JPS6079242A - Pressure converter - Google Patents
Pressure converterInfo
- Publication number
- JPS6079242A JPS6079242A JP58187044A JP18704483A JPS6079242A JP S6079242 A JPS6079242 A JP S6079242A JP 58187044 A JP58187044 A JP 58187044A JP 18704483 A JP18704483 A JP 18704483A JP S6079242 A JPS6079242 A JP S6079242A
- Authority
- JP
- Japan
- Prior art keywords
- base
- thick film
- vacuum
- pressure
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 description 9
- 210000003298 dental enamel Anatomy 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- SUDBRAWXUGTELR-HPFNVAMJSA-N 5-[[(2r,3r,4s,5s,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxymethyl]-1h-pyrimidine-2,4-dione Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OCC1=CNC(=O)NC1=O SUDBRAWXUGTELR-HPFNVAMJSA-N 0.000 description 1
- 241000555745 Sciuridae Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、圧力変換器に係り、ｔｌケに絶対圧基準形の
圧力変換器に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a pressure transducer, and more particularly to an absolute pressure reference type pressure transducer.
従来の絶対圧基準形出力変換器の一例として、例えは、
特開昭５６−２９１３５号に開示宴れたものが知られて
いる。この公知のものは、シリコンチップの一方の面を
エツチングにより加工し、薄肉化し、その反対面に拡散
によりピエゾ抵抗を形成している。そして、このシリコ
ンチップの四部の方を基台に接着し、四部２真空祭とす
りものである。測定用の圧力は、ピエゾ抵抗の形成面ｆ
ｌｌｌｌに導入される。この基台は、このゲー ジから
の出力信号の増「ｌ］、温度補償を行う厚膜回路基板と
ともに、樹脂製ハウジング内に収納埒れる。As an example of a conventional absolute pressure reference type output converter, for example,
It is known that it was disclosed in Japanese Patent Application Laid-Open No. 56-29135. In this known method, one side of a silicon chip is processed by etching to make it thin, and a piezoresistor is formed on the opposite side by diffusion. Then, the four parts of this silicon chip were glued to the base, and the four parts and the second vacuum festival were made. The pressure for measurement is the formation surface f of the piezoresistor.
llll will be introduced. This base is housed in a resin housing together with a thick film circuit board that amplifies the output signal from this gauge and performs temperature compensation.
この従来例にあって問題となるのは、ピエゾＵ（抗形成
面側に圧力を導入する点にめる。Ｊ−なわち、湿度の高
い気体や、腐食性の気体などを測に１７ようとすると、
ピエゾ抵抗が変化する。したがって、被測定気体が限定
されることになる。The problem with this conventional example is that pressure is introduced to the anti-forming surface side. Then,
Piezo resistance changes. Therefore, the gas to be measured is limited.
それに対し−Ｃ、シリコンチップの四部側に被測定気体
を導入ｆ−るものとしこ、例えシ」′、特開昭５７−１
８６１３７ 、５７ １８６］ ３８写などのものが・
ハコられている。このものにあ−９てに１．ピエゾ抵抗
形成面側を金属ケースの内面側にむけるようにし、この
ケース内を真空室とするようにしている。さらに、この
ケース内に、増Ｉｌｌ ’ ？ｌｒａ度補償用の厚膜回
路基板を内蔵して、全体を小型化している。On the other hand, suppose that the gas to be measured is introduced into the four sides of the silicon chip, for example '', JP-A-57-1
86137, 57 186] 38 copies etc.
I'm being attacked. This thing is a-9 and 1. The piezoresistance forming surface side faces the inner surface of the metal case, and the inside of the case is used as a vacuum chamber. Furthermore, within this case, increase Ill'? It has a built-in thick film circuit board for lra degree compensation, making the whole device smaller.
しかしながら、このような溝成にあっては、ケース内に
厚膜回路基板を固定するために、有機系の接着剤を用い
ている。そのため、この接着剤からのアウトガスにより
、真空室の真空度全保持できず、検出誤差をもたらすこ
とになる。However, in such a groove structure, an organic adhesive is used to fix the thick film circuit board within the case. Therefore, due to outgas from the adhesive, the vacuum chamber cannot be maintained at its full vacuum level, resulting in detection errors.
