JPH0418452U - - Google Patents
Info
- Publication number
- JPH0418452U JPH0418452U JP5854090U JP5854090U JPH0418452U JP H0418452 U JPH0418452 U JP H0418452U JP 5854090 U JP5854090 U JP 5854090U JP 5854090 U JP5854090 U JP 5854090U JP H0418452 U JPH0418452 U JP H0418452U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- hole
- edge
- conductor
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 4
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
第１図Ａ部の平面図、第３図は第２図の−断
面斜視図、第４図は縁部を切離した状態の第３図
に相当する図、第５図は電極部形成装置の縦断面
図、第６Ａ図及び第６Ｂ図はそれぞれ他の実施例
に係る第２図に相当する図、第７図は更に他の実
施例のスルーホール部の横断面図、第８図は従来
例の斜視図、第９図は第８図−断面斜視図、
第１０図は縁部を切り離した状態の第９図に相当
する図である。
１……厚膜基板用原板、２……セラミツク基板
、２ａ……縁部、４……スルーホール、７……電
極部、８……露出部。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a plan view of section A in Fig. 1, Fig. 3 is a cross-sectional perspective view of Fig. 2, and Fig. 4 is a state with the edges cut away. FIG. 5 is a longitudinal sectional view of the electrode part forming apparatus, FIGS. 6A and 6B are views corresponding to FIG. 2 according to other embodiments, and FIG. 7 is a diagram corresponding to FIG. A cross-sectional view of the through-hole portion of another embodiment, FIG. 8 is a perspective view of the conventional example, and FIG. 9 is a cross-sectional perspective view of FIG.
FIG. 10 is a view corresponding to FIG. 9 with the edges cut away. DESCRIPTION OF SYMBOLS 1... Original plate for thick film substrate, 2... Ceramic substrate, 2a... Edge, 4... Through hole, 7... Electrode part, 8... Exposed part.
Claims (1)
に配置されかつ前記本体部との境界にスルーホー
ルを有する縁部と、前記本体部から前記スルーホ
ール内に延びる導体とを備えた厚膜基板において
、 前記スルーホールは、前記縁部側壁面の一部に
導体が被着されていないことを特徴とする厚膜基
板用原板。 (2) 本体部と、前記本体部の周縁に切離し可能
に配置されかつ前記本体部との境界にスルーホー
ルを有する縁部と、前記本体部から前記スルーホ
ール内に延びる導体とを備えた厚膜基板において
、 前記スルーホールの内壁面に被着される導体厚
みは、本体側が縁部側よりも厚くなることを特徴
とする厚膜基板。[Claims for Utility Model Registration] (1) A main body, an edge that is separably disposed around the periphery of the main body and has a through hole at the boundary with the main body, and an edge that extends from the main body into the through hole. A thick film substrate, comprising: a conductor extending in the through hole, wherein a part of the edge side wall surface of the through hole is not coated with a conductor. (2) A thickness comprising a main body, an edge that is separably disposed around the periphery of the main body and has a through hole at the boundary with the main body, and a conductor extending from the main body into the through hole. A thick film substrate, wherein the thickness of the conductor coated on the inner wall surface of the through hole is thicker on the main body side than on the edge side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5854090U JPH0418452U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5854090U JPH0418452U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418452U true JPH0418452U (en) | 1992-02-17 |
Family
ID=31584245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5854090U Pending JPH0418452U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418452U (en) |
-
1990
- 1990-05-31 JP JP5854090U patent/JPH0418452U/ja active Pending
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