JPS62203381A - Semiconductor pressure detector - Google Patents

Abstract

PURPOSE:To improve the quality of a semiconductor pressure-sensing device by a method wherein sections for stopping the flow of a bonding agent are provided on a mount for an element for the prevention of the bonding agent from reaching a through-hole. CONSTITUTION:An alumina substrate 3 is installed on the bottom of a cavity in a case 4 housing a pressure sensor. Semicircular recesses 4a and 4b are provided on inner walls 4c of a mount for the alumina substrate 3 and on mounting surfaces for the alumina substrate 3 between the inner walls 4c and a through-hole 4d, respectively. In a process of bonding the alumina substrate 3, mounted with a pressure sensor main body consisting of a diaphragm 1 and bed 2, to the mounting surfaces in the case 4 with an adhesive agent 5, the semicircular recesses 4a and 4b prevent the adhesive agent 5, if applied more than prescribed, from flowing into the through-hole 4d. Consequently, it is ensured that there will no blockage of the through-hole 4d attributable to the adhesive agent 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor pressure detection device, and particularly to the structure of an element mounting body thereof.

[Conventional technology]

Figure 3 is a sectional view T, (1) showing the structure of a conventional pressure sensor.
) The silicon diaphragm (2) for detecting positive pressure is a silicon pedestal that makes it difficult for distortion to occur in the silicon diaphragm (1), and has a first through hole that guides outside air to the silicon diaphragm (1). (3) is an alumina substrate with a hole in the center, and (4) is a pressure sensor case with a second through hole in the center connected to the first through hole for guiding outside air to the silicon diaphragm (1). , with alumina substrate 3
) and are bonded by adhesive (5). This case (4
) and the silicon pedestal (2) are coupled via an alumina substrate (3). (6) is a wire whose one end is connected to the terminal of the diaphragm, and receives and receives output signals and base voltage from the outside.

[The problem that the invention attempts to solve]

Conventional pressure sensors are configured as described above, so
Pressure sensor case (4), diaphragm (1), and silicone stand! (2) and a pressure sensor body made of an alumina substrate (3) are bonded together with an adhesive, there is a problem in that the second through hole of the pressure sensor case (4) is blocked by the adhesive.

The present invention has been made to solve the above-mentioned problems and provides a semiconductor pressure detection device in which the through hole of the element mounting body is not blocked by the joining member.

[Means for solving problems]

The semiconductor pressure detection device according to the present invention is provided with a joining member flow prevention portion that prevents the joining member from reaching the through hole in a part of the element mounting body.

[Effect]

In the semiconductor pressure detection device according to the present invention, the joining member flow prevention portion prevents the joining member from flowing into the through hole.

〔Example〕

FIG. 1 shows a sectional view of an embodiment of the invention.

The same reference numerals as in FIG. 1183 indicate the same or corresponding parts, and the explanation will be omitted.

(4a) and (4b) are the inner wall portion (4C) of the mounting surface of the alumina substrate (3) provided on the concave lower surface of the pressure sensor space (4), and this inner wall portion (4C). These are semicircular recesses provided on the mounting surface between the 20M receiving hole (4d) and the 20M receiving hole (4d).

By providing these four semicircular parts (4a) (4b), the alumina substrate (3), on which the pressure sensor body consisting of the diaphragm (11 and the pedestal (2)) is attached, can be attached to the mounting surface of the pressure sensor case (4). When bonding with the adhesive (5), even if the adhesive +5) is slightly larger than the specified amount, the semicircular four parts (4m) (4b) prevent it from flowing into the second through hole (4d), The second through hole (4d
) will not be blocked by the adhesive (5).

FIG. 2 shows another embodiment of the invention. In this embodiment, a wall (4e) is provided around the opening of the second through hole (4d) on the mounting surface of the pressure sensor case (4) to which the pressure sensor body is mounted. This wall (
4e), even if the adhesive (5) used to attach the pressure sensor body to the mounting surface is in excess of the specified amount, the adhesive (5) will not flow into the second through hole due to this wall (4e). (4d), and the adhesive (5) does not close this second through hole (4d).

〔Effect of the invention〕

As explained above, the present invention is provided with a joining member flow prevention part that prevents the joining member from reaching the through hole in a part of the element mounting body, so that the quality of the semiconductor pressure detection device can be improved. There is an effect.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing a conventional pressure sensor. In the figure, (1) is a silicon diaphragm, (2) is a silicon pedestal, (3) is an alumina substrate, (4) is a pressure sensor case, (5) is an adhesive, (4a) and (4b) are semicircular four parts. , (4e) is a wall portion. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (3)

[Claims] (1) A semiconductor pressure sensing element consisting of a diaphragm, a mounting base to which the diaphragm is mounted, an element mounting body having an element mounting surface to which the mounting base is mounted via a joining member, and a through hole that opens on the mounting surface and guides outside air to the diaphragm; and the joining member reaching the through hole in a part of the element mounting body between the mounting surface and the opening of the through hole. A semiconductor pressure detection device characterized in that a bonding member flow prevention section is provided to prevent the flow of a joining member. (2) The semiconductor pressure detection device according to claim 1, wherein the joining member flow prevention portion has a convex shape. (3) The semiconductor pressure detection device according to claim 1, wherein the joining member flow prevention portion has a concave shape.