このような問題に対しては、厚膜回路基板全外付けすれ
ばよいわけであるが、そうすると、小型化が達成しえな
くなる。To solve this problem, it is possible to attach the thick film circuit board entirely externally, but if this is done, it becomes impossible to achieve miniaturization.
本発明の目的は、被測定気体について制限されることな
く、小型で、しかも検出精度のよい絶対圧基準型圧力変
換器を提供するにある。An object of the present invention is to provide an absolute pressure reference type pressure transducer which is small in size and has good detection accuracy without being limited by the gas to be measured.
〔発明の概−決〕
本発明は、ピエゾ抵抗形成面は真空室側にむけることに
より耐久性を向上し、検出回路を真空ケース内に設ける
ことにより小型化を図り、さらに、検出回路はケースの
一部に設けたほうろう部の上に厚膜印刷により形成し、
検出精度を得るようにしたものである。[Summary of the Invention] The present invention improves durability by facing the piezoresistance forming surface toward the vacuum chamber, and achieves miniaturization by providing the detection circuit inside the vacuum case. It is formed by thick film printing on the enamel part provided in a part of the
This is to obtain detection accuracy.
本発明の一実施例について、第１図および第２図を用い
て説明する、。An embodiment of the present invention will be described using FIG. 1 and FIG. 2.
プレス加工された金属製のベースＪのうち、中央円形の
ほうろう部２には、メッキ処見１！が施□される。その
上で、全面にガラスコープ・ｆングが施され、高温隔着
される。メツギ処理がされたほうろう部２は、ガラス被
覆が形成さ７段）。それ以外のガラスコート除去部３で
リス１、全屈ベース１にガラスが隔着し＝Ｃいため、は
うろうは形成されない。The central circular enamel part 2 of the pressed metal base J is plated 1! will be applied. On top of that, the entire surface is coated with a glass scope and sealed at a high temperature. The enameled part 2, which has been treated with Metsugi, is coated with glass in 7 stages). Since the glass is separately attached to the squirrel 1 and the fully bent base 1 in the glass coat removal section 3 other than that, no creeping is formed.
このようにして、部分はうろうされたｔ！、うろう基板
４の中のほうろう部２の上に、温度補償回路、増巾回路
となる厚膜回路６が印刷形成されろ。In this way, the portion was blown away! A thick film circuit 6 serving as a temperature compensation circuit and an amplification circuit is printed and formed on the enamel part 2 in the enamel substrate 4.
ベース１の中央にもうけ１）れた穴に、圧力導入用パイ
プ８が、ガラス１０ ＶＣよりノ・−メチツク封止され
る。また、別の穴には、入出力用リー ドビン７と真空
引き用パイプ９が、それズれガラス１０により・・−メ
チツク封止される。A pressure introduction pipe 8 is mechanically sealed in a hole made in the center of the base 1 with glass 10 VC. In addition, an input/output lead bin 7 and a vacuum pipe 9 are sealed in another hole with a glass 10.
圧力導入パイプ８の上には、カラスダイ１１およびノリ
コンダイアフラム５が接合される、ダイアフラム５には
凹部がエツ≠／グによシ形成され、との凹部と、ガラス
ダイ１１およびノ２イグ８の圧力導入穴１２が位置合せ
られる。ダイアフラム５の凹部の反対側には、ピエゾ抵
抗が形成される。A glass die 11 and a glue diaphragm 5 are joined onto the pressure introduction pipe 8. A recess is formed in the diaphragm 5 so that the glass die 11 and the glue 8 are connected to each other. The pressure introduction holes 12 are aligned. A piezoresistor is formed on the opposite side of the recessed portion of the diaphragm 5.
ダイアフラム５上のピエゾ抵抗と厚膜回路６の間、およ
び厚膜回路６とリードビン７０間は、ワイヤボンディン
グにより接続される。Connections are made between the piezoresistor on the diaphragm 5 and the thick film circuit 6, and between the thick film circuit 6 and the lead bin 70 by wire bonding.
