a fiber diameter of 5 to 20 μm are generally used. As an example of a commercially available product, Toho Rayon Co., Ltd. product name Vesfight HTA-C6-
CS, HTA-CMF-0160N / S, and Donac Corporation's trade names Donacarbo S-231 and S-244, but are not limited thereto. The compounding amount of the carbon fiber used in the present invention is 5 to 65 parts by weight based on 100 parts by weight of the resin component composed of the aromatic polycarbonate resin and the aromatic polysulfone resin. If the compounding amount of the carbon fiber is less than 5 parts by weight, the antistatic property required for the heat resistant tray for IC is not satisfied, which is not preferable.
If the amount is more than 65 parts by weight, the melt viscosity of the composition becomes high, making it difficult to process into an IC tray and causing the IC tray to warp.

In the present invention, a fibrous or acicular reinforcing agent such as glass fiber, silica alumina fiber, alumina fiber, aluminum borate whisker, etc.
Inorganic fillers such as talc, mica, clay, and glass beads; release improvers such as fluororesins and metal soaps; coloring agents such as dyes and pigments; antioxidants; heat stabilizers; ultraviolet absorbers; One or more ordinary additives such as an agent can be added. Also, a small amount of thermoplastic resin, for example, polyethylene, polypropylene, polyvinyl chloride,
A small amount of thermosetting resin such as ABS resin, polystyrene, methacrylic resin, polyamide, polyester, polyphenylene sulfide, polyether ketone, polyphenylene ether and its modified product, polyetherimide, for example, phenol resin, epoxy resin, cyanate resin, isocyanate One or more of a resin, a polyimide resin, and a small amount of a rubber component can be added. The means for compounding the raw materials for obtaining the resin composition of the present invention is not particularly limited. After mixing an aromatic polycarbonate resin, an aromatic polysulfone resin, a reinforcing material such as glass fiber, an inorganic filler, a release improver, a heat stabilizer, etc. using a Henschel mixer, a tumbler, etc., the extruder is used. It is common to melt-knead the mixture.
The melt-kneading method at this time may be such that all the raw materials are mixed at once and then fed to an extruder.If necessary, raw materials such as reinforcing materials such as glass fibers and inorganic fillers may be mixed with resin. It may be fed separately from raw materials mainly composed of. The method for producing a molded article molded using the thermoplastic resin composition of the present invention is not particularly limited.
Methods for melting, shaping, and solidifying the resin include extrusion molding, injection molding, and blow molding. Of these, injection molding is particularly preferably used. The extruded molded article may be processed by cutting or pressing. Examples of the heat-resistant tray for an IC (also referred to as a chip tray) of the present invention include a tray with a square pocket and a tray with a rectangular pocket. The thermoplastic resin composition of the present invention can be used in addition to heat-resistant trays for ICs, parts for automobiles, aircraft, etc., industrial equipment, home appliances, tableware and medical equipment, OA,
It can be suitably used as a molding material for AV equipment, electronics, and electronic components, for example, semiconductor wafer carriers, LCD carriers, TAB tape carriers, IC sockets, etc., which particularly require heat resistance.

[0015]

EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited to these examples. The melt viscosity, deflection temperature under load, Izod impact strength, bending strength,
The measurement of the surface resistivity was performed by the following method. (1) Melt viscosity: The melt viscosity of the aromatic polycarbonate resin and the aromatic polysulfone resin used in the thermoplastic resin composition of the present invention was determined using a Capillograph 1B manufactured by Toyo Seiki Seisaku-Sho, Ltd., with a die diameter of 1 mm and 340 ° C. Shear speed 1
Measured at 216 / sec. (2) Deflection temperature under load: 127 mm in length and 12.7 m in width from the thermoplastic resin composition of the present invention using an injection molding machine.
m, a test piece having a thickness of 6.4 mm was formed and subjected to ASTM D6
The measurement was performed at a load of 18.6 kg / cm ² in accordance with No.48. (3) Izod impact strength The test piece of the above (2) was divided into two equal parts to obtain a test piece for measuring Izod impact strength, which was measured in accordance with ASTM D-256. (4) Bending strength The test piece of (2) was used as a test piece for measuring bending strength, and measured in accordance with ASTM D-790. (5) Surface Specific Resistance From the thermoplastic resin composition of the present invention, a test piece having a side length of 64 mm and a thickness of 3 mm was molded using an injection molding machine, and the voltage was measured with an insulation resistance meter (PDM-256 manufactured by Sanwa Keiki Seisakusho). 250
Measured in V.

