JPS619849U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS619849U JPS619849U JP9372984U JP9372984U JPS619849U JP S619849 U JPS619849 U JP S619849U JP 9372984 U JP9372984 U JP 9372984U JP 9372984 U JP9372984 U JP 9372984U JP S619849 U JPS619849 U JP S619849U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bent portion
- lead frame
- semiconductor chip
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図はこの考案に係る回路基板の製造工程を示す図、
第２図はその製造過程の１つの状態を示す外観斜視図で
ある。
１・・・リードフレーム、１ｃ・・・折曲部、２−・・
チップ、５・・・封止樹脂。[Brief explanation of the drawings] Fig. 1 is a diagram showing the manufacturing process of the circuit board according to this invention;
FIG. 2 is an external perspective view showing one state of the manufacturing process. 1...Lead frame, 1c...Bending part, 2-...
Chip, 5... Sealing resin.
Claims (1)
フレームの折曲部内に取り付けられる半導体チップと、
この半導体チップを前記折曲部内に封止する封止樹脂と
を具備してなる回路基板。A lead frame having a concave bent portion; a semiconductor chip mounted within the bent portion of the lead frame;
A circuit board comprising a sealing resin for sealing the semiconductor chip within the bent portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9372984U JPS619849U (en) | 1984-06-25 | 1984-06-25 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9372984U JPS619849U (en) | 1984-06-25 | 1984-06-25 | circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS619849U true JPS619849U (en) | 1986-01-21 |
Family
ID=30651662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9372984U Pending JPS619849U (en) | 1984-06-25 | 1984-06-25 | circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619849U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63290796A (en) * | 1987-05-22 | 1988-11-28 | 大日本印刷株式会社 | Lead frame for ic card |
| JPH0289348A (en) * | 1988-09-27 | 1990-03-29 | Matsushita Electron Corp | Semiconductor device |
-
1984
- 1984-06-25 JP JP9372984U patent/JPS619849U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63290796A (en) * | 1987-05-22 | 1988-11-28 | 大日本印刷株式会社 | Lead frame for ic card |
| JPH0289348A (en) * | 1988-09-27 | 1990-03-29 | Matsushita Electron Corp | Semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS619849U (en) | circuit board | |
| JPS6025159U (en) | lead frame | |
| JPS59111052U (en) | Hybrid integrated circuit device | |
| JPS6063965U (en) | printed wiring board | |
| JPS5878682U (en) | electronic components | |
| JPS5929068U (en) | Positioning structure for chip-type parts | |
| JPS5877084U (en) | circuit board | |
| JPS6146736U (en) | Semiconductor chip mounting structure | |
| JPS6059553U (en) | circuit board structure | |
| JPS602869U (en) | Semiconductor integrated circuit device | |
| JPS58153459U (en) | semiconductor equipment | |
| JPS58135948U (en) | Sealing lid structure for hybrid integrated circuits | |
| JPS6124971U (en) | lead frame | |
| JPS59180438U (en) | Semiconductor integrated circuit device | |
| JPS5872844U (en) | LSI package | |
| JPS6061740U (en) | Hybrid integrated circuit device | |
| JPS60149172U (en) | flexible circuit board | |
| JPS6078141U (en) | Electronic component mounting structure | |
| JPS60113645U (en) | Mini flat package | |
| JPS5853156U (en) | hybrid integrated circuit | |
| JPS58142944U (en) | semiconductor parts | |
| JPS59185851U (en) | Semiconductor integrated circuit device | |
| JPS59154788U (en) | integrated circuit socket | |
| JPS60119146U (en) | Tuner device | |
| JPS5883173U (en) | printed wiring board |