JPS62229884A - Photoelectric apparatus - Google Patents
Photoelectric apparatusInfo
- Publication number
- JPS62229884A JPS62229884A JP62065711A JP6571187A JPS62229884A JP S62229884 A JPS62229884 A JP S62229884A JP 62065711 A JP62065711 A JP 62065711A JP 6571187 A JP6571187 A JP 6571187A JP S62229884 A JPS62229884 A JP S62229884A
- Authority
- JP
- Japan
- Prior art keywords
- envelope
- photoelectric
- lead frame
- package
- lead frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013307 optical fiber Substances 0.000 claims abstract description 20
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 24
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は光電装置に係り、特に回路基板に取着されて使
用される光伝送システム用の発光装置及び受光装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a photoelectric device, and more particularly to a light emitting device and a light receiving device for an optical transmission system that are attached to a circuit board and used.
（従来の技術）
光伝送システムは低雑音、広帯域など優れた特徴を有す
ることから１通信、 ＣＡＴＶはもちろん自動車、オー
ディオその他の民生機器の配線に広く使用されるように
なってきた。(Prior Art) Optical transmission systems have excellent features such as low noise and wide bandwidth, and have therefore come to be widely used in wiring for communication, CATV, as well as automobiles, audio, and other consumer equipment.
その−例を第１図により説明すると、送信側の機器内の
回路基板（５）には電気信号を忠実に光信号に変換する
波形整形器電流増幅器など（以下周辺回路、と云う）と
、電気−光変換用のＬＥＤ素子やＬＤ素子などの発光素
子とがそれぞれ回路基板を介して配線されるか、または
発光素子と周辺回路用ＩＣ素子または発光素子を含む周
辺回路用ＩＣ素子を組み込んだ発光装置（１）がリード
フレーム（２）を介して半田（３）により所定配線（４
）に配線されている。An example of this will be explained with reference to FIG. 1. The circuit board (5) in the transmitting device includes a waveform shaper, current amplifier, etc. (hereinafter referred to as peripheral circuit) that faithfully converts electrical signals into optical signals. A light emitting element such as an LED element or an LD element for electrical-optical conversion is wired via a circuit board, or a light emitting element and an IC element for a peripheral circuit, or an IC element for a peripheral circuit including a light emitting element is incorporated. A light emitting device (1) is connected to a predetermined wiring (4) with solder (3) via a lead frame (2).
).
また受信側の機器内の回路基板（ｌＯ）には光信号を忠
実に電気信号に変換するＰＤ素子、ＡＰＤ素子などの受
光素子と周辺回路がそれぞれ回路基板を介して配線され
るか、または受光素子と周辺回路用ＩＣ素子、または受
光素子を含む周辺回路用ＩＣ素子を組み込んだ受光装置
（６）がリードフレーム（７）を介して半田（８）によ
り所定配線（９）に配線されている。そしてこの発光装
Ｅ （１）と受光装置（６）間は光フアイバコード（１
１）の両端に取着された光コネクタ（１２）に光結合を
行ない、発光装置！ （１）で電気−光変換を行なった
信号を受光装置（６）で光−電気変換を行なうようにな
されている。In addition, on the circuit board (IO) in the receiving side equipment, light receiving elements such as PD elements and APD elements, which faithfully convert optical signals into electrical signals, and peripheral circuits are wired via circuit boards, or light receiving A light receiving device (6) incorporating an element and an IC element for a peripheral circuit, or an IC element for a peripheral circuit including a light receiving element, is wired to a predetermined wiring (9) by solder (8) via a lead frame (7). . An optical fiber cord (1) is connected between the light emitting device E (1) and the light receiving device (6).
1) is optically coupled to the optical connectors (12) attached to both ends of the light emitting device! The signal subjected to electrical-to-optical conversion in step (1) is subjected to optical-to-electrical conversion in a light receiving device (6).
次に第２図及び第３図によりこの発光装！（１）。Next, see Figures 2 and 3 to see this light emitting device! (1).
受光装置（６）の構造及びこれに装着される光フアイバ
コード（１１）の端部に設けられた光コネクタの構造を
説明する。図中第１図と同一符号は同一部分を示す。The structure of the light receiving device (6) and the structure of the optical connector provided at the end of the optical fiber cord (11) attached to the light receiving device (6) will be explained. In the figure, the same reference numerals as in FIG. 1 indicate the same parts.
