JPS622255U - - Google Patents
Info
- Publication number
- JPS622255U JPS622255U JP1985094061U JP9406185U JPS622255U JP S622255 U JPS622255 U JP S622255U JP 1985094061 U JP1985094061 U JP 1985094061U JP 9406185 U JP9406185 U JP 9406185U JP S622255 U JPS622255 U JP S622255U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- circuit board
- printed circuit
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案による半導体素子取付装置の
分解状態の斜面図、第２図は同他の実施例による
分解状態の斜面図、第３図は取付状態の斜面図、
第４図は従来の半導体素子取付装置を示す斜面図
、第５図、第６図は同第２、第３の従来例を示す
斜面図である。
１０……半導体素子、１１……フランジ、１２
……端子、２０……ＰＣ基板、２１……挿入片、
２１ａ……係合窓孔、３０……ヒートシンク、３
１……取付孔、３１ａ……挿入部、３２……係合
突起、３３……ビス孔。
FIG. 1 is an exploded perspective view of the semiconductor device mounting device according to this invention, FIG. 2 is an exploded perspective view of another embodiment, and FIG. 3 is an exploded perspective view of the attached device.
FIG. 4 is a perspective view showing a conventional semiconductor element mounting apparatus, and FIGS. 5 and 6 are perspective views showing second and third conventional examples. 10... Semiconductor element, 11... Flange, 12
... terminal, 20 ... PC board, 21 ... insertion piece,
21a... Engagement window hole, 30... Heat sink, 3
1... Attachment hole, 31a... Insertion part, 32... Engagement protrusion, 33... Screw hole.
Claims (1)
ト配線基板に装備した半導体素子取付装置におい
て、ヒートシンクに穿けられた取付孔と、この取
付孔に位置決め係合できる係合部をもつプリント
基板とを備え、半導体素子の端子とヒートシンク
との間隔を保持できるように構成したことを特徴
とする半導体素子取付装置。 A semiconductor device mounting device in which a printed circuit board is equipped with a semiconductor device fixed to a heat sink, which includes a mounting hole drilled in the heat sink and a printed circuit board having an engaging portion that can be positioned and engaged with the mounting hole, and a semiconductor device mounted on a printed wiring board. 1. A semiconductor device mounting device characterized in that the device is configured to maintain a distance between a terminal and a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985094061U JPS622255U (en) | 1985-06-20 | 1985-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985094061U JPS622255U (en) | 1985-06-20 | 1985-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622255U true JPS622255U (en) | 1987-01-08 |
Family
ID=30652286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985094061U Pending JPS622255U (en) | 1985-06-20 | 1985-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622255U (en) |
-
1985
- 1985-06-20 JP JP1985094061U patent/JPS622255U/ja active Pending