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JPS62102556A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS62102556A
JPS62102556A JP60244549A JP24454985A JPS62102556A JP S62102556 A JPS62102556 A JP S62102556A JP 60244549 A JP60244549 A JP 60244549A JP 24454985 A JP24454985 A JP 24454985A JP S62102556 A JPS62102556 A JP S62102556A
Authority
JP
Japan
Prior art keywords
power supply
integrated circuit
semiconductor integrated
pad
effect transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60244549A
Other languages
Japanese (ja)
Inventor
Tadayuki Akatsuki
赤月 忠之
Takashi Harada
尚 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60244549A priority Critical patent/JPS62102556A/en
Publication of JPS62102556A publication Critical patent/JPS62102556A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • H10D84/854Complementary IGFETs, e.g. CMOS comprising arrangements for preventing bipolar actions between the different IGFET regions, e.g. arrangements for latchup prevention

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は相補形(界効来トランジスタ(以下CMOS
FE’rと略記する)を含む集積回路に関し、特にその
ような集積回路において発生するラッチアップ(1at
ch up )  現象に関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to a complementary type (field effect transistor (hereinafter referred to as CMOS)
Regarding integrated circuits including integrated circuits (abbreviated as FE'r), latch-up (1at
chup) phenomenon.

〔従来の技術〕[Conventional technology]

爾2図はCMt)S FWT  ’を含む従来の半導体
集積回路の内部配線を示す配線図でめりて、図において
(1)は集積回路外部からの4源供給を受ける定めの電
源パッド(pad)でめ5、(21は集積回路内部で使
用される金属配線による電源配線であり、(3)は半害
体果槙回路内部で使用される接地配線であり、(4)は
接地配線(3)と外部回路を低気的に接続するための接
地パッドであり、(5)は半導体集積回路と外部回路と
の間で1g号r入出力するための信号パッドでのる。
Figure 2 is a wiring diagram showing the internal wiring of a conventional semiconductor integrated circuit including a CMt)S FWT'. ) deme 5, (21 is the power supply wiring using metal wiring used inside the integrated circuit, (3) is the ground wiring used inside the semi-harmful circuit, and (4) is the ground wiring ( 3) is a ground pad for connecting external circuits in a low-temperature manner, and (5) is a signal pad for inputting/outputting 1gr between the semiconductor integrated circuit and the external circuit.

第2図に示すような半導体集積回路で(は、信号パッド
(5)又は電源パッド(1)からパルス性雑音又はナー
ジ性雑音が入ってきた場合、CMOSFETがこの雑音
によりて動作し、動作した結果、その動作後の状態を保
持するよう制御する信号が生成されてその状態が保持さ
れるという、いわゆるラッチアップ現象が発生しがちで
ある。−反発生したラッチアップ現象は外部からの4諒
供給が断たれない限り保持され、終にはCMOSFgr
を物理的に破壊する場合がある。
In a semiconductor integrated circuit as shown in Fig. 2, when pulse noise or nervous noise enters from the signal pad (5) or power supply pad (1), the CMOSFET operates due to this noise. As a result, a so-called latch-up phenomenon tends to occur, in which a control signal is generated to maintain the state after the operation, and that state is held. It will be held until the supply is cut off, and eventually CMOSFgr
may be physically destroyed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の0MOSFET ′t″言む半導体集積回路にお
いては、上述のようなラッチアップ現象が発生し易いと
いう点に問題点がめった。また、ラッチアップ現象が一
次ん発生すると半導体集積回路の破壊に至る場合がある
点にも問題があった。
Conventional semiconductor integrated circuits such as MOSFET's have a problem in that the latch-up phenomenon described above is likely to occur.Furthermore, once the latch-up phenomenon occurs, it can lead to destruction of the semiconductor integrated circuit. There was also a problem in that there were cases.