即ち発光または受光用の光電素子（２１）は通常透明な
エポキシ樹脂などのモールド体からなる第１の外囲器（
２２）内にリードフレーム（２） （７）の一部と共に
埋設されており、この第１の外囲器（２２）の外側には
光コネクタ（１２）を介して光フアイバコード（１１）
のファイバ（１１１）の光学研摩された端面（Ｉｌａ）
と、光電素子（２１）とが光結合する部分を除いて光遮
蔽部材からなるモールド体からなる第２の外囲器（２３
）が設けられ、この第２の外囲器には一面に例えば４本
のリードフレーム（２） （７）が突出されており、こ
の面とほぼ直角な面には光コネクタ（１２）を保持する
保持部（２４）が設けられている。また光コネクタ（１
２）は、光フアイバコード（１１）の端部にほぼ円柱状
の本体（１３）の軸に沿って光フアイバコード（１１）
及びファイバ（１１□）が挿入される孔部を有し所定位
置に一体形成されたフランジ（１４）及び保持部（２４
）に嵌着する係止部（１５）を有してなり、さらに光コ
ネクタ（１２）の後端部にはこの光コネクタ（１２）と
光フアイバコードとを固定するがしめリング（１６）が
嵌着されている。That is, the photoelectric element (21) for emitting or receiving light is usually formed of a first envelope (21) made of a molded body of transparent epoxy resin or the like.
An optical fiber cord (11) is embedded in the first envelope (22) together with a part of the lead frame (2) (7), and an optical fiber cord (11) is connected to the outside of the first envelope (22) via an optical connector (12).
optically polished end face (Ila) of the fiber (111) of
The second envelope (23) is made of a molded body made of a light shielding member except for the part where the photoelectric element (21) and the photoelectric element (21) are optically coupled.
), and this second envelope has, for example, four lead frames (2) (7) protruding from one surface, and a surface substantially perpendicular to this surface that holds an optical connector (12). A holding part (24) is provided to hold the holding part (24). Also, optical connector (1
2) The optical fiber cord (11) is attached along the axis of the substantially cylindrical body (13) at the end of the optical fiber cord (11).
and a flange (14) and a holding part (24) which have a hole into which the fiber (11□) is inserted and are integrally formed at a predetermined position.
), and a locking ring (16) is provided at the rear end of the optical connector (12) to fix the optical connector (12) and the optical fiber cord. It is fitted.
然るにこの様な構造からなる光電装置（１）（６）は第
２図及び第３図を見てもわかるように回路基板（５）（
１０）に対する接続及び固定はり−ドブレーム（２）（
７）を回路基板（５）（１０）の所定配Ｍ （４） （
９）に半田（３） （８）のみにて接続されており、光
コネクタ（１２）をリードフレームの形成する平面に対
してほぼ直交する方向からスナップインする際に、矢印
（１７）方向の力がかかりリードフレーム（２） （７
）を加工硬化→破断させる機械的な欠点がある。また光
コネクタ（１２）の着脱の際に、リードフレーム（２）
（７）が変形するため光コネクタ（１２）の着脱作業
が容易でないという欠点がある。However, as can be seen from FIGS. 2 and 3, the photoelectric devices (1) (6) having such a structure are made of circuit boards (5) (
10) Connection and fixing beam - dobe frame (2) (
7) to the predetermined layout M (4) (
9) with only solder (3) and (8), and when snapping in the optical connector (12) from a direction almost perpendicular to the plane formed by the lead frame, the Lead frame (2) (7)
) has mechanical drawbacks such as work hardening and breakage. Also, when attaching or detaching the optical connector (12), the lead frame (2)
There is a drawback that the optical connector (12) cannot be easily attached or detached because the optical connector (7) is deformed.
（発明が解決しようとする問題点）
上記したように光電装置を形成する際には、リードフレ
ームを破断させたり、光ファイバの着脱作業が容易でな
いといった欠点がある。そこで本発明はこれら従来の光
電装置の欠点にかんがみなされたもので、回路基板に固
定し易く１機械的に安定な光電装置を提供することを目
的とする。(Problems to be Solved by the Invention) As described above, when forming a photoelectric device, there are drawbacks such as breakage of the lead frame and difficulty in attaching and detaching optical fibers. SUMMARY OF THE INVENTION The present invention has been made in view of these drawbacks of conventional photoelectric devices, and an object of the present invention is to provide a mechanically stable photoelectric device that is easy to fix to a circuit board.
