JPS62120451A - Copper alloy for press fit pin - Google Patents
Copper alloy for press fit pinInfo
- Publication number
- JPS62120451A JPS62120451A JP25978285A JP25978285A JPS62120451A JP S62120451 A JPS62120451 A JP S62120451A JP 25978285 A JP25978285 A JP 25978285A JP 25978285 A JP25978285 A JP 25978285A JP S62120451 A JPS62120451 A JP S62120451A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- press
- copper alloy
- hardness
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の目的)
本発明はプリント基板等の金属孔に、はんだを用いずに
ピンの接合部のばね性で接触保持させる圧入型のプレス
フィツトピン用銅合金に関する。DETAILED DESCRIPTION OF THE INVENTION (Objects of the Invention) The present invention relates to a copper alloy for a press-fit pin that is held in contact with a metal hole of a printed circuit board or the like by the spring properties of the joint portion of the pin without using solder.
(従来の技術)
従来、プレスフィツトピンは、プリント基板等の金属孔
に、はんだを用いずにビンのばね性で金属孔内に接触保
持させるものであるが、この接合部には、種々の形状が
提案されている。この接合部は微細かつ複雑であり、し
かも強加工によって成形され・るため、接合部では硬度
が著しく高くなり接合部の形状や材料の選択を誤ると割
れが発生する。(Prior art) Conventionally, press-fit pins are used to contact and hold metal holes in printed circuit boards, etc., using the spring properties of the bottle without using solder. shapes are proposed. Since these joints are minute and complex, and are formed through heavy working, the hardness of the joints is extremely high, and cracks can occur if the shape or material of the joint is incorrect.
また、第1図にプレスフィツトピンの一例を示すが、第
1図における端子部1は、他の電子部品と弾性的に接触
を行うため、ばね性が要求される。Further, an example of a press-fit pin is shown in FIG. 1, and since the terminal portion 1 in FIG. 1 makes elastic contact with other electronic components, it is required to have spring properties.
端子部3は、ワイヤラッピング接続(無はんだ巻付接続
)が施されるので、この接続処理の厳しさに十分耐え得
る強度が要求される。Since the terminal portion 3 is subjected to wire wrapping connection (solderless wrapping connection), it is required to have sufficient strength to withstand the rigors of this connection process.
これらの各部分の要求される強度およびばね性を満たす
ために、従来プレスフィツトピン用銅合金として、りん
青銅などが着目された。しかしながら、これをプレスフ
ィツトピンにプレス成型すると、接合部2の硬さが急激
に上昇し、強加工が施される形状のものでは限界の硬さ
くりん青銅の場合では280〜290)に達する。In order to satisfy the required strength and springiness of each of these parts, phosphor bronze and the like have conventionally been considered as copper alloys for press fit pins. However, when this is press-molded into a press-fit pin, the hardness of the joint portion 2 increases rapidly, reaching a hardness of 280 to 290) in the case of plain bronze, which is the limit for a shape that is subject to heavy working.
このため、加工硬化の大きな材料では割れが発生し、ま
た、さらにこの様な強加工された接合部をプリント板の
金属孔に挿入する場合には大きな力を要するので、硬さ
の低い端子部が変形するという問題を生じた。For this reason, cracks occur with materials that are highly work-hardened, and since a large amount of force is required when inserting such a strongly worked joint into a metal hole in a printed board, terminals with low hardness are This resulted in the problem of deformation.
このために逆に、素材を非常に軟らかくすることも考え
られたが強度が不足するとともに、プレス時にダイスに
くいつき、金型の損耗が激しいという問題があった。For this reason, it was considered to make the material very soft, but this resulted in problems such as insufficient strength, sticking of the die during pressing, and severe wear and tear on the mold.
以上のことからプレスフィツトピン用の材料には、上記
のようなりん青銅では不十分で、ある程度強度、ばね性
があり、加工性が良好で、かつ加工硬化量の小さい材料
が要求されていた。For the above reasons, the phosphor bronze mentioned above was not sufficient as a material for press fit pins, and a material was required that had a certain degree of strength, springiness, good workability, and a small amount of work hardening. .
本発明はこの様な点に鑑み、研究を行った結果。The present invention is the result of research conducted in view of these points.
強度、ばね性があり、加工性が良好で、さらに加工硬化
の小さいプレスフィツトピン用銅合金を見出した。We have found a copper alloy for press-fit pins that has strength, spring properties, good workability, and low work hardening.
