JPS62103261U - - Google Patents
Info
- Publication number
- JPS62103261U JPS62103261U JP19430585U JP19430585U JPS62103261U JP S62103261 U JPS62103261 U JP S62103261U JP 19430585 U JP19430585 U JP 19430585U JP 19430585 U JP19430585 U JP 19430585U JP S62103261 U JPS62103261 U JP S62103261U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hybrid
- lead
- semi
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のリード説明図、第
２図は本考案の一実施例の基板搭載図、第３図は
本考案の一実施例リードの引張荷重特性図、第４
図はハイブリツドＩＣの基板塔載図、第５図は基
板に曲げモーメントがかかる前の基板塔載時説明
図、第６図は基板に曲げモーメントがかかつた後
の基板塔載時説明図である。
３……基板（印刷配線板）、３′……変形基板
、４……リード、２１……セラミツクパツケージ
、４１・４２……パツケージ挾持部、４３……半
円弧状曲がり部、４４……端子。
Fig. 1 is an explanatory diagram of a lead according to an embodiment of the present invention, Fig. 2 is a board mounting diagram of an embodiment of the present invention, Fig. 3 is a tensile load characteristic diagram of a lead according to an embodiment of the present invention, Fig. 4
The figure shows a diagram of the hybrid IC board being mounted on the board, Figure 5 is an explanatory diagram of the board being mounted on the board before bending moment is applied to the board, and Figure 6 is an explanatory diagram of the board being mounted on the board after bending moment is applied to the board. be. 3...Substrate (printed wiring board), 3'...Deformed board, 4...Lead, 21...Ceramic package, 41/42...Package holding part, 43...Semicircular arc-shaped bent part, 44...Terminal .
Claims (1)
力用端子とらるリードを有するＤＩＰ形ハイブリ
ツドＩＣに於いて、リードの中間部に半円弧状曲
がり部を有することを特徴とするハイブリツドＩ
Ｃ。 In a DIP type hybrid IC having leads which are held on both sides of a rigid package and which take input/output terminals, a hybrid I is characterized in that the lead has a semi-circular curved part in the middle part.
C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19430585U JPS62103261U (en) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19430585U JPS62103261U (en) | 1985-12-19 | 1985-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62103261U true JPS62103261U (en) | 1987-07-01 |
Family
ID=31151155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19430585U Pending JPS62103261U (en) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62103261U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198745A (en) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
-
1985
- 1985-12-19 JP JP19430585U patent/JPS62103261U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198745A (en) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62103261U (en) | ||
| JPS5952744U (en) | small radio | |
| JPS60163751U (en) | semiconductor equipment | |
| JPS605085U (en) | connector | |
| JPS6315033U (en) | ||
| JPS5937746U (en) | Electronic component lead terminals | |
| JPS63112352U (en) | ||
| JPS6063965U (en) | printed wiring board | |
| JPS63191673U (en) | ||
| JPS6045446U (en) | semiconductor equipment | |
| JPS6096864U (en) | Flexible circuit board for small equipment | |
| JPS60141153U (en) | hybrid circuit | |
| JPS5916174U (en) | Installation structure of electrical parts | |
| JPS61121424U (en) | ||
| JPS5830283U (en) | Flexible board terminal connection device | |
| JPS59166949U (en) | thermal head | |
| JPS60158765U (en) | Hybrid IC | |
| JPH0338664U (en) | ||
| JPS60129145U (en) | IC with wire | |
| JPS6096862U (en) | Flexible circuit board for small equipment | |
| JPS6134727U (en) | Terminal device for electrical parts | |
| JPS63149570U (en) | ||
| JPS593490U (en) | Relay terminal | |
| JPH048468U (en) | ||
| JPS62169416U (en) |