Examples 1 to 5, Comparative Examples 1 to 3 Aromatic polycarbonate resin (manufactured by Sumitomo Dow Co., trade name: Caliber), aromatic polysulfone resin (manufactured by Sumitomo Chemical Co., Ltd., trade name: Sumika Excel PES) and carbon Textile (Vesfight HT, manufactured by Toho Rayon Co., Ltd.)
A-C6-CS) with the composition shown in Table 1 using a Henschel mixer, followed by a twin-screw extruder (PCM-3, manufactured by Ikegai Iron Works Co., Ltd.).
Using 0), the mixture was granulated at a cylinder temperature of 340 ° C. to obtain a thermoplastic resin composition. The weight% of each resin component is based on the total amount of the resin components. The parts by weight of the components other than the resin component are ratios per 100 parts by weight of the resin component. The melt viscosity of each resin was measured by the method described above. The test piece was molded from the thermoplastic resin composition at a cylinder temperature of 350 ° C. and a mold temperature of 120 ° C. using an injection molding machine (PS40E5ASE manufactured by Nissei Resin Industry Co., Ltd.), and the deflection temperature under load and Izod impact strength were measured. , Bending strength, and surface resistivity were measured, and the results are shown in Table 2.

[0017]

[Table 1]

[0018]

[Table 2]

Example 6 An injection molding machine (SG1 manufactured by Sumitomo Heavy Industries, Ltd.) was used using the thermoplastic resin composition having the composition shown in Example 2 obtained by the above method.
50M), cylinder temperature 340 ° C, mold temperature 1
50 ° C, injection speed 70%, injection pressure 1400kg / cm
^2. IC tray (length 31) with holding pressure 800 kg / cm ²
0mm, width 140mm, height 8mm, average thickness 1.5m
m) to obtain a good product without warpage. This IC
When the tray was heat-treated in a hot air circulating oven at 180 ° C. for 1 hour, no warping or deformation occurred.

[0020]

The thermoplastic resin composition of the present invention is excellent in heat resistance and mechanical properties, and the heat-resistant tray for IC molded therefrom can withstand drying of IC at high temperature and has good handleability. Excellent and very useful.

Claims (6)

[Claims] 1. A thermoplastic resin composition comprising 5 to 65 parts by weight of carbon fiber per 100 parts by weight of a resin component comprising 15 to 55% by weight of an aromatic polycarbonate resin and 85 to 45% by weight of an aromatic polysulfone resin. Stuff. Wherein the ratio of the melt viscosity of the aromatic polycarbonate resin as defined below (eta _a) and the melt viscosity of the aromatic polysulfone resin _{(η b) (η a /} η b) 0.5 to 2.0 The thermoplastic resin composition according to claim 1, wherein η _a : melt viscosity of the aromatic polycarbonate resin measured at 340 ° C. and a shear rate of 1216 / sec. η _b : melt viscosity of the aromatic polysulfone resin measured at 340 ° C. and a shear rate of 1216 / sec. 3. The method according to claim 2, wherein η _a / η _b is 0.8 to 1.8.
The thermoplastic resin composition according to the above. 4. An aromatic polycarbonate resin comprising at least 30 mol% of bisphenol A as a raw material for producing the same.
4. The thermoplastic resin composition according to claim 1, which is a copolycarbonate or a homopolycarbonate using the above. 5. The aromatic polysulfone resin has the following formula: 5. The thermoplastic resin composition according to claim 1, having a repeating unit represented by the formula: 80 mol% or more. 6. 6. A heat-resistant tray for IC formed by molding the thermoplastic resin composition according to claim 1, 2, 3, 4, or 5.