JPS62186523U - - Google Patents
Info
- Publication number
- JPS62186523U JPS62186523U JP7186786U JP7186786U JPS62186523U JP S62186523 U JPS62186523 U JP S62186523U JP 7186786 U JP7186786 U JP 7186786U JP 7186786 U JP7186786 U JP 7186786U JP S62186523 U JPS62186523 U JP S62186523U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- acoustic wave
- surface acoustic
- wave device
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010897 surface acoustic wave method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の一実施例を示す模式斜視図、
第２図は第１図の部分拡大簡略図、第３図は本考
案の弾性表面波装置用導電基体を用いた状態を説
明する状態図、第４図ａ乃至第４図ｃは本考案の
他の実施例を示す模式図である。
１，１１……弾性表面波装置用導電基体。
FIG. 1 is a schematic perspective view showing an embodiment of the present invention;
FIG. 2 is a simplified partially enlarged view of FIG. 1, FIG. 3 is a state diagram explaining the state in which the conductive substrate for a surface acoustic wave device of the present invention is used, and FIGS. 4a to 4c are diagrams of the present invention. It is a schematic diagram which shows another Example. 1, 11... Conductive substrate for surface acoustic wave device.
Claims (1)
とも備えたことを特徴とする弾性表面波装置用導
電基体。 (2) 前記導電物は、金属めつきからなることを
特徴とする実用新案登録請求の範囲第１項記載の
弾性表面波装置用導電基体。[Claims for Utility Model Registration] (1) A conductive substrate for a surface acoustic wave device, comprising at least a foamable substrate and a conductive material coated on the foamable substrate. (2) The conductive substrate for a surface acoustic wave device according to claim 1, wherein the conductive material is made of metal plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7186786U JPS62186523U (en) | 1986-05-15 | 1986-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7186786U JPS62186523U (en) | 1986-05-15 | 1986-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62186523U true JPS62186523U (en) | 1987-11-27 |
Family
ID=30914809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7186786U Pending JPS62186523U (en) | 1986-05-15 | 1986-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186523U (en) |
-
1986
- 1986-05-15 JP JP7186786U patent/JPS62186523U/ja active Pending
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