(発明の構成)
本発明はN i 0.4〜4.Ow t%、Sin、1
〜1.0wt%含み、残部Cuおよび不可避的不純物か
らなり、時効処理後の硬度がHv 160〜200であ
ることを特徴とするプレスフィツトピン用鋼合金。なら
びにNi0.4〜4.0wt%、Sin、1〜1.0w
t%含み、さらに副成分としてP、Sn、As、Cr、
Mg、Mn、Sb、Fe、Go、Al、Ti、Zr、、
Be、Zn。(Structure of the invention) The present invention has an N i of 0.4 to 4. Ow t%, Sin, 1
A steel alloy for press-fit pins, characterized in that it contains ~1.0 wt%, the balance is Cu and unavoidable impurities, and has a hardness of Hv 160 to 200 after aging treatment. and Ni0.4-4.0wt%, Sin, 1-1.0w
Contains t%, and further contains P, Sn, As, Cr, as subcomponents.
Mg, Mn, Sb, Fe, Go, Al, Ti, Zr,
Be, Zn.
B、ランタノイド元素各0.OO1〜1.0wt%の中
から1種または2種以上を総量で0.001〜2.Ow
t%含み、残部Cuおよび不可避的不純物からなり、
時効処理後の硬度がHv160〜200であることを特
徴とするプレスフィツトピン用銅合金である。B, lanthanoid elements each 0. The total amount of one or two or more types from 1 to 1.0 wt% of OO is 0.001 to 2.0 wt%. Ow
t%, the balance consists of Cu and unavoidable impurities,
This is a copper alloy for press fit pins, characterized by a hardness of 160 to 200 Hv after aging treatment.
Ni添加量を0.4〜4.0wt%とした理由は、0.
4wt%未満ではSiを0.1wt%以上添加しても強
度の向上は認められず、4.0wt%を超えると導電性
および加工性が低下するためである。Si添加量を0.
1〜1.0wt%とする理由は、Si量が0.1wt%
未満ではNiを0.4wt%以上添加しても高強度でか
つ高導電性のある材料が得られなく、1.0wt%を超
えると加工性が低下し、導電性が著しく劣化するためで
ある。さらに副成分としてP−3n、As、Cr、Mg
、Mn、Sn、Fe、Go。The reason why the amount of Ni added was set to 0.4 to 4.0 wt% is 0.4 to 4.0 wt%.
This is because if Si is less than 4 wt%, no improvement in strength will be observed even if 0.1 wt% or more of Si is added, and if it exceeds 4.0 wt%, conductivity and workability will decrease. The amount of Si added was set to 0.
The reason for setting it to 1 to 1.0 wt% is that the amount of Si is 0.1 wt%.
This is because if the Ni content is less than 0.4 wt%, a material with high strength and high conductivity cannot be obtained, and if it exceeds 1.0 wt%, the workability decreases and the conductivity deteriorates significantly. . Furthermore, as subcomponents P-3n, As, Cr, Mg
, Mn, Sn, Fe, Go.
Al、Ti、Zr、Be、Zn、B、ランタノイド元素
各0.001〜1.0wt%の中から1種または2種以
上を総量で0.001〜2.0wt%添加する理由は、
これらの元素を添加することにより、ばね性1強度を向
上させるためであるが、その添加量の総量が0.001
wt%未満ではばね性、強度の向上は認められず、2.
0wt%を超えるとばね性、強度は向上するが、導電性
が著しく低下するためである。The reason why one or more of Al, Ti, Zr, Be, Zn, B, and lanthanoid elements are added in a total amount of 0.001 to 2.0 wt% is as follows.
By adding these elements, the purpose is to improve the springiness 1 strength, but the total amount of addition is 0.001
If it is less than wt%, no improvement in spring properties or strength is observed.2.
This is because if it exceeds 0 wt%, the springiness and strength will improve, but the electrical conductivity will drop significantly.
時効処理後の硬度をHv 160〜200とする理由は
、本合金は時効処理を施すことにより、ばね性、強度が
著しく向上し、加工硬化度も減少するためである。しか
し、プレスフィツト用としての加工硬化量を考えると、
時効処理でHV 160〜200の範囲にコントロール
する必要がある。The reason why the hardness after aging treatment is set to Hv 160 to 200 is that by aging the present alloy, the springiness and strength are significantly improved, and the degree of work hardening is also reduced. However, considering the amount of work hardening for press fit,
It is necessary to control the HV within the range of 160 to 200 by aging treatment.
Hv 160未満ではプレス時のダイスのくいつきが激
しく、Hv200を超えると、逆に硬いための型摩耗が
発生し始め1割れの発生も起こり始めるためである。好
ましくはHv170〜190が推奨される。This is because if the Hv is less than 160, the die will stick severely during pressing, and if it exceeds Hv200, mold wear will begin to occur due to the hardness, and cracks will begin to occur. Preferably Hv170-190 is recommended.