回路の接合完了後、金属キャップ１４を、ホーロー基板
４のガラスコート除去部３に、抵抗溶接され、真空引き
用パイプ９により、真空引きし、抵抗溶接によりパイプ
を封［ヒすることにより、真空室１５を形成する。After the connection of the circuit is completed, the metal cap 14 is resistance welded to the glass coat removed portion 3 of the enamel substrate 4, the vacuum is drawn using the vacuum pipe 9, and the pipe is sealed by resistance welding. A chamber 15 is formed.
本発明によれば、ノリコンテツブおよびその補償回路、
増ｌ］回路を容易に真壁封止できる。According to the present invention, a Norikontetsubu and its compensation circuit,
] The circuit can be easily wall-sealed.
本発明の他の実施例Ｖこついて、第３図を用いて説明す
る。Another embodiment V of the present invention will be explained with reference to FIG.
本実施例は、前記実施例と真空封止前まで同一であるが
、真空引き用パイプ９を有せＪ“、金属キャップ１４を
真空中で溶接することにより、真空ｄ４Ｆ／−コＣ１＋
４纂−）−７−−に−に、、ＩＴ：→１：１ｔ１［’Ｒ
ｈ：ｌイ１ＡＩ＋ロー例けにより取付けである。This example is the same as the previous example up to the vacuum sealing stage, but it has a vacuum pipe 9 and a metal cap 14 is welded in a vacuum.
4-)-7--ni-ni,, IT:→1:1t1['R
h: It is installed by l-1 AI + low mounting.
本発明の実施例によれ畝真空捌止の簡略化、圧力導入ボ
ートの接合強度ｌ釘止を図れる。According to the embodiment of the present invention, it is possible to simplify the vacuum fixing of the ridges and to increase the joint strength of the pressure introduction boat.
本発明のその他の実施例を第４図を用いて説明する。Another embodiment of the present invention will be described with reference to FIG.
本実施例は、絶対圧基準圧力変換器１７とＥＧ几制御バ
ルブ１８を一体化したもので心り、ホーロー基板４の金
属ヘソグ１の一部をプレスにより加工し、ＥＧ刊制御バ
ルブ１Ｂの（１ｆ；造と一体化したものである。絶対圧
基準圧力変換器１７にエリ、排気マニホールドの圧力１
９を検出すＺ）ことによす、電気信号をコントロールユ
ニット１９に送り、コントロールユニット１９で、ソレ
ノイトノくルフ′２０を制御することにより、Ｅ ＯＲ
制省）１１ノ４ノ【・フ′１８に通じる負圧導入通路２
１を開閉する。In this embodiment, the absolute pressure reference pressure transducer 17 and the EG control valve 18 are integrated, and a part of the metal hem plate 1 of the hollow substrate 4 is processed by pressing, and the EG control valve 1B ( 1f: integrated with the structure.
E OR
Control) 11-4 [・ Negative pressure introduction passage 2 leading to F'18
Open and close 1.
本実施例によれば、絶対圧基準圧力変換器１７がアクチ
ュエータの構造の一部ヲ形成し句る。According to this embodiment, the absolute reference pressure transducer 17 forms part of the structure of the actuator.
本発明によれは、信頼性が高く、小型でしかも、検出精
度を高めることができる。According to the present invention, the device is highly reliable, compact, and can improve detection accuracy.