この発明は上記のような問題点を解決するためになされ
たもので、ラッチアップ現象が発生しにくいようにし、
かつ、−たん発生したラッチアップ現象を容易に解消す
ることがでさる半得体果横回帖を供給することを目的と
している。
This invention was made to solve the above-mentioned problems, and it makes it difficult for the latch-up phenomenon to occur.
Moreover, it is an object of the present invention to provide a semi-obtainable transverse cover which can easily eliminate the latch-up phenomenon that occurs.

〔問題点を解決する之めの手段〕[Means for solving problems]

この発明に係る半導体集積回路では、・区諒パッドと(
源配線との間に・に界効果トランジスタ(以下FE’r
と略記する)を仲人し、ラッチアップが発生し友ときこ
のF’l!?rt−オフ状態に制御して(源配線への電
源供給をしゃ断し、ラッチアップ現象を解消するように
した。
In the semiconductor integrated circuit according to the present invention, the boundary pad and (
A field effect transistor (hereinafter FE'r) is connected between the source wiring and the
), a latch-up occurred, and Tokiko's F'l! ? The latch-up phenomenon was eliminated by controlling the rt-off state (cutting off the power supply to the source wiring).

〔作用〕[Effect]

tIf源パッドと電源配線との間に接続されるFETは
i源パッドからtlLl起源への1流に対する抵抗’に
+#Fち、かつ電源配線と鏝地との間には静4容量が存
在するので、上記抵抗とla電容量とにより時定数金形
成し、外部から4源配線に入ってくるパルス性雑音をフ
ィルタ作用により減衰してラッチアップ現象の発生の機
会を減少する。また、ラッチアップ現象が発生したとき
は(源パッドと4源配線の間のFE’rがカットオフさ
れ、1源配線の4圧がなくなって、ラッチアップ現象は
自動的に解消式れる。
The FET connected between the tIf source pad and the power wiring has a resistance of +#F for the first current from the i source pad to the tlLl source, and there is a static capacitance between the power wiring and the trowel. Therefore, a time constant is formed by the resistor and the la capacitance, and the pulse noise entering the four-source wiring from the outside is attenuated by a filtering effect, thereby reducing the chance of occurrence of latch-up phenomenon. Furthermore, when a latch-up phenomenon occurs (FE'r between the source pad and the 4-source wiring is cut off, the 4-voltage of the 1-source wiring disappears, and the latch-up phenomenon is automatically resolved).

〔従来の技術〕[Conventional technology]

以下この発明の実施例を図面について説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図はこの発明の一実施例を示す配線図で、第2図と
同一符号は同−又は相当部分を示し、(6)はpチャネ
ル・vK)S F’ET s 17)は抵抗、(8)ハ
ルチャネルIVIO8Fgr、 +91はn % ’r
ネルMOSFE’l’ % Ial d F’h’+’
r +81゜(9)のゲートを並列に接続した接続点で
ある。
FIG. 1 is a wiring diagram showing an embodiment of the present invention, where the same symbols as in FIG. (8) Hull channel IVIO8Fgr, +91 is n%'r
Channel MOSFE'l' % Ial d F'h'+'
This is a connection point where r +81° (9) gates are connected in parallel.