(効 果)
このように、本発明合金を用いてプレスフィツトピンを
製造すると、強度、ばね性に優れ、かつプレス時の割れ
、型摩耗の発生がなく、また、加工硬化量も位小さいた
め、プリント基板の孔へ圧入時に端子部が変形するとい
った従来の欠点がなくなる。さらに本合金は時効処理を
行うことにより導電性も良好となるため、本発明合金は
、プレスフィツトピン用合金としては、あらゆる点に優
れた最良の銅合金といえる。(Effects) As described above, when a press-fit pin is manufactured using the alloy of the present invention, it has excellent strength and spring properties, and there is no cracking or die wear during pressing, and the amount of work hardening is also very small. This eliminates the conventional drawback that the terminal portion deforms when press-fitted into the hole of the printed circuit board. Furthermore, the conductivity of this alloy becomes good when subjected to aging treatment, so that the alloy of the present invention can be said to be the best copper alloy that is excellent in all respects as an alloy for press-fit pins.
つぎに、この発明の合金を実施例により説明する。Next, the alloy of the present invention will be explained using examples.
(実施例)
Ni1.6wt%、Si0.38wt%、Zn0.42
w1:%、残部Cuからなるインゴットを通常の大気溶
解で製造し、800℃での熱間圧延の後、冷間圧延と焼
鈍のくり返しにより0.3o11厚さの冷間圧延板とし
た。なお、この時点での硬さは Hv 142であった
。この冷間圧延板に450℃X2hrの時効処理を施し
、Hv185の材料を製造した。(Example) Ni1.6wt%, Si0.38wt%, Zn0.42
An ingot consisting of w1:%, balance Cu was produced by normal atmospheric melting, and after hot rolling at 800°C, cold rolling and annealing were repeated to obtain a cold rolled plate with a thickness of 0.3o11. The hardness at this point was Hv 142. This cold rolled plate was subjected to aging treatment at 450°C for 2 hours to produce a material with Hv185.
なお、比較のために0.3m厚さの冷間圧延板でHv
142のままのもの、さらにはHv 176のものを時
効処理によりHv210にしたものも製造した。さらに
比較合金としてC5210(ばね用りん青銅)、C51
01(りん青銅1種)。For comparison, the Hv of a cold rolled plate with a thickness of 0.3 m
142 as is, and also those with Hv 176 that were aged to Hv 210 were also manufactured. Furthermore, C5210 (phosphor bronze for springs) and C51 are comparative alloys.
01 (Phosphor bronze type 1).
C7710(ばね用洋白)を用いた。C7710 (nickel silver for springs) was used.
これらの試料を第1図、第2図に示すようなプレスフィ
ツトピンに加工した。なお、この図中、強加工を受ける
部分では80%以上の加工度となる。These samples were processed into press-fit pins as shown in FIGS. 1 and 2. In addition, in this figure, the degree of machining is 80% or more in the part that undergoes heavy machining.
プレス加工時1へピンに加工された部品について■ 加
工前後の第2図中B部の硬さ。About parts processed into pins during press processing ■ Hardness of part B in Figure 2 before and after processing.
■ ばね部(第1図中1)のばね限界値。■ Spring limit value of the spring part (1 in Figure 1).
■ 割れの有無(目視i察)
■ 1組の金型でブ1ノスできる回数(ス1−ローク数
)
の4点について評価を行い、第1表に示した。■ Presence or absence of cracks (visual inspection); ■ Number of times one mold can be pressed (number of strokes); the results are shown in Table 1.
この第1表からもわかるように本発明合金はプレス加工
時の割れ、型摩耗もなく、かつ優れた強度、ばね性を示
す。また、各種合金の加工硬化曲線を第3〜6図に示す
が、これらの図及び第1表のプレス前後の硬さの差から
もわかるように、本発明合金はプレス加工された部品の
場所による差が非常に少なく、均一な製品が製造可能と
なる。As can be seen from Table 1, the alloy of the present invention has no cracking or mold wear during press working, and exhibits excellent strength and spring properties. Further, the work hardening curves of various alloys are shown in Figures 3 to 6, and as can be seen from the differences in hardness before and after pressing in these figures and Table 1, the alloy of the present invention is There are very few differences due to the difference in color, making it possible to manufacture uniform products.