第１図および第２図は、本発明の一実施例の平面図およ
び断面図であ、す、８１’！３図は、本発明の他の実施
例の断面図であり、第４図は、本発明のその他の実施例
の１所面図である。
１・・・ベース、４・・・ポーロー基板、５・・・ノリ
コンダイアノンム、６・・・厚膜回路、１４・・ギャッ
プ。
代即人 弁理士 高橋明夫
第１図
第２図1 and 2 are a plan view and a sectional view of an embodiment of the present invention, 81'! FIG. 3 is a sectional view of another embodiment of the invention, and FIG. 4 is a top view of another embodiment of the invention. DESCRIPTION OF SYMBOLS 1... Base, 4... Porrow board, 5... Noricon diantom, 6... Thick film circuit, 14... Gap. Representative Patent Attorney Akio Takahashi Figure 1 Figure 2
Claims (1)
ースと、このベースに固定され一面にピエゾ抵抗の形成
さＺｌ、ている半導体ダイアノラムと、上記はうろう部
上に厚膜印刷により形成されノＣ圧力検出回路と、上記
半導体ダイアノラムのピエゾ抵抗面と圧力検出回路金お
おうように、−上記はうろう部以外のところで上記ベー
スに固着びれ、内部に真空室を形成する金属のカバーと
を有することを特徴とする圧力変換器５、1. A metal base with a processed enameled part at least in part, a semiconductor dianoram fixed to this base and having a piezoresistance formed on one side, and the above is formed by thick film printing on the hollow part. A pressure detection circuit, and a metal cover that is fixed to the base at a place other than the hollow part and forms a vacuum chamber inside, so as to cover the piezoresistive surface of the semiconductor dianoram and the pressure detection circuit. a pressure transducer 5 characterized in that it has;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58187044A JPS6079242A (en) | 1983-10-07 | 1983-10-07 | Pressure converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58187044A JPS6079242A (en) | 1983-10-07 | 1983-10-07 | Pressure converter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6079242A true JPS6079242A (en) | 1985-05-07 |
| JPH0544616B2 JPH0544616B2 (en) | 1993-07-06 |
Family
ID=16199189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58187044A Granted JPS6079242A (en) | 1983-10-07 | 1983-10-07 | Pressure converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6079242A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0441644U (en) * | 1990-08-08 | 1992-04-08 | ||
| JPH0447641U (en) * | 1990-08-24 | 1992-04-22 | ||
| WO1998005934A1 (en) * | 1996-08-06 | 1998-02-12 | Siemens Aktiengesellschaft | Electronic sensor component |
| US7102259B2 (en) | 2001-11-15 | 2006-09-05 | Mitsubishi Denki Kabushiki Kaisha | Rotor of a synchronous induction electric motor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124035A (en) * | 1979-03-09 | 1980-09-24 | Thomson Csf | Pressure detector |
| JPS5636109A (en) * | 1979-08-31 | 1981-04-09 | Matsushita Electric Works Ltd | Monostable type polar electromagnet |
| JPS57186137A (en) * | 1981-05-12 | 1982-11-16 | Fuji Electric Corp Res & Dev Ltd | Pressure sensor |
| JPS5823494A (en) * | 1981-08-05 | 1983-02-12 | 株式会社東芝 | Method of producing thick film integrated circuit |
-
1983
- 1983-10-07 JP JP58187044A patent/JPS6079242A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124035A (en) * | 1979-03-09 | 1980-09-24 | Thomson Csf | Pressure detector |
| JPS5636109A (en) * | 1979-08-31 | 1981-04-09 | Matsushita Electric Works Ltd | Monostable type polar electromagnet |
| JPS57186137A (en) * | 1981-05-12 | 1982-11-16 | Fuji Electric Corp Res & Dev Ltd | Pressure sensor |
| JPS5823494A (en) * | 1981-08-05 | 1983-02-12 | 株式会社東芝 | Method of producing thick film integrated circuit |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0441644U (en) * | 1990-08-08 | 1992-04-08 | ||
| JPH0447641U (en) * | 1990-08-24 | 1992-04-22 | ||
| WO1998005934A1 (en) * | 1996-08-06 | 1998-02-12 | Siemens Aktiengesellschaft | Electronic sensor component |
| GB2330418A (en) * | 1996-08-06 | 1999-04-21 | Siemens Ag | Electronic sensor component |
| GB2330418B (en) * | 1996-08-06 | 2000-06-07 | Siemens Ag | Electronic pressure sensor component |
| US7102259B2 (en) | 2001-11-15 | 2006-09-05 | Mitsubishi Denki Kabushiki Kaisha | Rotor of a synchronous induction electric motor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0544616B2 (en) | 1993-07-06 |
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