通常の状態ではnチャネルMOSFET +91はオフ
状態pチャネル1VIO8F’に!、T +slはオフ
状、懐にあり、したがってpチャネルMOSFgrt6
1はオン状態にあって、外部からの(源、4圧は4源パ
ツドf1)、pチャネル1V10S FKT t61合
経てE区源配線に)に与えらルる。この場合、pチャネ
ル1VIO8FET +61の抵抗とtm配線+21の
静Fl!谷量により、4源パツド(11を経て人力され
る雑音に灯しフィルタ回路を千4成して、この雑音を減
衰し、ラッチアップ現象が発生すると第1図fat点の
或位が低下し、pチャネルMOSFET I8)がオン
状態、nチャネルMOSFk:’f’ +91がオフ状
態になり、したがってpチャネル+VDS FE’r 
161がオフ状態となって1源配−(2)の(圧がなく
なり、ラッチアップ現象が解消される。ラッチアップ現
象が解消されるとIal点の4圧は高くなり、pチャネ
ル・VIO8FgT(6)がオン状態となって通常の状
態に自動復帰する。
Under normal conditions, n-channel MOSFET +91 is in the off state p-channel 1VIO8F'! , T +sl is in the off-state, and therefore the p-channel MOSFgrt6
1 is in the on state and is applied from the outside (source, 4 voltage is 4 source pad f1, p channel 1V10S FKT t61 connected to E section source wiring). In this case, p-channel 1VIO8FET +61 resistance and tm wiring +21 static Fl! Depending on the amount of trough, a filter circuit is formed to absorb the noise manually inputted through the four-source pad (11) to attenuate this noise, and when a latch-up phenomenon occurs, the level of the fat point in Figure 1 decreases. , p-channel MOSFET I8) is in the on-state, n-channel MOSFk: 'f' +91 is in the off-state, thus p-channel +VDS FE'r
161 is turned off, the (2) pressure is eliminated, and the latch-up phenomenon is eliminated. When the latch-up phenomenon is eliminated, the 4 pressure at the Ial point becomes high, and the p-channel VIO8FgT ( 6) is turned on and automatically returns to the normal state.

なお、第1図のnチャネル、VIO8FET +91の
かわりに抵抗?1昶吠してもlo1様な効果を得ること
ができる。
By the way, is there a resistor in place of the n-channel VIO8FET +91 in Figure 1? You can get a lo1-like effect even if you bark for 1 time.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、ラッチアップ現象の発
生を抑止し、また、ラッチアップ現象を解消できるよう
にしたので、システムの雑音に対する信頼性が向上し、
かつ、ラッチアップ現象による半導体集積回路の物理的
破壊を防止することができる。
As described above, according to the present invention, the occurrence of the latch-up phenomenon can be suppressed and the latch-up phenomenon can be eliminated, thereby improving the reliability of the system against noise.
Moreover, physical destruction of the semiconductor integrated circuit due to latch-up phenomenon can be prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例と示す配線図、第2図は0
MOSFET金含む従来の半導体集積回路の内部配線を
示す配線を示す配線図。 (1)はシ源パッド、(2)は4源配線、(3)は接地
配線、14)は瑚地バッド、(5)は信号パッド、(6
)はpチャネ/Lt IVIO8FET’ 、 (71
は抵抗、(8)はpチャネルMDSFET1(9)はn
チャネルIvios FtT 。 尚、各図中同一符号は同−又は相当部分を示す。
Fig. 1 is a wiring diagram showing one embodiment of this invention, Fig. 2 is a wiring diagram showing an embodiment of the present invention.
FIG. 2 is a wiring diagram showing internal wiring of a conventional semiconductor integrated circuit including MOSFET gold. (1) is source pad, (2) is 4 source wiring, (3) is ground wiring, 14) is ground pad, (5) is signal pad, (6
) is p channel/Lt IVIO8FET', (71
is the resistance, (8) is the p-channel MDSFET1 (9) is the n
Channel Ivios FtT. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (3)