以下余白 第1表Margin below Table 1
第1図はプレスフィツトピンの例を示す斜視図、第2図
は第1図のA’−’A断面図、第3図は本発明合金の加
工硬化曲線を示す図、第4図は比較合金である。C52
10の加工硬化曲線を示す図、第5図は比較合金である
C:5101の加工硬化曲線を示す図、第6図は比較合
金であるC7701の加工硬化曲線を示す図6Figure 1 is a perspective view showing an example of a press-fit pin, Figure 2 is a sectional view taken along A'-'A in Figure 1, Figure 3 is a diagram showing the work hardening curve of the alloy of the present invention, and Figure 4 is a comparison. It is an alloy. C52
Figure 5 is a diagram showing the work hardening curve of C:5101, which is a comparative alloy, and Figure 6 is a diagram showing the work hardening curve of C7701, which is a comparative alloy.
Claims (2)
wt%含み、残部Cuおよび不可避的不純物からなり、
時効処理後の硬度がHv160〜200であることを特
徴とするプレスフィットピン用銅合金。(1) Ni0.4-4.0wt%, Si0.1-1.0
wt%, the balance consists of Cu and unavoidable impurities,
A copper alloy for press-fit pins, which has a hardness of 160 to 200 Hv after aging treatment.
wt%含み、さらに副成分としてP、Sn、As、Cr
、Mg、Mn、Sb、Fe、Co、Al、Ti、Zr、
Be、Zn、B、ランタノイド元素各0.001〜1.
0wt%の中から1種または2種以上を総量で0.00
1〜2.0wt%含み、残部Cuおよび不可避的不純物
からなり、時効処理後の硬度がHv160〜200であ
ることを特徴とするプレスフィットピン用銅合金。(2) Ni0.4-4.0wt%, Si0.1-1.0
Contains wt%, and further contains P, Sn, As, Cr as subcomponents.
, Mg, Mn, Sb, Fe, Co, Al, Ti, Zr,
Be, Zn, B, lanthanoid elements each 0.001 to 1.
One or more types from 0 wt% in total amount of 0.00
A copper alloy for press-fit pins, characterized in that it contains 1 to 2.0 wt%, the balance is Cu and unavoidable impurities, and has a hardness of Hv 160 to 200 after aging treatment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25978285A JPS62120451A (en) | 1985-11-21 | 1985-11-21 | Copper alloy for press fit pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25978285A JPS62120451A (en) | 1985-11-21 | 1985-11-21 | Copper alloy for press fit pin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62120451A true JPS62120451A (en) | 1987-06-01 |
Family
ID=17338900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25978285A Pending JPS62120451A (en) | 1985-11-21 | 1985-11-21 | Copper alloy for press fit pin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62120451A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62199742A (en) * | 1986-02-27 | 1987-09-03 | Ngk Insulators Ltd | High strength copper alloy and its manufacture |
JPS6428337A (en) * | 1987-07-24 | 1989-01-30 | Furukawa Electric Co Ltd | High-strength and high-conductivity copper alloy |
JPH01119635A (en) * | 1987-10-30 | 1989-05-11 | Ngk Insulators Ltd | Spring material having electric conductivity |
JPH01263243A (en) * | 1988-04-12 | 1989-10-19 | Mitsubishi Electric Corp | Copper alloy for electronic equipment |
JPH02209442A (en) * | 1989-02-10 | 1990-08-20 | Mitsubishi Shindoh Co Ltd | High strength cu alloy |
CN105908015A (en) * | 2016-05-05 | 2016-08-31 | 太仓小小精密模具有限公司 | Anti-oxidization copper alloy mold material |
CN116732384A (en) * | 2023-08-08 | 2023-09-12 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
-
1985
- 1985-11-21 JP JP25978285A patent/JPS62120451A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62199742A (en) * | 1986-02-27 | 1987-09-03 | Ngk Insulators Ltd | High strength copper alloy and its manufacture |
JPH036214B2 (en) * | 1986-02-27 | 1991-01-29 | Ngk Insulators Ltd | |
JPS6428337A (en) * | 1987-07-24 | 1989-01-30 | Furukawa Electric Co Ltd | High-strength and high-conductivity copper alloy |
JPH01119635A (en) * | 1987-10-30 | 1989-05-11 | Ngk Insulators Ltd | Spring material having electric conductivity |
JPH01263243A (en) * | 1988-04-12 | 1989-10-19 | Mitsubishi Electric Corp | Copper alloy for electronic equipment |
JPH02209442A (en) * | 1989-02-10 | 1990-08-20 | Mitsubishi Shindoh Co Ltd | High strength cu alloy |
CN105908015A (en) * | 2016-05-05 | 2016-08-31 | 太仓小小精密模具有限公司 | Anti-oxidization copper alloy mold material |
CN116732384A (en) * | 2023-08-08 | 2023-09-12 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
CN116732384B (en) * | 2023-08-08 | 2023-11-21 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
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