（問題点を解決するための手段）
本発明の光電装置では、光電素子が接続されたリードフ
レームの形成する平面から離間し、かっこの平面に対し
て光ファイバの挿入側の位置において、ピンが第２の外
囲器に植設され、このピンとリードフレームが回路基板
に固定されて外囲器を回路基板に支持し得るようにした
ことにより構成される。(Means for Solving the Problems) In the photoelectric device of the present invention, the pin is spaced apart from the plane formed by the lead frame to which the photoelectric element is connected, and at a position on the insertion side of the optical fiber with respect to the plane of the bracket. The second envelope is implanted, and the pins and lead frame are fixed to the circuit board so that the envelope can be supported by the circuit board.
（作 用）
本発明の光電装置において、第１の外囲器と第２の外囲
器はリードフレームとピンにより回路基板に固定されて
いるので、リードフレームの破断や光ファイバの着脱の
不具合を防止することができる。(Function) In the photoelectric device of the present invention, since the first envelope and the second envelope are fixed to the circuit board by the lead frame and pins, problems such as lead frame breakage and attachment/detachment of the optical fiber can be avoided. can be prevented.
（実施例）
次に第５図及び第６図により本発明の光電装置の一実施
例を説明する。図中光フアイバコード、光コネクタ、リ
ードフレームなどはほぼ同一なので同一符号を使用し特
に説明は行なわない。(Embodiment) Next, an embodiment of the photoelectric device of the present invention will be described with reference to FIGS. 5 and 6. Since the optical fiber cord, optical connector, lead frame, etc. in the figures are almost the same, the same reference numerals will be used and no particular explanation will be given.
即ち光電装置（１） （６）は１発光または受光用の光
型素子または光電素子と周辺回路用ＩＣ素子または光電
素子を含む周辺回路用ＩＣ素子（以下単に光電素子と云
う） （４１）を所定のリードフレーム（２） （７）
上に載置配線し、このリードフレーム（２） （７）の
一部と光電素子（４１）を埋設するように透明なエポキ
シ樹脂などのモールド体からなる第１の外囲器（４２）
を形成し、この第１の外囲器（４２）の外側にモールド
成形または固着され、その一部に光コネクタとのスナッ
プインにより光結合を行なう保持部（４４）を有する導
電性部材からなる第２の外囲器（４３）からなる。この
第２の外囲器（４３）のリードフレーム（２） （７）
の出口には光遮断および固着を兼ねた不透明接着剤層（
４５）を設けると共にこれらリードフレーム（２） （
７）の形成する平面とは離間した位置にこの第２の外囲
器（４３）に植設されたピン（４６）を回路基板（５）
（１０）を介して接地回路（４ａ）（９ａ）に半田（
３ａ） （８ａ）により固定し得るようになされている
。また第２の外囲器（４３）はリードフレーム（２）
（７）との電気的接触およびリードフレーム切断部の形
状不ぞろいによる発光素子、受光素子の位置精度の悪化
を防ぐため凹部（５０）を有している。That is, the photoelectric device (1) (6) consists of one optical element or photoelectric element for emitting or receiving light, and an IC element for peripheral circuits or an IC element for peripheral circuits including the photoelectric element (hereinafter simply referred to as photoelectric element) (41). Predetermined lead frame (2) (7)
A first envelope (42) made of a molded body of transparent epoxy resin or the like is placed and wired thereon, and a part of the lead frame (2) (7) and the photoelectric element (41) are buried therein.
The first envelope (42) is molded or fixed on the outside of the first envelope (42), and is made of a conductive member that has a holding part (44) that performs optical coupling by snap-in with an optical connector. It consists of a second envelope (43). Lead frame (2) (7) of this second envelope (43)
There is an opaque adhesive layer (
45) and these lead frames (2) (
The pin (46) implanted in this second envelope (43) is placed in a position apart from the plane formed by the circuit board (5).