【特許請求の範囲】[Claims] (1)CMOSトランジスタを含む半導体集積回路にお
いて、外部からの、電源線が接続される電源パッド、外
部からの接地線が接続される接地パッド、半導体集積回
路内部の接地端子を互に並列に接続して上記接地パッド
へ接続する接地配線、半導体集積回路内部の電源端子を
互に並列に接続する電源配線、この電源配線と上記電源
パッドとの間に接続される電界効果トランジスタ、上記
半導体集積回路内に発生するラッチアップ現象を検出し
、このラッチアップ現象が発生したときに上記電界効果
トランジスタをカットオフする制御手段を備えたことを
特徴とする半導体集積回路。
(1) In a semiconductor integrated circuit including a CMOS transistor, a power pad to which an external power line is connected, a ground pad to which an external ground line is connected, and a ground terminal inside the semiconductor integrated circuit are connected in parallel. a ground wire connected to the ground pad, a power wire that connects power supply terminals inside the semiconductor integrated circuit in parallel, a field effect transistor connected between the power wire and the power pad, and the semiconductor integrated circuit. 1. A semiconductor integrated circuit, comprising: a control means for detecting a latch-up phenomenon that occurs in the semiconductor integrated circuit, and for cutting off the field-effect transistor when the latch-up phenomenon occurs.
(2)電源パッドと電源配線との間に接続される電界効
果トランジスタをカットオフ制御する制御手段は、上記
電源パッドと上記電界効果トランジスタのゲートとの間
に接続されるpチャネルMOSトランジスタ、上記、電
界効果トランジスタのゲートと接地点間に接続されるn
チャネルMOSトランジスタ、上記pチャネル及びnチ
ャネルMOSトランジスタのゲートを並列にして上記、
電源配線に接続する手段、上記pチャネルMOSトラン
ジスタのゲートと上記電源パッドとの間に接続される抵
抗を備えたことを特徴とする特許請求の範囲第1項記載
の半導体集積回路。
(2) The control means for controlling the cutoff of the field effect transistor connected between the power supply pad and the power supply wiring includes a p-channel MOS transistor connected between the power supply pad and the gate of the field effect transistor; , n connected between the gate of the field effect transistor and ground
a channel MOS transistor, the gates of the p-channel and n-channel MOS transistors are connected in parallel;
2. The semiconductor integrated circuit according to claim 1, further comprising means for connecting to a power supply wiring, and a resistor connected between the gate of said p-channel MOS transistor and said power supply pad.
(3)電源パッドと電源配線との間に接続される電界効
果トランジスタをカットオフ制御する制御手段は、上記
電源パッドと上記電界効果トランジスタのゲートとの間
に接続されるpチャネルMOSトランジスタ、上記電界
効果トランジスタのゲートと接地点間に接続される抵抗
、上記pチャネルMOSトランジスタのゲートと上記電
源配線とを接続する手段、上記電源パッドと上記pチャ
ネルMOSトランジスタのゲートとの間に接続される抵
抗を備えたことを特徴とする特許請求範囲第1項記載の
半導体集積回路。
(3) The control means for controlling the cutoff of the field effect transistor connected between the power supply pad and the power supply wiring includes a p-channel MOS transistor connected between the power supply pad and the gate of the field effect transistor; A resistor connected between the gate of the field effect transistor and a ground point, a means for connecting the gate of the p-channel MOS transistor and the power supply wiring, and a resistor connected between the power supply pad and the gate of the p-channel MOS transistor. The semiconductor integrated circuit according to claim 1, further comprising a resistor.
JP60244549A 1985-10-29 1985-10-29 Semiconductor integrated circuit Pending JPS62102556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60244549A JPS62102556A (en) 1985-10-29 1985-10-29 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60244549A JPS62102556A (en) 1985-10-29 1985-10-29 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS62102556A true JPS62102556A (en) 1987-05-13

Family

ID=17120352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60244549A Pending JPS62102556A (en) 1985-10-29 1985-10-29 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS62102556A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413733U (en) * 1987-07-16 1989-01-24
JPH03245565A (en) * 1990-02-23 1991-11-01 Nippon Motoroola Kk Manufacture of intelligent power semiconductor device
JPH0685179A (en) * 1991-10-23 1994-03-25 Internatl Business Mach Corp <Ibm> Latch-up protective circuit, adjustment/protection combined circuit and on-chip latch-up protective circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413733U (en) * 1987-07-16 1989-01-24
JPH03245565A (en) * 1990-02-23 1991-11-01 Nippon Motoroola Kk Manufacture of intelligent power semiconductor device
JPH0685179A (en) * 1991-10-23 1994-03-25 Internatl Business Mach Corp <Ibm> Latch-up protective circuit, adjustment/protection combined circuit and on-chip latch-up protective circuit

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