JPH02131395U - - Google Patents
Info
- Publication number
- JPH02131395U JPH02131395U JP3999789U JP3999789U JPH02131395U JP H02131395 U JPH02131395 U JP H02131395U JP 3999789 U JP3999789 U JP 3999789U JP 3999789 U JP3999789 U JP 3999789U JP H02131395 U JPH02131395 U JP H02131395U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- contact
- opposite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る電子部品の取付構造の一
実施例を示す部分断面図、第２図は第１図中Ａ矢
視図、第３図は従来の電子部品の取付構造の一例
を示す部分断面図である。
４……スルーホール、１１……パワートランジ
スタ、１１ａ……リード、１２……箱体壁部、１
３……プリント基板。
FIG. 1 is a partial sectional view showing an embodiment of the electronic component mounting structure according to the present invention, FIG. 2 is a view taken in the direction of arrow A in FIG. 1, and FIG. 3 is an example of the conventional electronic component mounting structure. FIG. 4...Through hole, 11...Power transistor, 11a...Lead, 12...Box wall, 1
3...Printed circuit board.
Claims (1)
プリント基板の電子部品実装位置の面と反対側の
面をヒートシンクに接触して取り付ける一方、プ
リント基板に、前記電子部品実装位置の面と反対
側の面とに通じる複数のスルーホールを開設した
ことを特徴とする電子部品の取付構造。 An electronic component is mounted in contact with a printed circuit board, and the surface of the printed circuit board opposite to the surface where the electronic component is mounted is mounted in contact with a heat sink, while the surface opposite to the surface where the electronic component is mounted is mounted on the printed circuit board. An electronic component mounting structure characterized by having a plurality of through holes that communicate with the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3999789U JPH02131395U (en) | 1989-04-06 | 1989-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3999789U JPH02131395U (en) | 1989-04-06 | 1989-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131395U true JPH02131395U (en) | 1990-10-31 |
Family
ID=31549401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3999789U Pending JPH02131395U (en) | 1989-04-06 | 1989-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131395U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015085550A (en) * | 2013-10-29 | 2015-05-07 | セイコーエプソン株式会社 | Liquid ejection device and control circuit board for liquid ejection device |
-
1989
- 1989-04-06 JP JP3999789U patent/JPH02131395U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015085550A (en) * | 2013-10-29 | 2015-05-07 | セイコーエプソン株式会社 | Liquid ejection device and control circuit board for liquid ejection device |