(10) to the ground circuits (4a) and (9a) by soldering
3a) It can be fixed by (8a). Further, the second envelope (43) is connected to the lead frame (2).
A recess (50) is provided to prevent deterioration of the positional accuracy of the light emitting element and light receiving element due to electrical contact with the lead frame (7) and irregular shapes of the cut portion of the lead frame.
この第２の外囲器（４３）の材料としては例えば炭幸を
含有させたプラスチック成形物があり、この炭素の含有
量によりある程度任意に電導率をコントロールすること
が可能であるし、しかも成形前の樹脂材料に炭素を混ぜ
ておくだけでよく１作業的には簡便である。勿論炭素の
かわりに金属粉末その低導電性を上げるものであれば良
く、さらに作業性を考えれば金属のモールドその他作業
性のよい方法で成形してもよい。なお、ビン（４６）は
細い銅線で充分である。The material of this second envelope (43) is, for example, a plastic molded product containing charcoal, and the electrical conductivity can be controlled to some extent by controlling the carbon content, and moreover, it is possible to mold the material. This process is simple and requires only mixing carbon with the previous resin material. Of course, instead of carbon, metal powder may be used as long as it increases its low conductivity, and if workability is considered, metal molding or other methods with good workability may be used. Note that a thin copper wire is sufficient for the bottle (46).
また第２の外囲器（４３）は一体部品で作られている必
要はなく、分割形成してもよく、分割されている場合、
そのすべてが導電性材料である必要もない。即ち例えば
光電素子（４１）を含む第１の外囲器（４２）の一部ま
たは全域にわたって導電材料からなる部品が固持され、
この部品と接触して固着された導電性ピンを回路基板の
接地配線に固着すればよい。さらに発光装置、受光装置
と光フアイバコードとの光結合は必ずしも光コネクタを
使用せずに直接第２の外ＶＩＩ器（４３）と光フアイバ
コードを固着するような構造にしても良いことは勿論で
ある。Further, the second envelope (43) does not need to be made of an integral part, and may be formed by dividing it, and if it is divided,
Not all of them need to be conductive materials. That is, for example, a part made of a conductive material is fixed over a part or the entire first envelope (42) including the photoelectric element (41),
The conductive pin that is fixed in contact with this component may be fixed to the ground wiring of the circuit board. Furthermore, it goes without saying that the optical coupling between the light emitting device, the light receiving device, and the optical fiber cord may be structured so that the second external VII device (43) and the optical fiber cord are directly fixed without necessarily using an optical connector. It is.
以上述べたように本発明の構成によれば、回路基板に固
定し易く１機械的に安定で、かつ光ファイバの着脱の容
易な新規な光電装置を提供することができる。As described above, according to the configuration of the present invention, it is possible to provide a novel photoelectric device that is easy to fix to a circuit board, is mechanically stable, and allows easy attachment and detachment of optical fibers.
第１図は光伝送回路を示す説明図、第２図は光電装置、
光フアイバケーブル及び光コネクタの関係の一例を示す
断面図、第３図は第２図の光電装置の底面図、第４図は
光電装置の他の例を示す断面図、第５図及び第６図は本
発明の光電装置の一実施例を示す図であり、第５図は光
電装置、光フアイバケーブル及び光コネクタの関係の一
例を示す断面図、第６図は第５図の光電装置の底面図で
ある。Figure 1 is an explanatory diagram showing an optical transmission circuit, Figure 2 is a photoelectric device,
3 is a bottom view of the photoelectric device shown in FIG. 2; FIG. 4 is a sectional view showing another example of the photoelectric device; FIGS. The figures are diagrams showing one embodiment of the photoelectric device of the present invention, FIG. 5 is a sectional view showing an example of the relationship between the photoelectric device, the optical fiber cable, and the optical connector, and FIG. 6 is a diagram showing the photoelectric device of FIG. 5. It is a bottom view.
Claims (2)
続されたリードフレームの一部を保持する第１の外囲器
と、この第１の外囲器を収容する外囲器であって、前記
光電素子との光結合を行なう光ファイバが挿入され、こ
の光ファイバを保持する保持部を有する第２の外囲器と
を備えた光電装置において、 前記光ファイバは前記リードフレームの形成する平面に
対してほぼ直交する方向から挿入されるとともに、前記
リードフレームの形成する平面から離間した位置におい
て第２の外囲器にピンが固定され、前記ピンと前記リー
ドフレームが回路基板に固定されて、前記第２の外囲器
を前記回路基板に支持し得るようにしたことを特徴とす
る光電装置。(1) A first envelope that holds a photoelectric element for emitting or receiving light and a part of a lead frame electrically connected to the photoelectric element, and an envelope that houses the first envelope. In the photoelectric device, the optical fiber is inserted into a second envelope having a holding portion for holding the optical fiber, and the optical fiber is inserted into the second envelope for optically coupling with the photoelectric element. A pin is inserted into the second envelope from a direction substantially perpendicular to a plane formed by the lead frame, and is fixed to the second envelope at a position spaced apart from the plane formed by the lead frame, and the pin and the lead frame are fixed to the circuit board. A photoelectric device characterized in that the second envelope can be supported by the circuit board.
対して前記光ファイバの挿入側で前記第２の外囲器に植
設されていることを特徴とする特許請求の範囲第１項記
載の光電装置。(2) The pin is implanted in the second envelope on the insertion side of the optical fiber with respect to a plane formed by the lead frame. Photoelectric device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62065711A JPS62229884A (en) | 1987-03-23 | 1987-03-23 | Photoelectric apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62065711A JPS62229884A (en) | 1987-03-23 | 1987-03-23 | Photoelectric apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6236081A Division JPS57177580A (en) | 1981-04-27 | 1981-04-27 | Device for light emission and detection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62229884A true JPS62229884A (en) | 1987-10-08 |
| JPS6329431B2 JPS6329431B2 (en) | 1988-06-14 |
Family
ID=13294876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62065711A Granted JPS62229884A (en) | 1987-03-23 | 1987-03-23 | Photoelectric apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62229884A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750204A1 (en) * | 1995-06-22 | 1996-12-27 | Hitachi, Ltd. | Optical semiconductor array module, method of fabricating the module, and external board mounting structure of the module |
| EP1217407A2 (en) | 2000-12-20 | 2002-06-26 | The Furukawa Electric Co., Ltd. | Optical/electric composite connector |
| US6499889B1 (en) * | 1999-12-08 | 2002-12-31 | Yazaki Corporation | Method of assembling optical connector, optical connector and hybrid connector |
| US7267260B2 (en) * | 2002-09-05 | 2007-09-11 | Intel Corporation | Apparatus for holding a fiber array |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119292A (en) * | 1974-02-21 | 1975-09-18 | ||
| JPS51129244A (en) * | 1975-04-18 | 1976-11-10 | Bunker Ramo | Optical device for focusing light beam |
| JPS5478147A (en) * | 1977-12-05 | 1979-06-22 | Hitachi Ltd | Light guide |
-
1987
- 1987-03-23 JP JP62065711A patent/JPS62229884A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119292A (en) * | 1974-02-21 | 1975-09-18 | ||
| JPS51129244A (en) * | 1975-04-18 | 1976-11-10 | Bunker Ramo | Optical device for focusing light beam |
| JPS5478147A (en) * | 1977-12-05 | 1979-06-22 | Hitachi Ltd | Light guide |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750204A1 (en) * | 1995-06-22 | 1996-12-27 | Hitachi, Ltd. | Optical semiconductor array module, method of fabricating the module, and external board mounting structure of the module |
| US5675685A (en) * | 1995-06-22 | 1997-10-07 | Hitachi Ltd. | Optical semiconductor array module, method of fabricating the module, and external board mounting structure of the module |
| US6499889B1 (en) * | 1999-12-08 | 2002-12-31 | Yazaki Corporation | Method of assembling optical connector, optical connector and hybrid connector |
| EP1217407A2 (en) | 2000-12-20 | 2002-06-26 | The Furukawa Electric Co., Ltd. | Optical/electric composite connector |
| EP1217407B1 (en) * | 2000-12-20 | 2010-10-20 | The Furukawa Electric Co., Ltd. | Optical/electric composite connector |
| US7267260B2 (en) * | 2002-09-05 | 2007-09-11 | Intel Corporation | Apparatus for holding a fiber array |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6329431B2 (en) | 1988-06-14 |
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